BAT54VV,115 - NXP - Products.Network

1. Product profile

1.1 General description

Planar Schottky barrier triple diode with an integrated guard ring for stress protection.

Three electrically isolated Schottky barrier diodes, encapsulate d in a SOT666 ultra small

SMD plastic package.

1.2 Features

Low forward voltage

Ultra small SMD plastic package

Low capacitance

Flat leads: excellent coplanarity and improved thermal behavior

1.3 Applications

Ultra high-speed switching

Voltage clamping

Line termination

Inverse-po lar ity pr ot ec tio n

1.4 Quick reference data

2. Pinning information

BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

Rev. 02 — 15 January 2010 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VRcontinuous reverse voltage - - 30 V

IFcontinuous forward current - - 200 mA

Table 2. Pinning

Pin Description Simplified outline Symbol

1 anode (diode 1)

2 anode (diode 2)

3 anode (diode 3)

4 cathode (diode 3)

5 cathode (diode 2)

6 cathode (diode 1) SOT66

123

456 6

sym04

Product data sheet Rev. 02 — 15 January 2010 2 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

3. Ordering information

4. Marking

5. Limiting values

[1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.

[2] Single diode loaded.

6. Thermal characteristics

[1] Refer to SOT666 standard mounting conditions.

[2] Reflow soldering is the only recommended soldering method.

Table 3. Ordering information

Type number Package

Name Description Version

BAT54VV - plastic surface mounted package; 6 leads SOT666

Table 4. Marking codes

Type number Marking code

BAT54VV C6

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRcontinuous reverse voltage - 30 V

IFcontinuous forward current - 200 mA

IFRM repetitive peak forward

current tp ≤ 1 s; δ ≤ 0.5 - 300 mA

IFSM non-repetitive peak forward

current tp < 10 ms - 600 mA

Ptot total power dissipation Tamb ≤ 25 °C[1][2] -170mW

Tjjunction temperature - 125 °C

Tamb ambient temperature −65 +125 °C

Tstg storage temperature −65 +150 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1][2] --590K/W

Product data sheet Rev. 02 — 15 January 2010 3 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

Table 7. Characteristics

Tamb = 25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VFforward voltage see Figure 1;[1]

IF = 0.1 mA - - 240 mV

IF = 1 mA --320mV

IF = 10 mA - - 400 mV

IF = 30 mA - - 500 mV

IF = 100 mA - - 800 mV

IRreverse current VR = 25 V; see Figure 2 --2μA

Cddiode capacitance VR = 1 V ; f = 1 MHz;

see Figure 3 --10pF

Product data sheet Rev. 02 — 15 January 2010 4 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Reverse current as a function of reverse

voltage; typical values

Tamb =25°C; f = 1 MHz

Fig 3. Diod e capacitance as a function of reverse voltage; typical values

103

102

10−1

(mA)

VF (V)

1.20.80.40

msa892

(3)(2)(1)

0102030

VR (V)

103

102

10−1

(μA)

(1)

(2)

(3)

msa893

0102030

(V)

(pF)

msa891

Product data sheet Rev. 02 — 15 January 2010 5 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

8. Package outline

Fig 4. Package outline SOT666.

UNIT bpcDE e1HELpw

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

04-11-08

06-03-16

IEC JEDEC JEITA

mm 0.27

0.17

0.18

0.08

1.7

1.5

1.3

1.1 0.5

1.0 1.7

1.5 0.1

0.1

DIMENSIONS (mm are the original dimensions)

0.3

0.1

SOT666

pin 1 index

detail X

0 1 2 mm

scale

0.6

0.5

123

456

Plastic surface-mounted package; 6 leads SOT66

wMA

Product data sheet Rev. 02 — 15 January 2010 6 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

9. Packing information

[1] For further information and the availability of packing methods, see Section 12.

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

4000

BAT54VV SOT666 4 mm pitch, 8 mm tape and reel -115

Product data sheet Rev. 02 — 15 January 2010 7 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

10. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAT54VV_2 20100115 Product data sheet - BAT54VV_1

Modifications: •This data sheet was changed to reflec t the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technica l

content.

•Table 2 “Pinning”: updated

•Figure 4 “Package outline SOT666.”: updated

BAT54VV_1 20040914 Product data sheet - -

Product data sheet Rev. 02 — 15 January 2010 8 of 9

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre va il.

11.3 Disclaimers

General — In formation in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give an y represent ations or

warranties, expressed or impli ed, as to the accuracy or completeness of such

information and shall have no liability for th e co nsequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, milit ary, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applic ations that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ra tings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other co nditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may af fect device reliability .

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertain i ng to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between inf ormation in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property right s.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

11.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respective ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors BAT54VV

Schottky barrier triple diode in ultra small SOT666 package

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 January 2010

Document identifier: BAT54VV_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Packing information . . . . . . . . . . . . . . . . . . . . . 6

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9