www.latticesemi.com
1
ispm4k_20z
ispMACH
4000V/B/C/Z Family
3.3V/2.5V/1.8V In-System Programmable
SuperFAST
High Density PLDs
January 2004 Data Sheet
TM
TM
© 2004 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specications and inf ormation herein are subject to change without notice.
Coolest Power
C
TM
Features
High Performance
•f
MAX
= 400MHz maximum operating frequency
•t
PD
= 2.5ns propagation delay
Up to four global clock pins with programmable
clock polarity control
Up to 80 PTs per output
Ease of Design
Enhanced macrocells with individual clock,
reset, preset and clock enable controls
Up to four global OE controls
Individual local OE control per I/O pin
Excellent First-Time-Fit
TM
and ret
•Fast path, SpeedLocking
TM
Path, and wide-PT
path
Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
Zero Power (ispMACH 4000Z) and Low
Power (ispMACH 4000V/B/C)
•Typical static current 10µA (4032Z)
•Typical static current 1.3mA (4000C)
1.8V core low dynamic power
ispMACH 4000Z operational down to 1.6V V
CC
Broad Device Offering
Multiple temperature range support
– Commercial: 0 to 90°C junction (T
j
)
– Industrial: -40 to 105°C junction (T
j
)
– Automotive: -40 to 130°C junction (T
j
)
Easy System Integration
Superior solution for power sensitive consumer
applications
Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O
Operation with 3.3V (4000V), 2.5V (4000B) or
1.8V (4000C/Z) supplies
5V tolerant I/O f or LVCMOS 3.3, LVTTL, and PCI
interfaces
Hot-socketing
Open-drain capability
Input pull-up, pull-down or bus-keeper
Programmable output slew rate
3.3V PCI compatible
IEEE 1149.1 boundary scan testable
3.3V/2.5V/1.8V In-System Programmable
(ISP™) using IEEE 1532 compliant interface
I/O pins with fast setup path
Lead-free package options
Table 1. ispMACH 4000V/B/C Family Selection Guide
ispMACH
4032V/B/C ispMACH
4064V/B/C ispMACH
4128V/B/C ispMACH
4256V/B/C ispMACH
4384V/B/C ispMACH
4512V/B/C
Macrocells 32 64 128 256 384 512
I/O + Dedicated
Inputs 30+2/32+4 30+2/32+4/
64+10 64+10/92+4/
96+4 64+10/96+14/
128+4/160+4 128+4/192+4 128+4/208+4
t
PD
(ns) 2.5 2.5 2.7 3.0 3.5 3.5
t
S
(ns) 1.8 1.8 1.8 2.0 2.0 2.0
t
CO
(ns) 2.2 2.2 2.7 2.7 2.7 2.7
f
MAX
(MHz) 400 400 333 322 322 322
Supply Voltages (V) 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V
Pins/P ackage 44 TQFP
48 TQFP 44 TQFP
48 TQFP
100 TQFP 100 TQFP
128 TQFP
144 TQFP
1
100 TQFP
144 TQFP
1
176 TQFP
256 fpBGA
2
176 TQFP
256 fpBGA 176 TQFP
256 fpBGA
1. 3.3V (4000V) only.
2. 128-I/O and 160-I/O congurations.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
2
Table 2. ispMACH 4000Z Family Selection Guide
ispMACH 4000 Introduction
The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution. The family is a blend
of Lattice’s two most popular architectures: the ispLSI
®
2000 and ispMACH 4A. Retaining the best of both families,
the ispMACH 4000 architecture focuses on signicant innovations to combine the highest performance with low
power in a exible CPLD family.
The ispMACH 4000 combines high speed and low power with the exibility needed for ease of design. With its
robust Global Routing Pool and Output Routing Pool, this family deliv ers excellent First-Time-Fit, timing predictabil-
ity, routing, pin-out retention and density migration.
The ispMACH 4000 family offers densities ranging from 32 to 512 macrocells. There are multiple density-I/O com-
binations in Thin Quad Flat Pac k (TQFP), Chip Scale BGA (csBGA) and Fine Pitch BGA (fpBGA) pac kages ranging
from 44 to 256 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key parameters.
The ispMACH 4000 family has enhanced system integration capabilities. It supports 3.3V (4000V), 2.5V (4000B)
and 1.8V (4000C/Z) supply voltages and 3.3V, 2.5V and 1.8V interface voltages. Additionally, inputs can be safely
driven up to 5.5V when an I/O bank is congured for 3.3V operation, making this family 5V tolerant. The ispMACH
4000 also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up
resistors, pull-down resistors, open drain outputs and hot socketing. The ispMACH 4000 family members are 3.3V/
2.5V/1.8V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1 boundary
scan testing capability also allows product testing on automated test equipment.
Overview
The ispMA CH 4000 de vices consist of m ultiple 36-input, 16-macrocell Generic Logic Blocks (GLBs) interconnected
by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks (IOBs), which
contain multiple I/O cells. This architecture is shown in Figure 1.
ispMACH 4032ZC ispMACH 4064ZC ispMACH 4128ZC ispMACH 4256ZC
Macrocells 32 64 128 256
I/O + Dedicated Inputs 32+4/32+4 32+4/32+12/
64+10/64+10 64+10/96+4 64+10/96+6/
128+4
t
PD
(ns) 3.5 3.7 4.2 4.5
t
S
(ns) 2.2 2.5 2.7 2.9
t
CO
(ns) 3.0 3.2 3.5 3.8
f
MAX
(MHz) 267 250 220 200
Supply Voltage (V) 1.8 1.8 1.8 1.8
Max. Standby Icc (µA) 20 25 35 55
Pins/P ackage 48 TQFP
56 csBGA 48 TQFP
56 csBGA
100 TQFP
132 csBGA 100 TQFP
132csBGA 100 TQFP
132 csBGA
176 TQFP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
3
Figure 1. Functional Block Diagram
The I/Os in the ispMACH 4000 are split into two banks. Each bank has a separate I/O power supply. Inputs can
suppor t a variety of standards independent of the chip or bank power supply. Outputs suppor t the standards com-
patible with the power supply provided to the bank. Suppor t for a variety of standards helps designers implement
designs in mixed voltage environments. In addition, 5V tolerant inputs are specied within an I/O bank that is con-
nected to V
CCO
of 3.0V to 3.6V for LVCMOS 3.3, LVTTL and PCI interfaces.
ispMACH 4000 Architecture
There are a total of two GLBs in the ispMACH 4032, increasing to 32 GLBs in the ispMACH 4512. Each GLB has
36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into the GRP to be
connected to the inputs of any other GLB on the device. Even if feedback signals return to the same GLB, they still
must go through the GRP. This mechanism ensures that GLBs communicate with each other with consistent and
predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them to the associ-
ated I/O cells in the I/O block.
Generic Logic Block
The ispMACH 4000 GLB consists of a programmable AND array, logic allocator, 16 macrocells and a GLB clock
generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O pins are decou-
pled from macrocells through the ORP. Figure 2 illustrates the GLB.
I/O
Block ORP ORP
16
16
GOE0
GOE1
VCC
GND
TCK
TMS
TDI
TDO
36
Generic
Logic
Block
Generic
Logic
Block
I/O
Block ORP ORP
16
36
Generic
Logic
Block
Generic
Logic
Block
I/O
Block
I/O Bank 0
I/O Bank 1
I/O
Block
36
36
CLK0/I
CLK1/I
CLK2/I
CLK3/I
16
16
Global Routing Pool
VCCO0
GND
VCCO1
GND
16 16
16
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
4
Figure 2. Generic Logic Block
AND Array
The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are
used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be con-
nected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product ter ms feed the logic
allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and
Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inver ted before being
fed to the macrocells.
Every set of ve product terms from the 80 logic product terms forms a product term cluster starting with PT0.
There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND
Array.
Logic Allocator
36 Inputs
from GRP
16 Macrocells
To ORP
To GRP
To
Product Term
Output Enable
Sharing
1+OE
16 MC Feedback Signals
Clock
Generator
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
CLK0
CLK1
CLK2
CLK3
1+OE
AND Array
36 Inputs,
83 Product Terms
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
5
Figure 3. AND Array
Enhanced Logic Allocator
Within the logic allocator, product terms are allocated to macrocells in product term clusters. Each product term
cluster is associated with a macrocell. The cluster size for the ispMACH 4000 family is 4+1 (total 5) product terms.
The software automatically considers the availability and distribution of product term clusters as it ts the functions
within a GLB. The logic allocator is designed to provide three speed paths: 5-PT fast bypass path, 20-PT Speed
Locking path and an up to 80-PT path. The availability of these three paths lets designers tr ade timing variability for
increased performance.
The enhanced Logic Allocator of the ispMACH 4000 family consists of the following blocks:
Product Term Allocator
Cluster Allocator
Wide Steering Logic
Figure 4 shows a macrocell slice of the Logic Allocator. There are 16 such slices in the GLB.
Figure 4. Macrocell Slice
PT0
PT1 Cluster 0
PT2
PT3
PT4
In[0]
In[34]
In[35]
Note:
Indicates programmable fuse.
PT80
PT81
PT82
Shared PT Clock
Shared PT Initialization
Shared PTOE
PT76
PT77
PT78
PT79
PT75
Cluster 15
to
n+1
to
n-1 to
n-2 from
n-1 from
n-4
from
n+2 from
n+1
5-PT
From
n-4 1-80
PTs
To n+4
Fast 5-PT
Path
To XOR (MC)
Cluster
Individual Product
Term Allocator Cluster
Allocator SuperWIDE™
Steering Logic
n
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
6
Product T erm Allocator
The product term allocator assigns product ter ms from a cluster to either logic or control applications as required
by the design being implemented. Product terms that are used as logic are steered into a 5-input OR gate associ-
ated with the cluster. Product terms that used for control are steered either to the macrocell or I/O cell associated
with the cluster. Table 3 shows the available functions for each of the ve product terms in the cluster. The OR gate
output connects to the associated I/O cell, providing a fast path for narrow combinatorial functions, and to the logic
allocator.
Table 3. Individual PT Steering
Cluster Allocator
The cluster allocator allows clusters to be steered to neighboring macrocells, thus allo wing the creation of functions
with more product terms. Table 4 shows which clusters can be steered to which macrocells. Used in this manner,
the cluster allocator can be used to form functions of up to 20 product terms. Additionally, the cluster allocator
accepts inputs from the wide steering logic. Using these inputs, functions up to 80 product terms can be created.
Table 4. Available Clusters for Each Macrocell
Wide Steering Logic
The wide steering logic allows the output of the cluster allocator n to be connected to the input of the cluster alloca-
tor
n
+4. Thus, cluster chains can be formed with up to 80 product ter ms, suppor ting wide product term functions
and allowing perfor mance to be increased through a single GLB implementation. Table 5 shows the product term
chains.
Product T erm Logic Control
PT
n
Logic PT Single PT for XOR/OR
PT
n
+1 Logic PT Individual Clock (PT Clock)
PT
n
+2 Logic PT Individual Initialization or Individual Clock Enable (PT Initialization/CE)
PT
n
+3 Logic PT Individual Initialization (PT Initialization)
PT
n
+4 Logic PT Individual OE (PTOE)
Macrocell Available Clusters
M0 C0 C1C2
M1 C0 C1 C2 C3
M2 C1 C2 C3 C4
M3 C2 C3 C4 C5
M4 C3 C4 C5 C6
M5 C4 C5 C6 C7
M6 C5 C6 C7 C8
M7 C6 C7 C8 C9
M8 C7 C8 C9 C10
M9 C8 C9 C10 C11
M10 C9 C10 C11 C12
M11 C10 C11 C12 C13
M12 C11 C12 C13 C14
M13 C12 C13 C14 C15
M14 C13 C14 C15
M15 C14 C15
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
7
Table 5. Product Term Expansion Capability
Ev ery time the super cluster allocator is used, there is an incremental delay of t
EXP
. When the super cluster alloca-
tor is used, all destinations other than the one being steered to , are giv en the value of ground (i.e ., if the super clus-
ter is steered to M (n+4), then M (n) is ground).
Macrocell
The 16 macrocells in the GLB are driven by the 16 outputs from the logic allocator. Each macrocell contains a pro-
grammable XOR gate, a programmable register/latch, along with routing for the logic and control functions.
Figure 5 shows a graphical representation of the macrocell. The macrocells feed the ORP and GRP. A direct input
from the I/O cell allows designers to use the macrocell to construct high-speed input registers. A programmable
delay in this path allows designers to choose between the fastest possible set-up time and zero hold time.
Figure 5. Macrocell
Enhanced Clock Multiplexer
The clock input to the ip-op can select any of the four block clocks along with the shared PT clock, and true and
complement forms of the optional individual term clock. An 8:1 m ultiplexer structure is used to select the clock. The
eight sources for the clock multiplexer are as follows:
Block CLK0
Block CLK1
Expansion
Chains Macrocells Associated with Expansion Chain
(with Wrap Around) Max PT/
Macrocell
Chain-0 M0
M4
M8
M12
M0 75
Chain-1 M1
M5
M9
M13
M1 80
Chain-2 M2
M6
M10
M14
M2 75
Chain-3 M3
M7
M11
M15
M3 70
Single PT Block CLK0
Block CLK1
Block CLK2
Block CLK3
PT Clock (optional)
Shared PT Clock
CE
D/T/L Q
RP
Shared PT Initialization
PT Initialization/CE (optional)
PT Initialization (optional)
From Logic Allocator
Power-up
Initialization
To ORP
To GRP
From I/O Cell
Delay
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
8
Block CLK2
Block CLK3
PT Clock
PT Clock Inverted
Shared PT Clock
Ground
Clock Enable Multiplexer
Each macrocell has a 4:1 clock enable multiplexer. This allows the clock enable signal to be selected from the fol-
lowing four sources:
PT Initialization/CE
PT Initialization/CE Inverted
Shared PT Clock
Logic High
Initialization Control
The ispMA CH 4000 f amily architecture accommodates both b lock-le v el and macrocell-le v el set and reset capability.
There is one block-level initialization term that is distributed to all macrocell registers in a GLB. At the macrocell
level, two product terms can be “stolen” from the cluster associated with a macrocell to be used for set/reset func-
tionality. A reset/preset swapping feature in each macrocell allows for reset and preset to be exchanged, providing
exibility.
Note that the reset/preset swapping selection feature affects power-up reset as well. All ip-ops power up to a
known state for predictable system initialization. If a macrocell is congured to SET on a signal from the block-lev el
initialization, then that macrocell will be SET during device power-up. If a macrocell is congured to RESET on a
signal from the block-level initialization or is not congured for set/reset, then that macrocell will RESET on power-
up . To guarantee initialization values , the V
CC
rise must be monotonic , and the cloc k m ust be inactiv e until the reset
delay time has elapsed.
GLB Clock Generator
Each ispMACH 4000 device has up to four clock pins that are also routed to the GRP to be used as inputs. These
pins drive a cloc k generator in each GLB , as sho wn in Figure 6. The clock generator provides four clock signals that
can be used anywhere in the GLB. These four GLB clock signals can consist of a number of combinations of the
true and complement edges of the global clock signals.
Figure 6. GLB Clock Generator
CLK0
CLK1
CLK2
CLK3
Block CLK0
Block CLK1
Block CLK2
Block CLK3
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
9
Output Routing Pool (ORP)
The Output Routing Pool allows macrocell outputs to be connected to any of several I/O cells within an I/O block.
This provides greater exibility in determining the pinout and allows design changes to occur without affecting the
pinout. The output routing pool also provides a parallel capability for routing macrocell-lev el OE product terms. This
allows the OE product term to follow the macrocell output as it is switched between I/O cells. Additionally, the out-
put routing pool allows the macrocell output or true and complement f orms of the 5-PT bypass signal to bypass the
output routing multiplexers and feed the I/O cell directly. The enhanced ORP of the ispMACH 4000 family consists
of the following elements:
Output Routing Multiplexers
OE Routing Multiplexers
Output Routing Pool Bypass Multiplexers
Figure 7 shows the structure of the ORP from the I/O cell perspective. This is referred to as an ORP slice. Each
ORP has as many ORP slices as there are I/O cells in the corresponding I/O block.
Figure 7. ORP Slice
Output Routing Multiplexers
The details of connections between the macrocells and the I/O cells vary across devices and within a device
dependent on the maximum number of I/Os available. Tables 5-9 provide the connection details.
Table 6. ORP Combinations for I/O Blocks with 8 I/Os
I/O Cell Available Macrocells
I/O 0 M0, M1, M2, M3, M4, M5, M6, M7
I/O 1 M2, M3, M4, M5, M6, M7, M8, M9
I/O 2 M4, M5, M6, M7, M8, M9, M10, M11
I/O 3 M6, M7, M8, M9, M10, M11, M12, M13
I/O 4 M8, M9, M10, M11, M12, M13, M14, M15
I/O 5 M10, M11, M12, M13, M14, M15, M0, M1
I/O 6 M12, M13, M14, M15, M0, M1, M2, M3
I/O 7 M14, M15, M0, M1, M2, M3, M4, M5
Out
p
ut Routin
g
Multi
p
lexer
OE Routing Multiplexer
ORP
Bypass
Multiplexer
From Macrocell
From PTOE To I/O
Cell
To I/O
Cell
Output
OE
5-PT Fast Path
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
10
Table 7. ORP Combinations for I/O Blocks with 16 I/Os
Table 8. ORP Combinations for I/O Blocks with 4 I/Os
Table 9. ORP Combinations for I/O Blocks with 10 I/Os
I/O Cell Available Macrocells
I/O 0 M0, M1, M2, M3, M4, M5, M6, M7
I/O 1 M1, M2, M3, M4, M5, M6, M7, M8
I/O 2 M2, M3, M4, M5, M6, M7, M8, M9
I/O 3 M3, M4, M5, M6, M7, M8, M9, M10
I/O 4 M4, M5, M6, M7, M8, M9, M10, M11
I/O 5 M5, M6, M7, M8, M9, M10, M11, M12
I/O 6 M6, M7, M8, M9, M10, M11, M12, M13
I/O 7 M7, M8, M9, M10, M11, M12, M13, M14
I/O 8 M8, M9, M10, M11, M12, M13, M14, M15
I/O 9 M9, M10, M11, M12, M13, M14, M15, M0
I/O 10 M10, M11, M12, M13, M14, M15, M0, M1
I/O 11 M11, M12, M13, M14, M15, M0, M1, M2
I/O 12 M12, M13, M14, M15, M0, M1, M2, M3
I/O 13 M13, M14, M15, M0, M1, M2, M3, M4
I/O 14 M14, M15, M0, M1, M2, M3, M4, M5
I/O 15 M15, M0, M1, M2, M3, M4, M5, M6
I/O Cell Available Macrocells
I/O 0 M0, M1, M2, M3, M4, M5, M6, M7
I/O 1 M4, M5, M6, M7, M8, M9, M10, M11
I/O 2 M8, M9, M10, M11, M12, M13, M14, M15
I/O 3 M12, M13, M14, M15, M0, M1, M2, M3
I/O Cell Available Macrocells
I/O 0 M0, M1, M2, M3, M4, M5, M6, M7
I/O 1 M2, M3, M4, M5, M6, M7, M8, M9
I/O 2 M4, M5, M6, M7, M8, M9, M10, M11
I/O 3 M6, M7, M8, M9, M10, M11, M12, M13
I/O 4 M8, M9, M10, M11, M12, M13, M14, M15
I/O 5 M10, M11, M12, M13, M14, M15, M0, M1
I/O 6 M12, M13, M14, M15, M0, M1, M2, M3
I/O 7 M14, M15, M0, M1, M2, M3, M4, M5
I/O 8 M2, M3, M4, M5, M6, M7, M8, M9
I/O 9 M10, M11, M12, M13, M14, M15, M0, M1
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
11
Table 10. ORP Combinations for I/O Blocks with 12 I/Os
ORP Bypass and Fast Output Multiplexers
The ORP bypass and fast-path output multiplexer is a 4:1 multiplexer and allows the 5-PT fast path to bypass the
ORP and be connected directly to the pin with either the regular output or the inverted output. This multiplexer also
allows the register output to bypass the ORP to achieve faster t
CO
.
Output Enable Routing Multiplexers
The OE Routing Pool provides the corresponding local output enable (OE) product term to the I/O cell.
I/O Cell
The I/O cell contains the following programmable elements: output buffer, input buffer, OE multiplexer and bus
maintenance circuitry. Figure 8 details the I/O cell.
Figure 8. I/O Cell
Each output suppor ts a variety of output standards dependent on the V
CCO
supplied to its I/O bank. Outputs can
also be congured f or open drain oper ation. Each input can be prog rammed to support a variety of standards, inde-
pendent of the V
CCO
supplied to its I/O bank. The I/O standards supported are:
I/O Cell Available Macrocells
I/O 0 M0, M1, M2, M3, M4, M5, M6, M7
I/O 1 M1, M2, M3, M4, M5, M6, M7, M8
I/O 2 M2, M3, M4, M5, M6, M7, M8, M9
I/O 3 M4, M5, M6, M7, M8, M9, M10, M11
I/O 4 M5, M6, M7, M8, M9, M10, M11, M12
I/O 5 M6, M7, M8, M9, M10, M11, M12, M13
I/O 6 M8, M9, M10, M11, M12, M13, M14, M15
I/O 7 M9, M10, M11, M12, M13, M14, M15, M0
I/O 8 M10, M11, M12, M13, M14, M15, M0, M1
I/O 9 M12, M13, M14, M15, M0, M1, M2, M3
I/O 10 M13, M14, M15, M0, M1, M2, M3, M4
I/O 11 M14, M15, M0, M1, M2, M3, M4, M5
GOE 0
From ORP
*Global fuses
From ORP
To Macrocell
To GRP
GOE 1
GOE 2
GOE 3
VCC
VCCO
VCCO
**
*
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
12
•LVTTL LVCMOS 1.8
•LVCMOS 3.3 3.3V PCI Compatible
•LVCMOS 2.5
All of the I/Os and dedicated inputs have the capability to provide a b us-keeper latch, Pull-up Resistor or Pull-down
Resistor. A fourth option is to provide none of these. The selection is done on a global basis. The default in both
hardware and software is such that when the device is erased or if the user does not specify, the input str ucture is
congured to be a Pull-up Resistor.
Each ispMACH 4000 device I/O has an individually programmable output slew rate control bit. Each output can be
individually congured for fast slew or slow slew. The typical edge rate difference between fast and slow slew set-
ting is 20%. For high-speed designs with long, unter minated traces, the slow-slew rate will introduce fewer reec-
tions, less noise and keep ground bounce to a minimum. For designs with short traces or well terminated lines, the
fast slew rate can be used to achieve the highest speed.
Global OE Generation
Most ispMACH 4000 family devices have a 4-bit wide Global OE Bus, except the ispMACH 4032 device that has a
2-bit wide Global OE Bus. This bus is derived from a 4-bit internal global OE PT bus and two dual purpose I/O or
GOE pins. Each signal that drives the bus can optionally be inverted.
Each GLB has a block-level OE PT that connects to all bits of the Global OE PT bus with four fuses. Hence, for a
256-macrocell device (with 16 blocks), each line of the bus is driven from 16 OE product terms. Figures 9 and 10
show a graphical representation of the global OE generation.
Figure 9. Global OE Generation for All Devices Except ispMACH 4032
Shared PTOE
(Block 0)
Shared PTOE
(Block n)
Global
Fuses GOE (0:3)
to I/O cells
Internal Global OE
PT Bus
(4 lines) 4-Bit
Global OE Bus
Global OE
Fuse connection
Hard wired
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
13
Figure 10. Global OE Generation for ispMACH 4032
Zero Power/Low Power and Power Management
The ispMACH 4000 family is designed with high speed low power design techniques to offer both high speed and
low power. With an advanced E
2
low power cell and non sense-amplier design approach (full CMOS logic
approach), the ispMACH 4000 family offers SuperFAST pin-to-pin speeds, while simultaneously delivering low
standby power without needing any “turbo bits” or other power management schemes associated with a traditional
sense-amplier approach.
The zero power ispMACH 4000Z is based on the 1.8V ispMACH 4000C family. With innovative circuit design
changes, the ispMACH 4000Z family is able to achieve the industry’s “lowest static power”.
IEEE 1149.1-Compliant Boundary Scan Testability
All ispMACH 4000 devices have boundary scan cells and are compliant to the IEEE 1149.1 standard. This allows
functional testing of the circuit board on which the device is mounted through a serial scan path that can access all
critical logic notes. Internal registers are linked internally, allowing test data to be shifted in and loaded directly onto
test nodes, or test node data to be captured and shifted out for verication. In addition, these devices can be linked
into a board-level serial scan path for more board-level testing. The test access port operates with an LVCMOS
interface that corresponds to the power supply voltage.
I/O Quick Conguration
To facilitate the most efcient board test, the physical nature of the I/O cells m ust be set bef ore running any continu-
ity tests. As these tests are fast, by nature, the overhead and time that is required for conguration of the I/Os’
ph ysical nature should be minimal so that board test time is minimiz ed. The ispMACH 4000 f amily of de vices allo ws
this by offering the user the ability to quickly congure the physical nature of the I/O cells. This quick conguration
takes milliseconds to complete, whereas it takes seconds for the entire device to be programmed. Lattice's
ispVM™ System programming software can either perform the quick conguration through the PC parallel port, or
can generate the ATE or test vectors necessary for a third-party test system.
Shared PTOE
(Block 0)
Shared PTOE
(Block 1)
Global
Fuses GOE (3:0)
to I/O cells
Internal Global OE
PT Bus
(2 lines) 4-Bit
Global OE Bus
Global OE
Fuse connection
Hard wired
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
14
IEEE 1532-Compliant In-System Programming
Programming devices in-system provides a number of signicant benets including: rapid prototyping, lower inven-
tor y levels, higher quality and the ability to make in-eld modications. All ispMACH 4000 devices provide In-Sys-
tem Programming (ISP™) capability through the Boundary Scan Test Access Port. This capability has been
implemented in a manner that ensures that the port remains complaint to the IEEE 1149.1 standard. By using IEEE
1149.1 as the communication interface through which ISP is achieved, users get the benet of a standard, well-
dened interface. All ispMACH 4000 devices are also compliant with the IEEE 1532 standard.
The ispMACH 4000 devices can be programmed across the commercial temperature and voltage range. The PC-
based Lattice software facilitates in-system programming of ispMACH 4000 devices. The software takes the
JEDEC le output produced by the design implementation software, along with information about the scan chain,
and creates a set of v ectors used to driv e the scan chain. The software can use these vectors to driv e a scan chain
via the parallel port of a PC. Alternatively, the software can output les in formats understood by common auto-
mated test equipment. This equipment can then be used to program ispMACH 4000 devices during the testing of a
circuit board.
Security Bit
A programmable security bit is provided on the ispMACH 4000 devices as a deterrent to unauthorized copying of
the array conguration patterns. Once programmed, this bit defeats readback of the programmed pattern by a
device programmer, securing proprietary designs from competitors. Programming and verication are also
defeated by the security bit. The bit can only be reset by erasing the entire device.
Hot Socketing
The ispMACH 4000 devices are well-suited for applications that require hot socketing capability. Hot socketing a
device requires that the device, during power-up and down, can tolerate active signals on the I/Os and inputs with-
out being damaged. Additionally, it requires that the effects of I/O pin loading be minimal on active signals. The
ispMACH 4000 devices provide this capability for input voltages in the range 0V to 3.0V.
Density Migration
The ispMACH 4000 family has been designed to ensure that different density devices in the same package have
the same pin-out. Furthermore, the architecture ensures a high success rate when performing design migration
from lower density parts to higher density par ts. In many cases, it is possible to shift a lower utilization design tar-
geted for a high density device to a lower density device. However, the exact details of the nal resource utilization
will impact the likely success in each case.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
15
Absolute Maximum Ratings
1, 2, 3
ispMACH 4000C/Z ispMACH 4000B ispMACH 4000V
(1.8V) (2.5V) (3.3V)
Supply Voltage (V
CC
). . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . .-0.5 to 5.5V. . . . . . . . . . . -0.5 to 5.5V
Output Supply Voltage (V
CCO
). . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . .-0.5 to 4.5V. . . . . . . . . . . -0.5 to 4.5V
Input or I/O Tristate Voltage Applied
4, 5
. . . . . . . . . -0.5 to 5.5V . . . . . . . . . .-0.5 to 5.5V. . . . . . . . . . . -0.5 to 5.5V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . .-65 to 150
°
C. . . . . . . . . -65 to 150
°
C . . . . . . . . . .-65 to 150
°
C
Junction Temperature (T
j) with Power Applied . . .-55 to 150°C. . . . . . . . . -55 to 150°C . . . . . . . . . .-55 to 150°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause per manent damage to the device. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specication
is not implied.
2. Compliance with Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. Undershoot of -2V and overshoot of (VIH (MAX) + 2V), up to a total pin voltage of 6.0V, is permitted for a duration of < 20ns.
5. Maximum of 64 I/Os per device with VIN > 3.6V is allowed.
Recommended Operating Conditions
Erase Reprogram Specications
Hot Socketing Characteristics1,2,3
Symbol Parameter Min. Max. Units
VCC
Supply Voltage for 1.8V Devices
ispMACH 4000C 1.65 1.95 V
ispMACH 4000Z 1.7 1.9 V
ispMA CH 4000Z, Extended Functional Voltage
Operation 1.61, 2 1.9 V
Supply Voltage for 2.5V Devices 2.3 2.7 V
Supply Voltage for 3.3V Devices 3.0 3.6 V
Tj
Junction Temperature (Commercial) 0 90 C
Junction Temperature (Industrial) -40 105 C
Junction Temperature (Automotiv e) -40 130 C
1. Devices operating at 1.6V can expect performance degradation up to 35%.
2. Applicable for devices with 2004 datecodes and later. Contact factory for ordering instructions.
Parameter Min. Max. Units
Erase/Reprogram Cycle 1,000 Cycles
Note: Valid over commercial temperature range.
Symbol Parameter Condition Min. Typ. Max. Units
IDK Input or I/O Leakage Current 0 VIN 3.0V, Tj = 105°C ±30 ±150 µA
0 VIN 3.0V, Tj = 130°C ±30 ±200 µA
1. Insensitive to sequence of VCC or VCCO. However, assumes monotonic rise/fall rates for VCC and VCCO, provided (VIN - VCCO) 3.6V.
2. 0 < VCC < VCC (MAX), 0 < VCCO < VCCO (MAX).
3. IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until fuse circuitry is active.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
16
I/O Recommended Operating Conditions
DC Electrical Characteristics
Over Recommended Operating Conditions
Standard VCCO (V)1
Min. Max.
LVTTL 3.0 3.6
LVCMOS 3.3 3.0 3.6
Extended LVCMOS 3.322.7 3.6
LVCMOS 2.5 2.3 2.7
LVCMOS 1.8 1.65 1.95
PCI 3.3 3.0 3.6
1. Typical values for VCCO are the average of the min. and max. values.
2. ispMACH 4000Z only.
Symbol Parameter Condition Min. Typ. Max. Units
IIL, IIH1Input Leakage Current (ispMACH
4000Z) 0 VIN VCCO 0.5 1 µA
IIH1Input High Leakage Current
(ispMACH 4000Z) VCCO < VIN 5.5V ——10µA
IIL, IIH1Input Leakage Current (ispMACH
4000V/B/C) 0 VIN 3.6V, Tj = 105°C 10 µA
0 VIN 3.6V, Tj = 130°C 15 µA
IIH1,2 Input High Leakage Current
(ispMACH 4000V/B/C)
3.6V < VIN 5.5V, Tj = 105°C
3.0V VCCO 3.6V ——20µA
3.6V < VIN 5.5V, Tj = 130°C
3.0V VCCO 3.6V ——50µA
IPU I/O Weak Pull-up Resistor Current 0 VIN 0.7VCCO -30 -150 µA
IPD I/O Weak Pull-down Resistor Current VIL (MAX) VIN VIH (MIN) 30 150 µA
IBHLS Bus Hold Low Sustaining Current VIN = VIL (MAX) 30 µA
IBHHS Bus Hold High Sustaining Current VIN = 0.7 VCCO -30 µA
IBHLO Bus Hold Low Overdrive Current 0V VIN VBHT ——150 µA
IBHHO Bus Hold High Overdrive Current VBHT VIN VCCO ——-150 µA
VBHT Bus Hold Trip Points VCCO * 0.35 VCCO * 0.65 V
C1I/O Capacitance3VCCO = 3.3V, 2.5V, 1.8V 8pf
VCC = 1.8V, VIO = 0 to VIH (MAX)
C2Clock Capacitance3VCCO = 3.3V, 2.5V, 1.8V 6pf
VCC = 1.8V, VIO = 0 to VIH (MAX)
C3Global Input Capacitance3VCCO = 3.3V, 2.5V, 1.8V 6pf
VCC = 1.8V, VIO = 0 to VIH (MAX)
1. Input or I/O leakage current is measured with the pin congured as an input or as an I/O with the output driver tristated. It is not
measured with the output driver active. Bus maintenance circuits are disabled.
2. 5V tolerant inputs and I/O should only be placed in banks where 3.0V VCCO 3.6V.
3. TA = 25°C, f = 1.0MHz
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
17
Supply Current, ispMACH 4000V/B/C
Over Recommended Operating Conditions
Symbol Parameter Condition Min. Typ. Max. Units
ispMACH 4032V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 11.8 mA
Vcc = 2.5V 11.8 mA
Vcc = 1.8V 1.8 mA
ICC4Standby Power Supply Current Vcc = 3.3V 11.3 mA
Vcc = 2.5V 11.3 mA
Vcc = 1.8V 1.3 mA
ispMACH 4064V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 12 mA
Vcc = 2.5V 12 mA
Vcc = 1.8V 2 mA
ICC5Standby Power Supply Current Vcc = 3.3V 11.5 mA
Vcc = 2.5V 11.5 mA
Vcc = 1.8V 1.5 mA
ispMACH 4128V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 12 mA
Vcc = 2.5V 12 mA
Vcc = 1.8V 2 mA
ICC4Standby Power Supply Current Vcc = 3.3V 11.5 mA
Vcc = 2.5V 11.5 mA
Vcc = 1.8V 1.5 mA
ispMACH 4256V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 12.5 mA
Vcc = 2.5V 12.5 mA
Vcc = 1.8V 2.5 mA
ICC4Standby Power Supply Current Vcc = 3.3V 12 mA
Vcc = 2.5V 12 mA
Vcc = 1.8V 2 mA
ispMACH 4384V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 13.5 mA
Vcc = 2.5V 13.5 mA
Vcc = 1.8V 3.5 mA
ICC4Standby Power Supply Current Vcc = 3.3V 12.5 mA
Vcc = 2.5V 12.5 mA
Vcc = 1.8V 2.5 mA
ispMACH 4512V/B/C
ICC1,2,3 Operating Power Supply Current Vcc = 3.3V 14 mA
Vcc = 2.5V 14 mA
Vcc = 1.8V 4 mA
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
18
ICC4Standby Power Supply Current Vcc = 3.3V 13 mA
Vcc = 2.5V 13 mA
Vcc = 1.8V 3 mA
1. TA = 25°C, frequency = 1.0 MHz.
2. Device congured with 16-bit counters.
3. ICC varies with specic device conguration and operating frequency.
4. TA = 25°C
Supply Current, ispMACH 4000Z
Over Recommended Operating Conditions
Symbol Parameter Condition Min. Typ. Max. Units
ispMACH 4032ZC
ICC1, 2, 3, 5 Operating Power Supply Current
Vcc = 1.8V, TA = 25°C 50 µA
Vcc = 1.9V, TA = 70°C 58 µA
Vcc = 1.9V, TA = 85°C 60 µA
Vcc = 1.9V, TA = 125°C 70 µA
ICC4, 5 Standby Power Supply Current
Vcc = 1.8V, TA = 25°C 10 µA
Vcc = 1.9V, TA = 70°C 13 20 µA
Vcc = 1.9V, TA = 85°C 15 25 µA
Vcc = 1.9V, TA = 125°C 22 µA
ispMACH 4064ZC
ICC1, 2, 3, 5 Operating Power Supply Current
Vcc = 1.8V, TA = 25°C 80 µA
Vcc = 1.9V, TA = 70°C 89 µA
Vcc = 1.9V, TA = 85°C 92 µA
Vcc = 1.9V, TA = 125°C 109 µA
ICC4, 5 Standby Power Supply Current
Vcc = 1.8V, TA = 25°C 11 µA
Vcc = 1.9V, TA = 70°C 15 25 µA
Vcc = 1.9V, TA = 85°C 18 35 µA
Vcc = 1.9V, TA = 125°C 37 µA
ispMACH 4128ZC
ICC1, 2, 3, 5 Operating Power Supply Current
Vcc = 1.8V, TA = 25°C 168 µA
Vcc = 1.9V, TA = 70°C 190 µA
Vcc = 1.9V, TA = 85°C 195 µA
Vcc = 1.9V, TA = 125°C 212 µA
ICC4, 5 Standby Power Supply Current
Vcc = 1.8V, TA = 25°C 12 µA
Vcc = 1.9V, TA = 70°C 16 35 µA
Vcc = 1.9V, TA = 85°C 19 50 µA
Vcc = 1.9V, TA = 125°C 42 µA
Supply Current, ispMACH 4000V/B/C (Cont.)
Over Recommended Operating Conditions
Symbol Parameter Condition Min. Typ. Max. Units
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
19
ispMACH 4256ZC
ICC1, 2, 3, 5 Operating Power Supply Current
Vcc = 1.8V, TA = 25°C 341 µA
Vcc = 1.9V, TA = 70°C 361 µA
Vcc = 1.9V, TA = 85°C 372 µA
Vcc = 1.9V, TA = 125°C 468 µA
ICC4, 5 Standby Power Supply Current
Vcc = 1.8V, TA = 25°C 13 µA
Vcc = 1.9V, TA = 70°C 32 55 µA
Vcc = 1.9V, TA = 85°C 43 90 µA
Vcc = 1.9V, TA = 125°C 135 µA
1. TA = 25°C, frequency = 1.0 MHz.
2. Device congured with 16-bit counters.
3. ICC varies with specic device conguration and operating frequency.
4. VCCO = 3.6V, VIN = 0V or VCCO, bus maintenance turned off. VIN above VCCO will add transient current above the specied standby ICC.
5. Includes VCCO current without output loading.
Supply Current, ispMACH 4000Z (Cont.)
Over Recommended Operating Conditions
Symbol Parameter Condition Min. Typ. Max. Units
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
20
I/O DC Electrical Characteristics
Over Recommended Operating Conditions
Standard VIL VIH VOL
Max (V) VOH
Min (V) IOL1
(mA) IOH1
(mA)Min (V) Max (V) Min (V) Max (V)
LVTTL -0.3 0.80 2.0 5.5 0.40 VCCO - 0.40 8.0 -4.0
0.20 VCCO - 0.20 0.1 -0.1
LVCMOS 3.3 -0.3 0.80 2.0 5.5 0.40 VCCO - 0.40 8.0 -4.0
0.20 VCCO - 0.20 0.1 -0.1
LVCMOS 2.5 -0.3 0.70 1.70 3.6 0.40 VCCO - 0.40 8.0 -4.0
0.20 VCCO - 0.20 0.1 -0.1
LVCMOS 1.8
(4000V/B) -0.3 0.63 1.17 3.6 0.40 VCCO - 0.45 2.0 -2.0
0.20 VCCO - 0.20 0.1 -0.1
LVCMOS 1.8
(4000C/Z) -0.3 0.35 * VCC 0.65 * VCC 3.6 0.40 VCCO - 0.45 2.0 -2.0
0.20 VCCO - 0.20 0.1 -0.1
PCI 3.3 (4000V/B) -0.3 1.08 1.5 5.5 0.1 VCCO 0.9 VCCO 1.5 -0.5
PCI 3.3 (4000C/Z) -0.3 0.3 * 3.3 * (VCC / 1.8) 0.5 * 3.3 * (VCC / 1.8) 5.5 0.1 VCCO 0.9 VCCO 1.5 -0.5
1. The average DC current drawn by I/Os between adjacent bank GND connections, or between the last GND in an I/O bank and the end of
the I/O bank, as shown in the logic signals connection table, shall not exceed n*8mA. Where n is the number of I/Os between bank GND
connections or between the last GND in a bank and the end of a bank.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
21
V
O
Output Voltage (V)
Typical I/O Output Current (mA)
3.3V V
CCO
VO Output Voltage (V)
0
0
0
20
40
60
80
100
10
20
30
40
50
60
0
10
20
30
40
50
60
70
2.01.51.00.5
0 2.0 2.5 3.0 3.51.51.00.5 0 2.0 2.51.51.00.5
Typical I/O Output Current (mA)
1.8V V
CCO
VO Output Voltage (V)
IOH
Typical I/O Output Current (mA)
2.5V V
CCO
IOL
IOH
IOL
IOH
IOL
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
22
ispMACH 4000V/B/C External Switching Characteristics
Over Recommended Operating Conditions
Parameter Description1, 2, 3
-25 -27 -3 -35 UnitsMin. Max. Min. Max. Min. Max. Min. Max.
tPD 5-PT bypass combinatorial propagation
delay —2.5—2.7—3.0 3.5 ns
tPD_MC 20-PT combinatorial propagation delay
through macrocell —3.2—3.5—3.8 4.2 ns
tSGLB register setup time before clock 1.8 1.8 2.0 2.0 ns
tST GLB register setup time before clock
with T-type register 2.0 2.0 2.2 2.2 ns
tSIR GLB register setup time before clock,
input register path 0.7 1.0 1.0 1.0 ns
tSIRZ GLB register setup time before clock
with zero hold 1.7 2.0 2.0 2.0 ns
tHGLB register hold time after clock 0.0 0.0 0.0 0.0 ns
tHT GLB register hold time after clock with
T-type register 0.0 0.0 0.0 0.0 ns
tHIR GLB register hold time after clock, input
register path 0.9 1.0 1.0 1.0 ns
tHIRZ GLB register hold time after clock, input
register path with zero hold 0.0 0.0 0.0 0.0 ns
tCO GLB register clock-to-output delay 2.2 2.7 2.7 2.7 ns
tRExternal reset pin to output delay 3.5 4.0 4.4 4.5 ns
tRW External reset pulse duration 1.5 1.5 1.5 1.5 - ns
tPTOE/DIS Input to output local product term output
enable/disable —4.0—4.5—5.0 5.5 ns
tGPTOE/DIS Input to output global product term
output enable/disable —5.0—6.5—8.0 8.0 ns
tGOE/DIS Global OE input to output enable/disab le 3.0 3.5 4.0 4.5 ns
tCW Global clock width, high or low 1.1 1.3 1.3 1.3 ns
tGW Global gate width low (for low
transparent) or high (f or high transparent) 1.1 1.3 1.3 1.3 ns
tWIR Input register clock width, high or low 1.1 1.3 1.3 1.3 ns
fMAX4Clock frequency with internal feedback 400 333 322 322 MHz
fMAX (Ext.) Cloc k frequency with external f eedbac k,
[1/ (tS + tCO)] 250 222 212 212 MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards. Timing v.3.2
2. Measured using standard switching circuit, assuming GRP loading of 1 and 1 output switching.
3. Pulse widths and clock widths less than minimum will cause unknown behavior.
4. Standard 16-bit counter using GRP feedback.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
23
ispMACH 4000V/B/C External Switching Characteristics (Cont.)
Over Recommended Operating Conditions
Parameter Description1, 2, 3
-5 -75 -10 UnitsMin. Max. Min. Max. Min. Max.
tPD 5-PT bypass combinatorial propagation delay 5.0 7.5 10.0 ns
tPD_MC 20-PT combinatorial propagation delay through macrocell 5.5 8.0 10.5 ns
tSGLB register setup time before clock 3.0 4.5 5.5 ns
tST GLB register setup time before clock with T-type register 3.2 4.7 5.5 ns
tSIR GLB register setup time before clock, input register path 1.2 1.7 1.7 ns
tSIRZ GLB register setup time before clock with zero hold 2.2 2.7 2.7 ns
tHGLB register hold time after clock 0.0 0.0 0.0 ns
tHT GLB register hold time after clock with T-type register 0.0 0.0 0.0 ns
tHIR GLB register hold time after clock, input register path 1.0 1.0 1.0 ns
tHIRZ GLB register hold time after clock, input register path with
zero hold 0.0 0.0 0.0 ns
tCO GLB register clock-to-output delay 3.4 4.5 6.0 ns
tRExternal reset pin to output delay 6.3 9.0 10.5 ns
tRW External reset pulse duration 2.0 4.0 4.0 ns
tPTOE/DIS Input to output local product term output enable/disable 7.0 9.0 10.5 ns
tGPTOE/DIS Input to output global product term output enable/disable 9.0 10.3 12.0 ns
tGOE/DIS Global OE input to output enable/disable 5.0 7.0 8.0 ns
tCW Global clock width, high or low 2.2 3.3 4.0 ns
tGW Global gate width low (for low transparent) or high (for
high transparent) 2.2 3.3 4.0 ns
tWIR Input register clock width, high or low 2.2 3.3 4.0 ns
fMAX4Clock frequency with internal feedback 227 168 125 MHz
fMAX (Ext.) Clock frequency with external feedback, [1/ (tS + tCO)] 156 111 86 MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards. Timing v.3.2
2. Measured using standard switching circuit, assuming GRP loading of 1 and 1 output switching.
3. Pulse widths and clock widths less than minimum will cause unknown behavior.
4. Standard 16-bit counter using GRP feedback.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
24
ispMACH 4000Z External Switching Characteristics
Over Recommended Operating Conditions
Parameter Description1, 2, 3
-35 -37 -42 UnitsMin. Max. Min. Max. Min. Max.
tPD 5-PT bypass combinatorial propagation delay 3.5 3.7 4.2 ns
tPD_MC 20-PT combinatorial propagation delay
through macrocell —4.4—4.7 5.7 ns
tSGLB register setup time before clock 2.2 2.5 2.7 ns
tST GLB register setup time before clock with
T-type register 2.4 2.7 2.9 ns
tSIR GLB register setup time before clock, input
register path 1.0 1.1 1.3 ns
tSIRZ GLB register setup time bef ore clock with zeto
hold 2.0 2.1 2.6 ns
tHGLB register hold time after clock 0.0 0.0 0.0 ns
tHT GLB register hold time after clock with T-type
register 0.0 0.0 0.0 ns
tHIR GLB register hold time after clock, input
register path 1.0 1.0 1.3 ns
tHIRZ GLB register hold time after clock, input
register path with zero hold 0.0 0.0 0.0 ns
tCO GLB register clock-to-output delay 3.0 3.2 3.5 ns
tRExternal reset pin to output delay 5.0 6.0 7.3 ns
tRW External reset pulse duration 1.5 1.7 2.0 ns
tPTOE/DIS Input to output local product term output
enable/disable —7.0—8.0 8.0 ns
tGPTOE/DIS Input to output global product term output
enable/disable —6.5—7.0 8.0 ns
tGOE/DIS Global OE input to output enable/disable 4.5 4.5 4.8 ns
tCW Global clock width, high or low 1.0 1.5 1.8 ns
tGW Global gate width low (for low transparent) or
high (for high transparent) 1.0 1.5 1.8 ns
tWIR Input register clock width, high or low 1.0 1.5 1.8 ns
fMAX4Clock frequency with internal feedback 267 250 220 MHz
tMAX (Ext.) clock frequency with external feedback,
[1 / (tS + tCO)] 192 175 161 MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards. Timing v.2.2
2. Measured using standard switching GRP loading of 1 and 1 output switching.
3. Pulse widths and clock widths less than minimum will cause unknown behavior.
4. Standard 16-bit counter using GRP feedback.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
25
ispMACH 4000Z External Switching Characteristics (Cont.)
Over Recommended Operating Conditions
Parameter Description1, 2, 3
-45 -5 -75 UnitsMin. Max. Min. Max. Min. Max.
tPD 5-PT bypass combinatorial propagation delay 4.5 5.0 7.5 ns
tPD_MC 20-PT combinatorial propagation delay
through macrocell —5.8—6.0 8.0 ns
tSGLB register setup time before clock 2.9 3.0 4.5 ns
tST GLB register setup time before clock with T-
type register 3.1 3.2 4.7 ns
tSIR GLB register setup time before clock, input
register path 1.3 1.3 1.4 ns
tSIRZ GLB register setup time bef ore clock with zeto
hold 2.6 2.6 2.7 ns
tHGLB register hold time after clock 0.0 0.0 0.0 ns
tHT GLB register hold time after clock with T-type
register 0.0 0.0 0.0 ns
tHIR GLB register hold time after clock, input regis-
ter path 1.3 1.3 1.3 ns
tHIRZ GLB register hold time after clock, input regis-
ter path with zero hold 0.0 0.0 0.0 ns
tCO GLB register clock-to-output delay 3.8 4.2 4.5 ns
tRExternal reset pin to output delay 7.5 7.5 9.0 ns
tRW External reset pulse duration 2.0 2.0 4.0 ns
tPTOE/DIS Input to output local product term output
enable/disable —8.2—8.5 9.0 ns
tGPTOE/DIS Input to output global product term output
enable/disable 10.0 10.0 10.5 ns
tGOE/DIS Global OE input to output enable/disable 5.5 6.0 7.0 ns
tCW Global clock width, high or low 1.8 2.0 3.3 ns
tGW Global gate width low (for low transparent) or
high (for high transparent) 1.8 2.0 3.3 ns
tWIR Input register clock width, high or low 1.8 2.0 3.3 ns
fMAX4Clock frequency with internal feedback 200 200 168 MHz
tMAX (Ext.) clock frequency with external feedback, [1 /
(tS + tCO)] 150 139 111 MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards. Timing v.2.2
2. Measured using standard switching GRP loading of 1 and 1 output switching.
3. Pulse widths and clock widths less than minimum will cause unknown behavior.
4. Standard 16-bit counter using GRP feedback.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
26
Timing Model
The task of determining the timing through the ispMACH 4000 f amily, like any CPLD, is relatively simple . The timing
model provided in Figure 11 shows the specic delay paths. Once the implementation of a given function is deter-
mined either conceptually or from the software report le, the delay path of the function can easily be determined
from the timing model. The Lattice design tools repor t the timing delays based on the same timing model for a par-
ticular design. Note that the internal timing parameters are given for reference only, and are not tested. The exter-
nal timing parameters are tested and guaranteed for every device. For more information on the timing model and
usage, please refer to Technical Note TN1004: ispMACH 4000 Timing Model Design and Usage Guidelines.
Figure 11. ispMACH 4000 Timing Model
DATA
MC Reg.
C.E.
S/R
Q
SCLK
IN
OE
In/Out
Delays
In/Out
Delays
Control
Delays
Register/Latch
Delays
Routing/GLB Delays
Out
Note: Italicized items are optional delay adders.
t
FBK
Feedback
From
Feedback
t
BUF
t
PDb
t
MCELL
t
PTCLK
t
BCLK
t
PTSR
t
BSR
t
GPTOE
t
PTOE
t
EXP
t
ROUTE
t
BLA
t
INREG
t
INDIO
t
IN
t
IOI
t
GCLK_IN
t
IOI
t
GOE
t
IOI
t
PDi
t
IOO
t
ORP
t
EN
t
DIS
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
27
ispMACH 4000V/B/C Internal Timing Parameters
Over Recommended Operating Conditions
Parameter Description -2.5 -2.7 -3 -3.5 Units
In/Out Delays
tIN Input Buffer Delay 0.60 0.60 0.70 0.70 ns
tGOE Global OE Pin Delay 2.04 2.54 3.04 3.54 ns
tGCLK_IN Global Clock Input Buffer Delay 0.78 1.28 1.28 1.28 ns
tBUF Delay through Output Buffer 0.85 0.85 0.85 0.85 ns
tEN Output Enable Time 0.96 0.96 0.96 0.96 ns
tDIS Output Disable Time 0.96 0.96 0.96 0.96 ns
Routing/GLB Delays
tROUTE Delay through GRP 0.61 0.81 1.01 1.01 ns
tMCELL Macrocell Delay 0.45 0.55 0.55 0.65 ns
tINREG Input Buffer to Macrocell Register
Delay 0.11 0.31 0.31 0.31 ns
tFBK Internal Feedback Delay 0.00 0.00 0.00 0.00 ns
tPDb 5-PT Bypass Propagation Delay 0.44 0.44 0.44 0.94 ns
tPDi Macrocell Propagation Delay 0.64 0.64 0.64 0.94 ns
Register/Latch Delays
tSD-Register Setup Time
(Global Clock) 0.92 1.12 1.02 0.92 ns
tS_PT D-Register Setup Time
(Product Term Clock) 1.42 1.32 1.32 1.32 ns
tST T-Register Setup Time
(Global Clock) 1.12 1.32 1.22 1.12 ns
tST_PT T-Register Setup Time
(Product Term Clock) 1.42 1.32 1.32 1.32 ns
tHD-Register Hold Time 0.88 0.68 0.98 1.08 ns
tHT T-Register Hold Time 0.88 0.68 0.98 1.08 ns
tSIR D-Input Register Setup Time
(Global Clock) 0.82 1.37 1.27 1.27 ns
tSIR_PT D-Input Register Setup Time
(Product Term Clock) 1.45 1.45 1.45 1.45 ns
tHIR D-Input Register Hold Time
(Global Clock) 0.88 0.63 0.73 0.73 ns
tHIR_PT D-Input Register Hold Time
(Product Term Clock) 0.88 0.63 0.73 0.73 ns
tCOi Register Clock to Output/Feedback
MUX Time 0.52 0.52 0.52 0.52 ns
tCES Clock Enable Setup Time 2.25 2.25 2.25 2.25 ns
tCEH Clock Enable Hold Time 1.88 1.88 1.88 1.88 ns
tSL Latch Setup Time
(Global Clock) 0.92 1.12 1.02 0.92 ns
tSL_PT Latch Setup Time (Product Term
Clock) 1.42 1.32 1.32 1.32 ns
tHL Latch Hold Time 1.17 1.17 1.17 1.17 ns
tGOi Latch Gate to Output/Feedback
MUX Time 0.33 0.33 0.33 0.33 ns
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
28
tPDLi Propagation Delay through
Transparent Latch to Output/
Feedback MUX 0.25 0.25 0.25 0.25 ns
tSRi Asynchronous Reset or Set to
Output/Feedback MUX Delay 0.28 0.28 0.28 0.28 ns
tSRR Asynchronous Reset or Set
Recov ery Time 1.67 1.67 1.67 1.67 ns
Control Delays
tBCLK GLB PT Clock Delay 1.12 1.12 1.12 1.12 ns
tPTCLK Macrocell PT Clock Delay 0.87 0.87 0.87 0.87 ns
tBSR Block PT Set/Reset Delay 1.83 1.83 1.83 1.83 ns
tPTSR Macrocell PT Set/Reset Delay 1.11 1.41 1.51 1.61 ns
tGPTOE Global PT OE Delay 2.83 4.13 5.33 5.33 ns
tPTOE Macrocell PT OE Delay 1.83 2.13 2.33 2.83 ns
Timing v.3.2
Note: Internal Timing Parameters are not tested and are for reference only. Refer to Timing Model in this data sheet for further details.
ispMACH 4000V/B/C Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter Description -2.5 -2.7 -3 -3.5 Units
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
29
ispMACH 4000V/B/C Internal Timing Parameters
Over Recommended Operating Conditions
Parameter Description -5 -75 -10 UnitsMin. Max. Min. Max. Min. Max.
In/Out Delays
tIN Input Buffer Delay 0.95 1.50 2.00 ns
tGOE Global OE Pin Delay 4.04 6.04 7.04 ns
tGCLK_IN Global Clock Input Buffer Delay 1.83 2.28 3.28 ns
tBUF Delay through Output Buffer 1.00 1.50 1.50 ns
tEN Output Enable Time 0.96 0.96 0.96 ns
tDIS Output Disable Time 0.96 0.96 0.96 ns
Routing/GLB Delays
tROUTE Delay through GRP 1.51 2.26 3.26 ns
tMCELL Macrocell Delay 1.05 1.45 1.95 ns
tINREG Input Buffer to Macrocell Register Delay 0.56 0.96 1.46 ns
tFBK Internal Feedback Delay 0.00 0.00 0.00 ns
tPDb 5-PT Bypass Propagation Delay 1.54 2.24 3.24 ns
tPDi Macrocell Propagation Delay 0.94 1.24 1.74 ns
Register/Latch Delays
tSD-Register Setup Time (Global Clock) 1.32 1.57 1.57 ns
tS_PT D-Register Setup Time (Product Term Clock) 1.32 1.32 1.32 ns
tST T-Register Setup Time (Global Clock) 1.52 1.77 1.77 ns
tST_PT T-Register Setup Time (Product Term Clock) 1.32 1.32 1.32 ns
tHD-Register Hold Time 1.68 2.93 3.93 ns
tHT T-Register Hold Time 1.68 2.93 3.93 ns
tSIR D-Input Register Setup Time (Global Clock) 1.52 1.57 1.57 ns
tSIR_PT D-Input Register Setup Time (Product Term Clock) 1.45 1.45 1.45 ns
tHIR D-Input Register Hold Time (Global Clock) 0.68 1.18 1.18 ns
tHIR_PT D-Input Register Hold Time (Product Term Clock) 0.68 1.18 1.18 ns
tCOi Register Clock to Output/Feedback MUX Time 0.52 0.67 1.17 ns
tCES Clock Enable Setup Time 2.25 2.25 2.25 ns
tCEH Clock Enable Hold Time 1.88 1.88 1.88 ns
tSL Latch Setup Time (Global Clock) 1.32 1.57 1.57 ns
tSL_PT Latch Setup Time (Product Term Clock) 1.32 1.32 1.32 ns
tHL Latch Hold Time 1.17 1.17 1.17 ns
tGOi Latch Gate to Output/Feedback MUX Time 0.33 0.33 0.33 ns
tPDLi Propagation Delay through Transparent Latch to Output/
Feedback MUX 0.25 0.25 0.25 ns
tSRi Asynchronous Reset or Set to Output/Feedback MUX
Delay 0.28 0.28 0.28 ns
tSRR Asynchronous Reset or Set Recovery Time 1.67 1.67 1.67 ns
Control Delays
tBCLK GLB PT Clock Delay 1.12 1.12 0.62 ns
tPTCLK Macrocell PT Clock Delay 0.87 0.87 0.87 ns
tBSR GLB PT Set/Reset Delay 1.83 1.83 1.83 ns
tPTSR Macrocell PT Set/Reset Delay 2.51 3.41 3.41 ns
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
30
tGPTOE Global PT OE Delay 5.58 5.58 5.78 ns
tPTOE Macrocell PT OE Delay 3.58 4.28 4.28 ns
Timing v.3.2
Note: Internal Timing Parameters are not tested and are for reference only. Refer to Timing Model in this data sheet for further details.
ispMACH 4000V/B/C Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter Description -5 -75 -10 UnitsMin. Max. Min. Max. Min. Max.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
31
ispMACH 4000Z Internal Timing Parameters
Over Recommended Operating Conditions
Parameter Description -35 -37 -42 UnitsMin. Max. Min. Max. Min. Max.
In/Out Delays
tIN Input Buffer Delay 0.75 0.80 0.75 ns
tGOE Global OE Pin Delay 2.25 2.25 2.30 ns
tGCLK_IN Global Clock Input Buffer Delay 1.60 1.60 1.95 ns
tBUF Delay through Output Buffer 0.75 0.90 0.90 ns
tEN Output Enable Time 2.25 2.25 2.50 ns
tDIS Output Disable Time 1.35 1.35 2.50 ns
Routing/GLB Delays
tROUTE Delay through GRP 1.60 1.60 2.15 ns
tMCELL Macrocell Delay 0.65 0.75 0.85 ns
tINREG Input Buffer to Macrocell Register Delay 0.91 1.00 1.00 ns
tFBK Internal Feedback Delay 0.05 0.00 0.00 ns
tPDb 5-PT Bypass Propagation Delay 0.40 0.40 0.40 ns
tPDi Macrocell Propagation Delay 0.25 0.25 0.65 ns
Register/Latch Delays
tSD-Register Setup Time (Global Clock) 0.80 0.95 0.90 ns
tS_PT D-Register Setup Time (Product Term Clock) 1.35 1.95 1.90 ns
tST T-Register Setup Time (Global Clock) 1.00 1.15 1.10 ns
tST_PT T-register Setup Time (Product Term Clock) 1.55 1.75 2.10 ns
tHD-Register Hold Time 1.40 1.55 1.80 ns
tHT T-Resister Hold Time 1.40 1.55 1.80 ns
tSIR D-Input Register Setup Time (Global Clock) 0.94 0.90 1.50 ns
tSIR_PT D-Input Register Setup Time (Product Term Clock) 1.45 1.45 1.45 ns
tHIR D-Input Register Hold Time (Global Clock) 1.06 1.20 1.10 ns
tHIR_PT D-Input Register Hold Time (Product Term Clock) 0.88 1.00 1.00 ns
tCOi Register Clock to Output/Feedback MUX Time 0.65 0.70 0.65 ns
tCES Clock Enable Setup Time 1.00 2.00 2.00 ns
tCEH Clock Enable Hold Time 0.00 0.00 0.00 ns
tSL Latch Setup Time (Global Clock) 0.80 0.95 0.90 ns
tSL_PT Latch Setup Time (Product Term Clock) 1.55 1.95 1.90 ns
tHL Latch Hold Time 1.40 1.80 1.80 ns
tGOi Latch Gate to Output/Feedback MUX Time 0.40 0.33 0.33 ns
tPDLi Propagation Delay through Transparent Latch to Output/
Feedback MUX 0.30 0.25 0.25 ns
tSRi Asynchronous Reset or Set to Output/F eedback MUX Dela y 0.28 0.28 1.27 ns
tSRR Asynchronous Reset or Set Recovery Delay 2.00 1.67 1.80 ns
Control Delays
tBCLK GLB PT Clock Delay 1.30 1.50 1.55 ns
tPTCLK Macrocell PT Clock Delay 1.50 1.70 1.55 ns
tBSR GLB PT Set/Reset Delay 1.10 1.83 1.83 ns
tPTSR Macrocell PT Set/Reset Delay 1.22 2.02 1.83 ns
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
32
tGPTOE Global PT OE Delay 1.9 2.35 2.60 ns
tPTOE Macrocell PT OE Delay 2.4 3.35 2.60 ns
Note: Internal Timing Parameters are not tested and are for reference only. Refer to the timing model in this data sheet for Timing v.2.2
further details.
ispMACH 4000Z Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter Description -35 -37 -42 UnitsMin. Max. Min. Max. Min. Max.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
33
ispMACH 4000Z Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter Description -45 -5 -75 UnitsMin. Max. Min. Max. Min. Max.
In/Out Delays
tIN Input Buffer Delay 0.95 1.25 1.80 ns
tGOE Global OE Pin Delay 3.00 3.50 4.30 ns
tGCLK_IN Global Clock Input Buffer Delay 1.95 2.05 2.15 ns
tBUF Delay through Output Buffer 1.10 1.00 1.30 ns
tEN Output Enable Time 2.50 2.50 2.70 ns
tDIS Output Disable Time 2.50 2.50 2.70 ns
Routing/GLB Delays
tROUTE Delay through GRP 2.25 2.05 2.50 ns
tMCELL Macrocell Delay 0.65 0.65 1.00 ns
tINREG Input Buffer to Macrocell Register Delay 1.00 1.00 1.00 ns
tFBK Internal Feedback Delay 0.35 0.05 0.05 ns
tPDb 5-PT Bypass Propagation Delay 0.20 0.70 1.90 ns
tPDi Macrocell Propagation Delay 0.45 0.65 1.00 ns
Register/Latch Delays
tSD-Register Setup Time (Global Clock) 1.00 1.10 1.35 ns
tS_PT D-Register Setup Time (Product Term Clock) 2.10 1.90 2.45 ns
tST T-Register Setup Time (Global Clock) 1.20 1.30 1.55 ns
tST_PT T-register Setup Time (Product Term Clock) 2.30 2.10 2.75 ns
tHD-Register Hold Time 1.90 1.90 3.15 ns
tHT T-Resister Hold Time 1.90 1.90 3.15 ns
tSIR D-Input Register Setup Time (Global Clock) 1.30 1.10 0.75 ns
tSIR_PT D-Input Register Setup Time (Product Term Clock) 1.45 1.45 1.45 ns
tHIR D-Input Register Hold Time (Global Clock) 1.30 1.50 1.95 ns
tHIR_PT D-Input Register Hold Time (Product Term Clock) 1.00 1.00 1.18 ns
tCOi Register Clock to Output/Feedback MUX Time 0.75 1.15 1.05 ns
tCES Clock Enable Setup Time 2.00 2.00 2.00 ns
tCEH Clock Enable Hold Time 0.00 0.00 0.00 ns
tSL Latch Setup Time (Global Clock) 1.00 1.00 1.65 ns
tSL_PT Latch Setup Time (Product Term Clock) 2.10 1.90 2.15 ns
tHL Latch Hold Time 2.00 2.00 1.17 ns
tGOi Latch Gate to Output/Feedback MUX Time 0.33 0.33 0.33 ns
tPDLi Propagation Delay through Transparent Latch to Output/
Feedback MUX 0.25 0.25 0.25 ns
tSRi Asynchronous Reset or Set to Output/F eedback MUX Dela y 0.97 0.97 0.28 ns
tSRR Asynchronous Reset or Set Recovery Delay 1.80 1.80 1.67 ns
Control Delays
tBCLK GLB PT Clock Delay 1.55 1.55 1.25 ns
tPTCLK Macrocell PT Clock Delay 1.55 1.55 1.25 ns
tBSR GLB PT Set/Reset Delay 1.83 1.83 1.83 ns
tPTSR Macrocell PT Set/Reset Delay 1.83 1.83 2.72 ns
tGPTOE Global PT OE Delay 4.30 4.20 3.50 ns
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
34
tPTOE Macrocell PT OE Delay 2.50 2.70 2.00 ns
Note: Internal Timing Parameters are not tested and are for reference only. Refer to the timing model in this data sheet for Timing v.2.2
further details.
ispMACH 4000Z Internal Timing Parameters (Cont.)
Over Recommended Operating Conditions
Parameter Description -45 -5 -75 UnitsMin. Max. Min. Max. Min. Max.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
35
ispMACH 4000V/B/C Timing Adders1
Adder
Type Base
Parameter Description -25 -27 -3 -35 UnitsMin. Max. Min. Max. Min. Max. Min. Max.
Optional Delay Adders
tINDIO tINREG Input register delay 0.95 1.00 1.00 1.00 ns
tEXP tMCELL Product term expander
delay 0.33 0.33 0.33 0.33 ns
tORP Output routing pool delay 0.05 0.05 0.05 0.05 ns
tBLA tROUTE Additional block loading
adder 0.03 0.05 0.05 0.05 ns
tIOI Input Adjusters
LVTTL_in tIN, tGCLK_IN,
tGOE Using LVTTL standard 0.60 0.60 0.60 0.60 ns
LVCMOS33_in tIN, tGCLK_IN,
tGOE Using LVCMOS 3.3
standard 0.60 0.60 0.60 0.60 ns
LVCMOS25_in tIN, tGCLK_IN,
tGOE Using LVCMOS 2.5
standard 0.60 0.60 0.60 0.60 ns
LVCMOS18_in tIN, tGCLK_IN,
tGOE Using LVCMOS 1.8
standard 0.00 0.00 0.00 0.00 ns
PCI_in tIN, tGCLK_IN,
tGOE Using PCI compatible
input 0.60 0.60 0.60 0.60 ns
tIOO Output Adjusters
LVTTL_out tBUF, tEN, tDIS Output congured as
TTL buffer 0.20 0.20 0.20 0.20 ns
LVCMOS33_out tBUF, tEN, tDIS Output congured as
3.3V buffer 0.20 0.20 0.20 0.20 ns
LVCMOS25_out tBUF, tEN, tDIS Output congured as
2.5V buffer 0.10 0.10 0.10 0.10 ns
LVCMOS18_out tBUF, tEN, tDIS Output congured as
1.8V buffer 0.00 0.00 0.00 0.00 ns
PCI_out tBUF, tEN, tDIS Output congured as
PCI compatible buffer 0.20 0.20 0.20 0.20 ns
Slow Slew tBUF, tEN Output congured for
slow slew rate 1.00 1.00 1.00 1.00 ns
Note: Open drain timing is the same as corresponding LVCMOS timing. Timing v.3.2
1. Refer to Technical Note TN1004: ispMACH 4000 Timing Model Design and Usage Guidelines for information regarding use of these adders.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
36
ispMACH 4000V/B/C Timing Adders1 (Cont.)
Adder
Type Base
Parameter Description -5 -75 -10 UnitsMin. Max. Min. Max. Min. Max.
Optional Delay Adders
tINDIO tINREG Input register delay 1.00 1.00 1.00 ns
tEXP tMCELL Product term expander delay 0.33 0.33 0.33 ns
tORP Output routing pool delay 0.05 0.05 0.05 ns
tBLA tROUTE Additional block loading adder 0.05 0.05 0.05 ns
tIOI Input Adjusters
LVTTL_in tIN, tGCLK_IN,
tGOE Using LVTTL standard 0.60 0.60 0.60 ns
LVCMOS33_in tIN, tGCLK_IN,
tGOE Using LVCMOS 3.3 standard 0.60 0.60 0.60 ns
LVCMOS25_in tIN, tGCLK_IN,
tGOE Using LVCMOS 2.5 standard 0.60 0.60 0.60 ns
LVCMOS18_in tIN, tGCLK_IN,
tGOE Using LVCMOS 1.8 standard 0.00 0.00 0.00 ns
PCI_in tIN, tGCLK_IN,
tGOE Using PCI compatible input 0.60 0.60 0.60 ns
tIOO Output Adjusters
LVTTL_out tBUF, tEN, tDIS Output congured as TTL buffer 0.20 0.20 0.20 ns
LVCMOS33_out tBUF, tEN, tDIS Output congured as 3.3V buffer 0.20 0.20 0.20 ns
LVCMOS25_out tBUF, tEN, tDIS Output congured as 2.5V buffer 0.10 0.10 0.10 ns
LVCMOS18_out tBUF, tEN, tDIS Output congured as 1.8V buffer 0.00 0.00 0.00 ns
PCI_out tBUF, tEN, tDIS Output congured as PCI compatible
buffer 0.20 0.20 0.20 ns
Slow Slew tBUF, tEN Output congured for slow slew rate 1.00 1.00 1.00 ns
Note: Open drain timing is the same as corresponding LVCMOS timing. Timing v.3.2
1. Refer to Technical Note TN1004: ispMA CH 4000 Timing Model Design and Usage Guidelines for information regarding use of these adders.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
37
ispMACH 4000Z Timing Adders 1
Adder
Type Base
Parameter Description -35 -37 -42 UnitsMin. Max. Min. Max. Min. Max.
Optional Delay Adders
tINDIO tINREG Input register delay 1.00 1.00 1.30 ns
tEXP tMCELL Product term expander
delay 0.40 0.40 0.45 ns
tORP Output routing pool
delay 0.40 0.40 0.40 ns
tBLA tROUTE Additional block load-
ing adder 0.04 0.05 0.05 ns
tIOI Input Adjusters
LVTTL_in tIN, tGCLK_IN, tGOE Using LVTTL standard 0.60 0.60 0.60 ns
LVCMOS33_in tIN, tGCLK_IN, tGOE Using LVCMOS 3.3
standard 0.60 0.60 0.60 ns
LVCMOS25_in tIN, tGCLK_IN, tGOE Using LVCMOS 2.5
standard 0.60 0.60 0.60 ns
LVCMOS18_in tIN, tGCLK_IN, tGOE Using LVCMOS 1.8
standard 0.00 0.00 0.00 ns
PCI_in tIN, tGCLK_IN, tGOE Using PCI compatible
input 0.60 0.60 0.60 ns
tIOO Output Adjusters
LVTTL_out tBUF, tEN, tDIS Output congured as
TTL buffer 0.20 0.20 0.20 ns
LVCMOS33_out tBUF, tEN, tDIS Output congured as
3.3V buffer 0.20 0.20 0.20 ns
LVCMOS25_out tBUF, tEN, tDIS Output congured as
2.5V buffer 0.10 0.10 0.10 ns
LVCMOS18_out tBUF, tEN, tDIS Output congured as
1.8V buffer 0.00 0.00 0.00 ns
PCI_out tBUF, tEN, tDIS Output congured as
PCI compatible buffer 0.20 0.20 0.20 ns
Slow Slew tBUF, tEN Output congured for
slow slew rate 1.00 1.00 1.00 ns
Note: Open drain timing is the same as corresponding LVCMOS timing. Timing v.2.2
1. Refer to Technical Note TN 1004, ispMACH 4000 Timing Model Design and Usage Guidelines for information regarding the use of these
adders.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
38
ispMACH 4000Z Timing Adders (Cont.)1
Adder
Type Base
Parameter Description -45 -5 -75 UnitsMin. Max. Min. Max. Min. Max.
Optional Delay Adders
tINDIO tINREG Input register delay 1.30 1.30 1.30 ns
tEXP tMCELL Product term expander
delay 0.45 0.45 0.50 ns
tORP Output routing pool
delay 0.40 0.40 0.40 ns
tBLA tROUTE Additional block load-
ing adder 0.05 0.05 0.05 ns
tIOI Input Adjusters
LVTTL_in tIN, tGCLK_IN, tGOE Using LVTTL standard 0.60 0.60 0.60 ns
LVCMOS33_in tIN, tGCLK_IN, tGOE Using LVCMOS 3.3
standard 0.60 0.60 0.60 ns
LVCMOS25_in tIN, tGCLK_IN, tGOE Using LVCMOS 2.5
standard 0.60 0.60 0.60 ns
LVCMOS18_in tIN, tGCLK_IN, tGOE Using LVCMOS 1.8
standard 0.00 0.00 0.00 ns
PCI_in tIN, tGCLK_IN, tGOE Using PCI compatible
input 0.60 0.60 0.60 ns
tIOO Output Adjusters
LVTTL_out tBUF, tEN, tDIS Output congured as
TTL buffer 0.20 0.20 0.20 ns
LVCMOS33_out tBUF, tEN, tDIS Output congured as
3.3V buffer 0.20 0.20 0.20 ns
LVCMOS25_out tBUF, tEN, tDIS Output congured as
2.5V buffer 0.10 0.10 0.10 ns
LVCMOS18_out tBUF, tEN, tDIS Output congured as
1.8V buffer 0.00 0.00 0.00 ns
PCI_out tBUF, tEN, tDIS Output congured as
PCI compatible buffer 0.20 0.20 0.20 ns
Slow Slew tBUF, tEN Output congured for
slow slew rate 1.00 1.00 1.00 ns
Note: Open drain timing is the same as corresponding LVCMOS timing. Timing v.2.2
1. Refer to Technical Note TN 1004, ispMACH 4000 Timing Model Design and Usage Guidelines for information regarding use of these
adders.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
39
Boundary Scan Waveforms and Timing Specications
Symbol Parameter Min. Max. Units
tBTCP TCK [BSCAN test] clock cycle 40 ns
tBTCH TCK [BSCAN test] pulse width high 20 ns
tBTCL TCK [BSCAN test] pulse width low 20 ns
tBTSU TCK [BSCAN test] setup time 8 ns
tBTH TCK [BSCAN test] hold time 10 ns
tBRF TCK [BSCAN test] rise and fall time 50 mV/ns
tBTCO TAP controller falling edge of clock to valid output 10 ns
tBTOZ TAP controller falling edge of clock to data output disable 10 ns
tBTVO TAP controller falling edge of clock to data output enable 10 ns
tBTCPSU BSCAN test Capture register setup time 8 ns
tBTCPH BSCAN test Capture register hold time 10 ns
tBTUCO BSCAN test Update reg, falling edge of clock to valid output 25 ns
tBTUOZ BSCAN test Update reg, falling edge of clock to output disable 25 ns
tBTUOV BSCAN test Update reg, falling edge of clock to output enable 25 ns
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
40
Power Consumption
Power Estimation Coefcients1
Device A B
ispMACH 4032V/B 11.3 0.010
ispMACH 4032C 1.3 0.010
ispMACH 4064V/B 11.5 0.010
ispMACH 4064C 1.5 0.010
ispMACH 4128V/B 11.5 0.011
ispMACH 4128C 1.5 0.011
ispMACH 4256V/B 12 0.011
ispMACH 4256C 2 0.011
ispMACH 4384V/B 12.5 0.013
ispMACH 4384C 2.5 0.013
ispMACH 4512V/B 13 0.013
ispMACH 4512C 3 0.013
ispMACH 4032ZC 0.010 0.010
ispMACH 4064ZC 0.011 0.010
ispMACH 4128ZC 0.012 0.010
ispMACH 4256ZC 0.013 0.010
1. For further information about the use of these coefcients, refer to Technical Note
TN1005, Power Estimation in ispMACH 4000V/B/C/Z Devices.
01005050 100 200150 250 150 200 250 300 350 400
Frequency (MHz)
ICC (mA)
ICC (mA)
Note: The devices are configured with maximum number
of 16-bit counters, typical current at 1.8V, 25°C.
150
200
300
250
100
50
0
4032V/B
4064V/B
4128V/B
4384V/B
4256V/B
4512V/B
ispMACH 4000C
Typical ICC vs. Frequency
Note: The devices are configured with maximum number
of 16-bit counters, typical current at 3.3V, 2.5V, 25°C.
4032C
4064C
4128C
4384C
4256C
4512C
ispMACH 4000V/B
Typical ICC vs. Frequency
4032ZC
4064ZC
4128ZC
4256ZC
60
80
100
40
20
010050 150 200 250 300 350 400
Frequency (MHz)
ICC (mA)
150
200
300
250
100
50
0
Note: The devices are configured with maximum number
of 16-bit counters, typical current at 1.8V, 25°C.
ispMACH 4000Z
Typical ICC vs. Frequency
(Preliminary Information)
0300
Frequency (MHz)
0
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
41
Switching Test Conditions
Figure 12 shows the output test load that is used for AC testing. The specic values for resistance, capacitance,
voltage, and other test conditions are shown in Table 11.
Figure 12. Output Test Load, LVTTL and LVCMOS Standards
Table 11. Test Fixture Required Components
Test Condition R1R2CL1Timing Ref. VCCO
LVCMOS I/O, (L -> H, H -> L) 10610635pF LVCMOS 3.3 = 1.5V LVCMOS 3.3 = 3.0V
LVCMOS 2.5 = VCCO/2 LVCMOS 2.5 = 2.3V
LVCMOS 1.8 = VCCO/2 LVCMOS 1.8 = 1.65V
LVCMOS I/O (Z -> H) 10635pF 1.5V 3.0V
LVCMOS I/O (Z -> L) 106Ω∞ 35pF 1.5V 3.0V
LVCMOS I/O (H -> Z) 1065pF VOH - 0.3 3.0V
LVCMOS I/O (L -> Z) 106Ω∞ 5pF VOL + 0.3 3.0V
1. CL includes test xtures and probe capacitance.
VCCO
R1
R2CL
DUT Test
Point
0213A/ispm4
k
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
42
Signal Descriptions
ispMACH 4000V/B/C ORP Reference Table
ispMACH 4000Z ORP Reference Table
Signal Names Description
TMS Input – This pin is the IEEE 1149.1 Test Mode Select input, which is used to control
the state machine
TCK Input – This pin is the IEEE 1149.1 Test Clock input pin, used to clock through the
state machine
TDI Input – This pin is the IEEE 1149.1 Test Data In pin, used to load data
TDO Output – This pin is the IEEE 1149.1 Test Data Out pin used to shift data out
GOE0/IO, GOE1/IO These pins are congured to be either Global Output Enable Input or as general I/O
pins
GND Ground
NC Not Connected
VCC The power supply pins for logic core
CLK0/I, CLK1/I, CLK2/I, CLK3/I These pins are congured to be either CLK input or as an input
VCCO0, VCCO1 The power supply pins for each I/O bank
yzz
Input/Output1These are the general purpose I/O used by the logic array. y is GLB
reference (alpha) and z is macrocell reference (numeric). z: 0-15
ispMACH 4032 y: A-B
ispMACH 4064 y: A-D
ispMACH 4128 y: A-H
ispMACH 4256 y: A-P
ispMACH 4384 y: A-P, AX-HX
ispMACH 4512 y: A-P, AX-PX
1. In some packages, certain I/Os are only available for use as inputs. See the signal connections table for details.
4032V/B/C 4064V/B/C 4128V/B/C 4256V/B/C 4384V/B/C 4512V/B/C
Number of I/Os 30132 30232 64 64 92396 64 964128 160 128 192 128 208
Number of GLBs 2244 4 8 8816 16 16 16 16 16 16 16
Number of I/Os /
GLB 16 16 8 8 16 8 12 12 4 8 8 10 8 8 8 Mixture
of 8 & 45
Reference ORP
Table 16 I/Os /
GLB 8 I/Os /
GLB 16 I/Os /
GLB 8 I/Os /
GLB 12 I/Os /
GLB 4 I/Os /
GLB 8 I/Os /
GLB 8 I/Os /
GLB 10 I/Os /
GLB 8 I/Os /
GLB 8 I/Os /
GLB
8 I/Os /
GLB
4 I/Os /
GLB
1. 32-macrocell device, 44 TQFP: 2 GLBs have 15 out of 16 I/Os bonded out.
2. 64-macrocesll device, 44 TQFP: 2 GLBs have 7 out of 8 I/Os bonded out.
3. 128-macrocell device, 128 TQFP: 4 GLBs have 11 out of 12 I/Os
4. 256-macrocell device, 144 TQFP: 16 GLBs have 6 I/Os per
5. 512-macrocell device: 20 GLBs have 8 I/Os per, 12 GLBs have 4 I/Os per
4032Z 4064Z 4128Z 4256Z
Number of I/Os 32 32 64 64 96 64 961128
Number of GLBs 24488161616
Number of I/Os / GLB 16 8 16 8 12 4 8 8
Reference ORP Table 16 I/Os /
GLB 8 I/Os /
GLB 16 I/Os /
GLB 8 I/Os /
GLB 12 I/Os /
GLB 4 I/Os /
GLB 8 I/Os /
GLB 8 I/Os /
GLB
1. 256-macrocell device, 132 csBGA: 16 GLBs have 6 I/Os per
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
43
ispMACH 4000V/B/C/Z Power Supply and NC Connections1
Signal 44-pin TQFP248-pin TQFP256-ball csBGA3100-pin TQFP2128-pin TQFP2
VCC 11, 33 12, 36 K2, A9 25, 40, 75, 90 32, 51, 96, 115
VCCO0
VCCO (Bank 0) 66F313, 33, 95 3, 17, 30, 41, 122
VCCO1
VCCO (Bank 0) 28 30 E8 45, 63, 83 58, 67, 81, 94, 105
GND 12, 34 13, 37 H3, C8 1, 26, 51, 76 1, 33, 65, 97
GND (Bank 0) 5 5 D3 7, 18, 32, 96 10, 24, 40, 113, 123
GND (Bank 1) 27 29 G8 46, 57, 68, 82 49, 59, 74, 88, 104
NC 4032Z: A8, B10, E1,
E3, F8, F10, J1, K3 ——
1. All grounds must be electrically connected at the board le v el. How e v er, f or the purposes of I/O current loading, grounds are associated with
the bank shown.
2. Pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise.
3. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order
ascending horizontally.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
44
ispMACH 4000V/B/C/Z Power Supply and NC Connections1 (Cont.)
Signal 132-ball csBGA7144-pin TQFP4176-pin TQFP4256-ball fpBGA2, 3, 7
VCC P1, A14, B7, N8 36, 57, 108, 129 42, 69, 88, 130,
157, 176 B2, B15, G8, G9, K8, K9, R2, R15
VCCO0
VCCO (Bank 0) G3, P5, C18, M28,
C5 3, 19, 34, 47, 136 4, 22, 40, 56, 166 D6, F4, H7, J7, L4, N6
VCCO1
VCCO (Bank 1) M10, M148, H12,
A10, C13864, 75, 91, 106, 119 78, 92, 110, 128,
144 D11, F13, H10, J10, L13, N11
GND B1, P2, N14, A13 1, 37, 73, 109 2, 465, 65, 90, 134,
153 A1, A16, C6, C11, F3, F14, G7, G10, H8,
H9, J8, J9, K7, K10, L3, L14, P6, P11, T1,
T16
GND (Bank 0) E2, K2, N4, B4 10, 186, 27, 46, 127,
137 13, 31, 55, 155,
167
GND (Bank 1) N11, K13, E13, B11 55, 65, 82, 906, 99,
118 67, 79, 101, 119,
143
NC 4064Z: C1, C3, E1,
E3, H2, J3, K1, M2,
M4, N5, P7, P8, M8,
P10, P11, P14, M12,
K14, K12, G13,
G14, E14, C13, B13,
B10, C10, A7, B5,
A5, A4, A1
4128Z: P8, A7
4128V: 17, 20, 38,
45, 72, 89, 92, 110,
117, 144
4256V: 18, 90
1, 43, 44, 45, 89,
131, 132, 133 4256V/B/C, 128 I/O: A4, A5, A6, A11, A12,
A13, A15, B5, B6, B11, B12, B14, C7, D1,
D4, D5, D10, D12, D16, E1, E2, E4, E5, E7,
E10, E13, E14, E15, E16, F1, F2, F15, F16,
G1, G4, G5, G6, G12, G13, G14, J11, K3,
K4, K15, L1, L2, L12, L15, L16, M1, M2, M3,
M4, M5, M12, M13, M15, M16, N1, N2, N7,
N10, N12, N14, P5, P12, R4, R5, R6, R11,
R12, R16, T2, T4, T5, T6, T11, T12, T13, T15
4256V/B/C, 160 I/O: A5, A12, A15, B5, B6,
B11, B12, B14, D4, D5, D12, E1, E4, E5,
E13, E15, E16, F1, F2, F15, G1, G5, G12,
G14, L1, L2, L12, L15, L16, M1, M2, M3,
M12, M16, N1, N12, N14, P5, R4, R5, R6,
R11, R12, R16, T4, T5, T12, T15
4384V/B/C: B5, B12, D5, D12, E1, E15,
E16, F2, L12, M1, M2, M16, N12, R5, R12,
T4
4512V/B/C: None
1. All grounds must be electrically connected at the board le v el. However, f or the purposes of I/O current loading, grounds are associated with
the bank shown.
2. Internal GNDs and I/O GNDs (Bank 0/1) are connected inside package.
3. VCCO balls connect to two power planes within the package, one for VCCO0 and one for VCCO1.
4. Pin orientation follows the conventional order from pin 1 marking of the top side view and counter-clockwise.
5. ispMACH 4384V/B/C pin 46 is tied to GND (Bank 0).
6. ispMACH 4128V only.
7. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order
ascending horizontally.
8. ispMACH 4128Z and 4256Z only. NC for ispMACH 4064Z.
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
45
ispMACH 4032V/B/C and 4064V/B/C Logic Signal Connections:
44-Pin TQFP
Pin Number Bank Number ispMACH 4032V/B/C ispMACH 4064V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP
1-TDI-TDI -
20A5A^5 A10 A^5
30A6A^6 A12 A^6
40A7A^7 A14 A^7
5 0 GND (Bank 0) - GND (Bank 0) -
6 0 VCCO (Bank 0) - VCCO (Bank 0) -
70A8A^8 B0 B^0
80A9A^9 B2 B^1
90A10 A^10 B4 B^2
10 - TCK - TCK -
11 - VCC - VCC -
12 - GND - GND -
13 0 A12 A^12 B8 B^4
14 0 A13 A^13 B10 B^5
15 0 A14 A^14 B12 B^6
16 0 A15 A^15 B14 B^7
17 1 CLK2/I - CLK2/I -
18 1 B0 B^0 C0 C^0
19 1 B1 B^1 C2 C^1
20 1 B2 B^2 C4 C^2
21 1 B3 B^3 C6 C^3
22 1 B4 B^4 C8 C^4
23 - TMS - TMS -
24 1 B5 B^5 C10 C^5
25 1 B6 B^6 C12 C^6
26 1 B7 B^7 C14 C^7
27 1 GND (Bank 1) - GND (Bank 1) -
28 1 VCCO (Bank 1) - VCCO (Bank 1) -
29 1 B8 B^8 D0 D^0
30 1 B9 B^9 D2 D^1
31 1 B10 B^10 D4 D^2
32 - TDO - TDO -
33 - VCC - VCC -
34 - GND - GND -
35 1 B12 B^12 D8 D^4
36 1 B13 B^13 D10 D^5
37 1 B14 B^14 D12 D^6
38 1 B15/GOE1 B^15 D14/GOE1 D^7
39 0 CLK0/I - CLK0/I -
40 0 A0/GOE0 A^0 A0/GOE0 A^0
41 0 A1 A^1 A2 A^1
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
46
42 0 A2 A^2 A4 A^2
43 0 A3 A^3 A6 A^3
44 0 A4 A^4 A8 A^4
ispMACH 4032V/B/C/Z and 4064V/B/C/Z Logic Signal Connections:
48-Pin TQFP
Pin
Number Bank
Number ispMACH 4032V/B/C ispMACH 4064V/B/C ispMACH 4064Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
1- TDI - TDI - TDI -
20 A5 A^5 A10 A^5 A8 A^5
30 A6 A^6 A12 A^6 A10 A^6
40 A7 A^7 A14 A^7 A11 A^7
5 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
6 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
70 A8 A^8 B0 B^0 B15 B^7
80 A9 A^9 B2 B^1 B12 B^6
90 A10 A^10 B4 B^2 B10 B^5
10 0 A11 A^11 B6 B^3 B8 B^4
11 - TCK - TCK - TCK -
12 - VCC - VCC - VCC -
13 - GND - GND - GND -
14 0 A12 A^12 B8 B^4 B6 B^3
15 0 A13 A^13 B10 B^5 B4 B^2
16 0 A14 A^14 B12 B^6 B2 B^1
17 0 A15 A^15 B14 B^7 B0 B^0
18 0 CLK1/I - CLK1/I - CLK1/I -
19 1 CLK2/I - CLK2/I - CLK2/I -
20 1 B0 B^0 C0 C^0 C0 C^0
21 1 B1 B^1 C2 C^1 C1 C^1
22 1 B2 B^2 C4 C^2 C2 C^2
23 1 B3 B^3 C6 C^3 C4 C^3
24 1 B4 B^4 C8 C^4 C6 C^4
25 - TMS - TMS - TMS -
26 1 B5 B^5 C10 C^5 C8 C^5
27 1 B6 B^6 C12 C^6 C10 C^6
28 1 B7 B^7 C14 C^7 C11 C^7
29 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
30 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
31 1 B8 B^8 D0 D^0 D15 D^7
32 1 B9 B^9 D2 D^1 D12 D^6
ispMACH 4032V/B/C and 4064V/B/C Logic Signal Connections:
44-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4032V/B/C ispMACH 4064V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
47
33 1 B10 B^10 D4 D^2 D10 D^5
34 1 B11 B^11 D6 D^3 D8 D^4
35 - TDO - TDO - TDO -
36 - VCC - VCC - VCC -
37 - GND - GND - GND -
38 1 B12 B^12 D8 D^4 D6 D^3
39 1 B13 B^13 D10 D^5 D4 D^2
40 1 B14 B^14 D12 D^6 D2 D^1
41 1 B15/GOE1 B^15 D14/GOE1 D^7 D0/GOE1 D^0
42 1 CLK3/I - CLK3/I - CLK3/I -
43 0 CLK0/I - CLK0/I - CLK0/I -
44 0 A0/GOE0 A^0 A0/GOE0 A^0 A0/GOE0 A^0
45 0 A1 A^1 A2 A^1 A1 A^1
46 0 A2 A^2 A4 A^2 A2 A^2
47 0 A3 A^3 A6 A^3 A4 A^3
48 0 A4 A^4 A8 A^4 A6 A^4
ispMACH 4032Z and 4064Z Logic Signal Connections: 56-Ball csBGA
Ball Number Bank Number ispMACH 4032Z ispMACH 4064Z
GLB/MC/Pad ORP GLB/MC/Pad ORP
B1 - TDI - TDI -
C3 0 A5 A^5 A8 A^5
C1 0 A6 A^6 A10 A^6
D1 0 A7 A^7 A11 A^7
D3 0 GND (Bank 0) - GND (Bank 0) -
E3 0 NC -I-
E1 0 NC -I-
F3 0 VCCO (Bank 0) - VCCO (Bank 0) -
F1 0 A8 A^8 B15 B^7
G3 0 A9 A^9 B12 B^6
G1 0 A10 A^10 B10 B^5
H1 0 A11 A^11 B8 B^4
J1 0 NC -I-
K1 - TCK - TCK -
K2 - VCC - VCC -
H3 - GND - GND -
K3 - I -
K4 0 A12 A^12 B6 B^3
H4 0 A13 A^13 B4 B^2
H5 0 A14 A^14 B2 B^1
ispMACH 4032V/B/C/Z and 4064V/B/C/Z Logic Signal Connections:
48-Pin TQFP (Cont.)
Pin
Number Bank
Number ispMACH 4032V/B/C ispMACH 4064V/B/C ispMACH 4064Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
48
K5 0 A15 A^15 B0 B^0
H6 0 CLK1/I - CLK1/I -
K6 1 CLK2/I - CLK2/I -
H7 1 B0 B^0 C0 C^0
K7 1 B1 B^1 C1 C^1
K8 1 B2 B^2 C2 C^2
K9 1 B3 B^3 C4 C^3
K10 1 B4 B^4 C6 C^4
J10 - TMS - TMS -
H8 1 B5 B^5 C8 C^5
H10 1 B6 B^6 C10 C^6
G10 1 B7 B^7 C11 C^7
G8 1 GND (Bank 1) - GND (Bank 1) -
F8 1 NC -I-
F10 1 NC - I -
E8 1 VCCO (Bank 1) - VCCO (Bank 1) -
E10 1 B8 B^8 D15 D^7
D8 1 B9 B^9 D12 D^6
D10 1 B10 B^10 D10 D^5
C10 1 B11 B^11 D8 D^4
B10 1 NC - I -
A10 - TDO - TDO -
A9 - VCC - VCC -
C8 - GND - GND -
A8 1 NC -I-
A7 1 B12 B^12 D6 D^3
C7 1 B13 B^13 D4 D^2
C6 1 B14 B^14 D2 D^1
A6 1 B15/GOE1 B^15 D0/GOE1 D^0
C5 1 CLK3/I - CLK3/I -
A5 0 CLK0/I - CLK0/I -
C4 0 A0/GOE0 A^0 A0/GOE0 A^0
A4 0 A1 A^1 A1 A^1
A3 0 A2 A^2 A2 A^2
A2 0 A3 A^3 A4 A^3
A1 0 A4 A^4 A6 A^4
ispMACH 4032Z and 4064Z Logic Signal Connections: 56-Ball csBGA (Cont.)
Ball Number Bank Number ispMACH 4032Z ispMACH 4064Z
GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
49
ispMACH 4064V/B/C/Z, 4128V/B/C/Z, 4256V/B/C/Z Logic Signal Connections:
100-Pin TQFP
Pin Number Bank
Number ispMACH 4064V/B/C/Z ispMACH 4128V/B/C/Z ispMACH 4256V/B/C/Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
1-GND-GND - GND -
2-TDI-TDI - TDI -
30A8A^8 B0 B^0 C12 C^3
40A9A^9 B2 B^1 C10 C^2
50A10 A^10 B4 B^2 C6 C^1
60A11 A^11 B6 B^3 C2 C^0
7 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
80A12 A^12 B8 B^4 D12 D^3
90A13 A^13 B10 B^5 D10 D^2
10 0 A14 A^14 B12 B^6 D6 D^1
11 0 A15 A^15 B13 B^7 D4 D^0
12* 0 I - I - I -
13 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
14 0 B15 B^15 C14 C^7 E4 E^0
15 0 B14 B^14 C12 C^6 E6 E^1
16 0 B13 B^13 C10 C^5 E10 E^2
17 0 B12 B^12 C8 C^4 E12 E^3
18 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
19 0 B11 B^11 C6 C^3 F2 F^0
20 0 B10 B^10 C5 C^2 F6 F^1
21 0 B9 B^9 C4 C^1 F10 F^2
22 0 B8 B^8 C2 C^0 F12 F^3
23* 0 I - I - I -
24 - TCK - TCK - TCK -
25 - VCC - VCC - VCC -
26 - GND - GND - GND -
27* 0 I - I - I -
28 0 B7 B^7 D13 D^7 G12 G^3
29 0 B6 B^6 D12 D^6 G10 G^2
30 0 B5 B^5 D10 D^5 G6 G^1
31 0 B4 B^4 D8 D^4 G2 G^0
32 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
33 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
34 0 B3 B^3 D6 D^3 H12 H^3
35 0 B2 B^2 D4 D^2 H10 H^2
36 0 B1 B^1 D2 D^1 H6 H^1
37 0 B0 B^0 D0 D^0 H2 H^0
38 0 CLK1/I - CLK1/I - CLK1/I -
39 1 CLK2/I - CLK2/I - CLK2/I -
40 - VCC - VCC - VCC -
41 1 C0 C^0 E0 E^0 I2 I^0
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
50
42 1 C1 C^1 E2 E^1 I6 I^1
43 1 C2 C^2 E4 E^2 I10 I^2
44 1 C3 C^3 E6 E^3 I12 I^3
45 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
46 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
47 1 C4 C^4 E8 E^4 J2 J^0
48 1 C5 C^5 E10 E^5 J6 J^1
49 1 C6 C^6 E12 E^6 J10 J^2
50 1 C7 C^7 E14 E^7 J12 J^3
51 - GND - GND - GND -
52 - TMS - TMS - TMS -
53 1 C8 C^8 F0 F^0 K12 K^3
54 1 C9 C^9 F2 F^1 K10 K^2
55 1 C10 C^10 F4 F^2 K6 K^1
56 1 C11 C^11 F6 F^3 K2 K^0
57 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
58 1 C12 C^12 F8 F^4 L12 L^3
59 1 C13 C^13 F10 F^5 L10 L^2
60 1 C14 C^14 F12 F^6 L6 L^1
61 1 C15 C^15 F13 F^7 L4 L^0
62* 1 I - I - I -
63 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
64 1 D15 D^15 G14 G^7 M4 M^0
65 1 D14 D^14 G12 G^6 M6 M^1
66 1 D13 D^13 G10 G^5 M10 M^2
67 1 D12 D^12 G8 G^4 M12 M^3
68 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
69 1 D11 D^11 G6 G^3 N2 N^0
70 1 D10 D^10 G5 G^2 N6 N^1
71 1 D9 D^9 G4 G^1 N10 N^2
72 1 D8 D^8 G2 G^0 N12 N^3
73* 1 I - I - I -
74 - TDO - TDO - TDO -
75 - VCC - VCC - VCC -
76 - GND - GND - GND -
77* 1 I - I - I -
78 1 D7 D^7 H13 H^7 O12 O^3
79 1 D6 D^6 H12 H^6 O10 O^2
80 1 D5 D^5 H10 H^5 O6 O^1
81 1 D4 D^4 H8 H^4 O2 O^0
82 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
ispMACH 4064V/B/C/Z, 4128V/B/C/Z, 4256V/B/C/Z Logic Signal Connections:
100-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4064V/B/C/Z ispMACH 4128V/B/C/Z ispMACH 4256V/B/C/Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
51
83 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
84 1 D3 D^3 H6 H^3 P12 P^3
85 1 D2 D^2 H4 H^2 P10 P^2
86 1 D1 D^1 H2 H^1 P6 P^1
87 1 D0/GOE1 D^0 H0/GOE1 H^0 P2/OE1 P^0
88 1 CLK3/I - CLK3/I - CLK3/I -
89 0 CLK0/I - CLK0/I - CLK0/I -
90 - VCC - VCC - VCC -
91 0 A0/GOE0 A^0 A0/GOE0 A^0 A2/GOE0 A^0
92 0 A1 A^1 A2 A^1 A6 A^1
93 0 A2 A^2 A4 A^2 A10 A^2
94 0 A3 A^3 A6 A^3 A12 A^3
95 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
96 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
97 0 A4 A^4 A8 A^4 B2 B^0
98 0 A5 A^5 A10 A^5 B6 B^1
99 0 A6 A^6 A12 A^6 B10 B^2
100 0 A7 A^7 A14 A^7 B12 B^3
*This pin is input only.
ispMACH 4128V/B/C Logic Signal Connections: 128-Pin TQFP
Pin Number Bank Number ispMACH 4128V/B/C
GLB/MC/Pad ORP
10GND -
20TDI -
3 0 VCCO (Bank 0) -
40B0B^0
50B1B^1
60B2B^2
70B4B^3
80B5B^4
90B6B^5
10 0 GND (Bank 0) -
11 0 B8 B^6
12 0 B9 B^7
13 0 B10 B^8
14 0 B12 B^9
15 0 B13 B^10
16 0 B14 B^11
17 0 VCCO (Bank 0) -
18 0 C14 C^11
ispMACH 4064V/B/C/Z, 4128V/B/C/Z, 4256V/B/C/Z Logic Signal Connections:
100-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4064V/B/C/Z ispMACH 4128V/B/C/Z ispMACH 4256V/B/C/Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
52
19 0 C13 C^10
20 0 C12 C^9
21 0 C10 C^8
22 0 C9 C^7
23 0 C8 C^6
24 0 GND (Bank 0) -
25 0 C6 C^5
26 0 C5 C^4
27 0 C4 C^3
28 0 C2 C^2
29 0 C0 C^0
30 0 VCCO (Bank 0) -
31 0 TCK -
32 0 VCC -
33 0 GND -
34 0 D14 D^11
35 0 D13 D^10
36 0 D12 D^9
37 0 D10 D^8
38 0 D9 D^7
39 0 D8 D^6
40 0 GND (Bank 0) -
41 0 VCCO (Bank 0) -
42 0 D6 D^5
43 0 D5 D^4
44 0 D4 D^3
45 0 D2 D^2
46 0 D1 D^1
47 0 D0 D^0
48 0 CLK1/I -
49 1 GND (Bank 1) -
50 1 CLK2/I -
51 1 VCC -
52 1 E0 E^0
53 1 E1 E^1
54 1 E2 E^2
55 1 E4 E^3
56 1 E5 E^4
57 1 E6 E^5
58 1 VCCO (Bank 1) -
59 1 GND (Bank 1) -
60 1 E8 E^6
61 1 E9 E^7
ispMACH 4128V/B/C Logic Signal Connections: 128-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V/B/C
GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
53
62 1 E10 E^8
63 1 E12 E^9
64 1 E14 E^11
65 1 GND -
66 1 TMS -
67 1 VCCO (Bank 1) -
68 1 F0 F^0
69 1 F1 F^1
70 1 F2 F^2
71 1 F4 F^3
72 1 F5 F^4
73 1 F6 F^5
74 1 GND (Bank 1) -
75 1 F8 F^6
76 1 F9 F^7
77 1 F10 F^8
78 1 F12 F^9
79 1 F13 F^10
80 1 F14 F^11
81 1 VCCO (Bank 1) -
82 1 G14 G^11
83 1 G13 G^10
84 1 G12 G^9
85 1 G10 G^8
86 1 G9 G^7
87 1 G8 G^6
88 1 GND (Bank 1) -
89 1 G6 G^5
90 1 G5 G^4
91 1 G4 G^3
92 1 G2 G^2
93 1 G0 G^0
94 1 VCCO (Bank 1) -
95 1 TDO -
96 1 VCC -
97 1 GND -
98 1 H14 H^11
99 1 H13 H^10
100 1 H12 H^9
101 1 H10 H^8
102 1 H9 H^7
103 1 H8 H^6
104 1 GND (Bank 1) -
ispMACH 4128V/B/C Logic Signal Connections: 128-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V/B/C
GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
54
105 1 VCCO (Bank 1) -
106 1 H6 H^5
107 1 H5 H^4
108 1 H4 H^3
109 1 H2 H^2
110 1 H1 H^1
111 1 H0/GOE1 H^0
112 1 CLK3/I -
113 0 GND (Bank 0) -
114 0 CLK0/I -
115 0 VCC -
116 0 A0/GOE0 A^0
117 0 A1 A^1
118 0 A2 A^2
119 0 A4 A^3
120 0 A5 A^4
121 0 A6 A^5
122 0 VCCO (Bank 0) -
123 0 GND (Bank 0) -
124 0 A8 A^6
125 0 A9 A^7
126 0 A10 A^8
127 0 A12 A^9
128 0 A14 A^11
ispMACH 4064Z, 4128Z and 4256Z Logic Signal Connections:
132-Ball csBGA
Ball Number Bank Number ispMACH 4064Z ispMACH 4128Z ispMACH 4256Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
B1 - GND - GND - GND -
B2 - TDI - TDI - TDI -
C1 0 NC - VCCO (Bank 0) -VCCO (Bank 0) -
C3 0 NC - B0 B^0 C12 C^6
C2 0 A8 A^8 B1 B^1 C10 C^5
D1 0 A9 A^9 B2 B^2 C8 C^4
D3 0 A10 A^10 B4 B^3 C6 C^3
D2 0 A11 A^11 B5 B^4 C4 C^2
E1 0 NC B6 B^5 C2 C^1
E2 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
E3 0 NC - B8 B^6 D12 D^6
F2 0 A12 A^12 B9 B^7 D10 D^5
ispMACH 4128V/B/C Logic Signal Connections: 128-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V/B/C
GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
55
F1 0 A13 A^13 B10 B^8 D8 D^4
F3 0 A14 A^14 B12 B^9 D6 D^3
G1 0 A15 A^15 B13 B^10 D4 D^2
G2 0 I - B14 B^11 D2 D^1
G3 0 VCCO (Bank 0) -VCCO (Bank 0) -VCCO (Bank 0) -
H2 0 NC - C14 C^11 E2 E^1
H1 0 B15 B^15 C13 C^10 E4 E^2
H3 0 B14 B^14 C12 C^9 E6 E^3
J1 0 B13 B^13 C10 C^8 E8 E^4
J2 0 B12 B^12 C9 C^7 E10 E^5
J3 0 NC - C8 C^6 E12 E^6
K2 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
K1 0 NC - C6 C^5 F2 F^1
K3 0 B11 B^11 C5 C^4 F4 F^2
L2 0 B10 B^10 C4 C^3 F6 F^3
L1 0 B9 B^9 C2 C^2 F8 F^4
L3 0 B8 B^8 C1 C^1 F10 F^5
M1 0 I - C0 C^0 F12 F^6
M2 0 NC - VCCO (Bank 0) -VCCO (Bank 0) -
N1 - TCK - TCK - TCK -
P1 - VCC - VCC - VCC -
P2 - GND - GND - GND -
N2 0 I - D14 D^11 G12 G^6
P3 0 B7 B^7 D13 D^10 G10 G^5
M3 0 B6 B^6 D12 D^9 G8 G^4
N3 0 B5 B^5 D10 D^8 G6 G^3
P4 0 B4 B^4 D9 D^7 G4 G^2
M4 0 NC - D8 D^6 G2 G^1
N4 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
P5 0 VCCO (Bank 0) -VCCO (Bank 0) -VCCO (Bank 0) -
N5 0 NC - D6 D^5 H12 H^6
M5 0 B3 B^3 D5 D^4 H10 H^5
N6 0 B2 B^2 D4 D^3 H8 H^4
P6 0 B1 B^1 D2 D^2 H6 H^3
M6 0 B0 B^0 D1 D^1 H4 H^2
P7 0 NC - D0 D^0 H2 H^1
N7 0 CLK1/I - CLK1/I - CLK1/I -
M7 1 CLK2/I - CLK2/I - CLK2/I -
N8 - VCC - VCC - VCC -
P8 1 NC-NC- I -
M8 1 NC - E0 E^0 I2 I^1
ispMACH 4064Z, 4128Z and 4256Z Logic Signal Connections:
132-Ball csBGA (Cont.)
Ball Number Bank Number ispMACH 4064Z ispMACH 4128Z ispMACH 4256Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
56
P9 1 C0 C^0 E1 E^1 I4 I^2
N9 1 C1 C^1 E2 E^2 I6 I^3
M9 1 C2 C^2 E4 E^3 I8 I^4
N10 1 C3 C^3 E5 E^4 I10 I^5
P10 1 NC - E6 E^5 I12 I^6
M10 1 VCCO (Bank 1) -VCCO (Bank 1) -VCCO (Bank 1) -
N11 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
P11 1 NC - E8 E^6 J2 J^1
M11 1 C4 C^4 E9 E^7 J4 J^2
P12 1 C5 C^5 E10 E^8 J6 J^3
N12 1 C6 C^6 E12 E^9 J8 J^4
P13 1 C7 C^7 E13 E^10 J10 J^5
P14 1 NC - E14 E^11 J12 J^6
N14 - GND - GND - GND -
N13 - TMS - TMS - TMS -
M14 1 NC - VCCO (Bank 1) -VCCO (Bank 1) -
M12 1 NC - F0 F^0 K12 K^6
M13 1 C8 C^8 F1 F^1 K10 K^5
L14 1 C9 C^9 F2 F^2 K8 K^4
L12 1 C10 C^10 F4 F^3 K6 K^3
L13 1 C11 C^11 F5 F^4 K4 K^2
K14 1 NC - F6 F^5 K2 K^1
K13 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
K12 1 NC - F8 F^6 L12 L^6
J13 1 C12 C^12 F9 F^7 L10 L^5
J14 1 C13 C^13 F10 F^8 L8 L^4
J12 1 C14 C^14 F12 F^9 L6 L^3
H14 1 C15 C^15 F13 F^10 L4 L^2
H13 1 I - F14 F^11 L2 L^1
H12 1 VCCO (Bank 1) -VCCO (Bank 1) -VCCO (Bank 1) -
G13 1 NC - G14 G^11 M2 M^1
G14 1 NC - G13 G^10 M4 M^2
G12 1 D15 D^15 G12 G^9 M6 M^3
F14 1 D14 D^14 G10 G^8 M8 M^4
F13 1 D13 D^13 G9 G^7 M10 M^5
F12 1 D12 D^12 G8 G^6 M12 M^6
E13 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
E14 1 NC - G6 G^5 N2 N^1
E12 1 D11 D^11 G5 G^4 N4 N^2
D13 1 D10 D^10 G4 G^3 N6 N^3
D14 1 D9 D^9 G2 G^2 N8 N^4
ispMACH 4064Z, 4128Z and 4256Z Logic Signal Connections:
132-Ball csBGA (Cont.)
Ball Number Bank Number ispMACH 4064Z ispMACH 4128Z ispMACH 4256Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
57
D12 1 D8 D^8 G1 G^1 N10 N^5
C14 1 I - G0 G^0 N12 N^6
C13 1 NC - VCCO (Bank 1) -VCCO (Bank 1) -
B14 - TDO - TDO - TDO -
A14 - VCC - VCC - VCC -
A13 - GND - GND - GND -
B13 1 NC - H14 H^11 O12 O^6
A12 1 I - H13 H^10 O10 O^5
C12 1 D7 D^7 H12 H^9 O8 O^4
B12 1 D6 D^6 H10 H^8 O6 O^3
A11 1 D5 D^5 H9 H^7 O4 O^2
C11 1 D4 D^4 H8 H^6 O2 O^1
B11 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
A10 1 VCCO (Bank 1) -VCCO (Bank 1) -VCCO (Bank 1) -
B10 1 NC - H6 H^5 P12 P^6
C10 1 NC - H5 H^4 P10 P^5
B9 1 D3 D^3 H4 H^3 P8 P^4
A9 1 D2 D^2 H2 H^2 P6 P^3
C9 1 D1 D^1 H1 H^1 P4 P^2
A8 1 D0/GOE1 D^0 H0/GOE1 H^0 P2/GOE1 P^1
B8 1 CLK3/I - CLK3/I - CLK3/I -
C8 0 CLK0/I - CLK0/I - CLK0/I -
B7 - VCC - VCC - VCC -
A7 0 NC-NC- I -
C7 0 A0/GOE0 - A0/GOE0 A^0 A2/GOE0 A^1
A6 0 A1 A^0 A1 A^1 A4 A^2
B6 0 A2 A^1 A2 A^2 A6 A^3
C6 0 A3 A^2 A4 A^3 A8 A^4
B5 0 NC A^3 A5 A^4 A10 A^5
A5 0 NC - A6 A^5 A12 A^6
C5 0 VCCO (Bank 0) -VCCO (Bank 0) -VCCO (Bank 0) -
B4 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
A4 0 NC - A8 A^6 B2 B^1
C4 0 A4 A^4 A9 A^7 B4 B^2
A3 0 A5 A^5 A10 A^8 B6 B^3
B3 0 A6 A^6 A12 A^9 B8 B^4
A2 0 A7 A^7 A13 A^10 B10 B^5
A1 0 NC - A14 A^11 B12 B^6
ispMACH 4064Z, 4128Z and 4256Z Logic Signal Connections:
132-Ball csBGA (Cont.)
Ball Number Bank Number ispMACH 4064Z ispMACH 4128Z ispMACH 4256Z
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
58
ispMACH 4128V and 4256V Logic Signal Connections: 144-Pin TQFP
Pin Number Bank Number ispMACH 4128V ispMACH 4256V
GLB/MC/Pad ORP GLB/MC/Pad ORP
1-GND-GND -
2-TDI-TDI -
3 0 VCCO (Bank 0) - VCCO (Bank 0) -
40B0B^0 C12 C^6
50B1B^1 C10 C^5
60B2B^2 C8 C^4
70B4B^3 C6 C^3
80B5B^4 C4 C^2
90B6B^5 C2 C^1
10 0 GND (Bank 0) - GND (Bank 0) -
11 0 B8 B^6 D14 D^7
12 0 B9 B^7 D12 D^6
13 0 B10 B^8 D10 D^5
14 0 B12 B^9 D8 D^4
15 0 B13 B^10 D6 D^3
16 0 B14 B^11 D4 D^2
17 - NC2-I
2-
18 0 GND (Bank 0)1- NC1-
19 0 VCCO (Bank 0) - VCCO (Bank 0) -
20 0 NC2-I
2-
21 0 C14 C^11 E2 E^1
22 0 C13 C^10 E4 E^2
23 0 C12 C^9 E6 E^3
24 0 C10 C^8 E8 E^4
25 0 C9 C^7 E10 E^5
26 0 C8 C^6 E12 E^6
27 0 GND (Bank 0) - GND (Bank 0) -
28 0 C6 C^5 F2 F^1
29 0 C5 C^4 F4 F^2
30 0 C4 C^3 F6 F^3
31 0 C2 C^2 F8 F^4
32 0 C1 C^1 F10 F^5
33 0 C0 C^0 F12 F^6
34 0 VCCO (Bank 0) - VCCO (Bank 0) -
35 - TCK - TCK -
36 - VCC - VCC -
37 - GND - GND -
38 - NC2-I
2-
39 0 D14 D^11 G12 G^6
40 0 D13 D^10 G10 G^5
41 0 D12 D^9 G8 G^4
42 0 D10 D^8 G6 G^3
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
59
43 0 D9 D^7 G4 G^2
44 0 D8 D^6 G2 G^1
45 - NC2-I
2-
46 0 GND (Bank 0) - GND (Bank 0) -
47 0 VCCO (Bank 0) - VCCO (Bank 0) -
48 0 D6 D^5 H12 H^6
49 0 D5 D^4 H10 H^5
50 0 D4 D^3 H8 H^4
51 0 D2 D^2 H6 H^3
52 0 D1 D^1 H4 H^2
53 0 D0 D^0 H2 H^1
54 0 CLK1/I - CLK1/I -
55 1 GND (Bank 1) - GND (Bank 1) -
56 1 CLK2/I - CLK2/I -
57 - VCC - VCC -
58 1 E0 E^0 I2 I^1
59 1 E1 E^1 I4 I^2
60 1 E2 E^2 I6 I^3
61 1 E4 E^3 I8 I^4
62 1 E5 E^4 I10 I^5
63 1 E6 E^5 I12 I^6
64 1 VCCO (Bank 1) - VCCO (Bank 1) -
65 1 GND (Bank 1) - GND (Bank 1) -
66 1 E8 E^6 J2 J^1
67 1 E9 E^7 J4 J^2
68 1 E10 E^8 J6 J^3
69 1 E12 E^9 J8 J^4
70 1 E13 E^10 J10 J^5
71 1 E14 E^11 J12 J^6
72 - NC2-I
2-
73 - GND - GND -
74 - TMS - TMS -
75 1 VCCO (Bank 1) - VCCO (Bank 1) -
76 1 F0 F^0 K12 K^6
77 1 F1 F^1 K10 K^5
78 1 F2 F^2 K8 K^4
79 1 F4 F^3 K6 K^3
80 1 F5 F^4 K4 K^2
81 1 F6 F^5 K2 K^1
82 1 GND (Bank 1) - GND (Bank 1) -
83 1 F8 F^6 L14 L^7
84 1 F9 F^7 L12 L^6
85 1 F10 F^8 L10 L^5
ispMACH 4128V and 4256V Logic Signal Connections: 144-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V ispMACH 4256V
GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
60
86 1 F12 F^9 L8 L^4
87 1 F13 F^10 L6 L^3
88 1 F14 F^11 L4 L^2
89 - NC2-I
2-
90 1 GND (Bank 1)1- NC1-
91 1 VCCO (Bank 1) - VCCO (Bank 1) -
92 - NC2-I
2-
93 1 G14 G^11 M2 M^1
94 1 G13 G^10 M4 M^2
95 1 G12 G^9 M6 M^3
96 1 G10 G^8 M8 M^4
97 1 G9 G^7 M10 M^5
98 1 G8 G^6 M12 M^6
99 1 GND (Bank 1) - GND (Bank 1) -
100 1 G6 G^5 N2 N^1
101 1 G5 G^4 N4 N^2
102 1 G4 G^3 N6 N^3
103 1 G2 G^2 N8 N^4
104 1 G1 G^1 N10 N^5
105 1 G0 G^0 N12 N^6
106 1 VCCO (Bank 1) - VCCO (Bank 1) -
107 - TDO - TDO -
108 - VCC - VCC -
109 - GND - GND -
110 - NC2-I
2-
111 1 H14 H^11 O12 O^6
112 1 H13 H^10 O10 O^5
113 1 H12 H^9 O8 O^4
114 1 H10 H^8 O6 O^3
115 1 H9 H^7 O4 O^2
116 1 H8 H^6 O2 O^1
117 - NC2-I
2-
118 1 GND (Bank 1) - GND (Bank 1) -
119 1 VCCO (Bank 1) - VCCO (Bank 1) -
120 1 H6 H^5 P12 P^6
121 1 H5 H^4 P10 P^5
122 1 H4 H^3 P8 P^4
123 1 H2 H^2 P6 P^3
124 1 H1 H^1 P4 P^2
125 1 H0/GOE1 H^0 P2/GOE1 P^1
126 1 CLK3/I - CLK3/I -
127 0 GND (Bank 0) - GND (Bank 0) -
128 0 CLK0/I - CLK0/1 -
ispMACH 4128V and 4256V Logic Signal Connections: 144-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V ispMACH 4256V
GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
61
129 - VCC - VCC -
130 0 A0/GOE0 A^0 A2/GOE0 A^1
131 0 A1 A^1 A4 A^2
132 0 A2 A^2 A6 A^3
133 0 A4 A^3 A8 A^4
134 0 A5 A^4 A10 A^5
135 0 A6 A^5 A12 A^6
136 0 VCCO (Bank 0) - VCCO (Bank 0) -
137 0 GND (Bank 0) - GND (Bank 0) -
138 0 A8 A^6 B2 B^1
139 0 A9 A^7 B4 B^2
140 0 A10 A^8 B6 B^3
141 0 A12 A^9 B8 B^4
142 0 A13 A^10 B10 B^5
143 0 A14 A^11 B12 B^6
144 - NC2-I
2-
1. For device migration considerations, these NC pins are GND pins for I/O banks in ispMACH 4128V devices.
2. For device migration considerations, these NC pins are input signal pins in ispMACH 4256V devices.
ispMACH 4256V/B/C/Z, 4384V/B/C, 4512V/B/C, Logic Signal Connections:
176-Pin TQFP
Pin Number Bank
Number ispMACH 4256V/B/C/Z ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
1-NC-NC-NC-
2-GND - GND - GND -
3-TDI - TDI - TDI -
4 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
50C14 C^7 C14 C^7 C14 C^7
60C12 C^6 C12 C^6 C12 C^6
70C10 C^5 C10 C^5 C10 C^5
80C8C^4 C8 C^4 C8 C^4
90C6C^3 C6 C^3 C6 C^3
10 0 C4 C^2 C4 C^2 C4 C^2
11 0 C2 C^1 C2 C^1 C2 C^1
12 0 C0 C^0 C0 C^0 C0 C^0
13 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
14 0 D14 D^7 E14 E^7 G14 G^7
15 0 D12 D^6 E12 E^6 G12 G^6
16 0 D10 D^5 E10 E^5 G10 G^5
17 0 D8 D^4 E8 E^4 G8 G^4
18 0 D6 D^3 E6 E^3 G6 G^3
ispMACH 4128V and 4256V Logic Signal Connections: 144-Pin TQFP (Cont.)
Pin Number Bank Number ispMACH 4128V ispMACH 4256V
GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
62
19 0 D4 D^2 E4 E^2 G4 G^2
20 0 D2 D^1 E2 E^1 G2 G^1
21 0 D0 D^0 E0 E^0 G0 G^0
22 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
23 0 E0 E^0 H0 H^0 J0 J^0
24 0 E2 E^1 H2 H^1 J2 J^1
25 0 E4 E^2 H4 H^2 J4 J^2
26 0 E6 E^3 H6 H^3 J6 J^3
27 0 E8 E^4 H8 H^4 J8 J^4
28 0 E10 E^5 H10 H^5 J10 J^5
29 0 E12 E^6 H12 H^6 J12 J^6
30 0 E14 E^7 H14 H^7 J14 J^7
31 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
32 0 F0 F^0 J0 J^0 N0 N^0
33 0 F2 F^1 J2 J^1 N2 N^1
34 0 F4 F^2 J4 J^2 N4 N^2
35 0 F6 F^3 J6 J^3 N6 N^3
36 0 F8 F^4 J8 J^4 N8 N^4
37 0 F10 F^5 J10 J^5 N10 N^5
38 0 F12 F^6 J12 J^6 N12 N^6
39 0 F14 F^7 J14 J^7 N14 N^7
40 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
41 - TCK - TCK - TCK -
42 - VCC - VCC - VCC -
43 - NC - NC-NC-
44 - NC - NC-NC-
45 - NC - NC-NC-
46 - GND - GND (Bank 0) - GND -
47 0 G14 G^7 K14 K^7 O14 O^7
48 0 G12 G^6 K12 K^6 O12 O^6
49 0 G10 G^5 K10 K^5 O10 O^5
50 0 G8 G^4 K8 K^4 O8 O^4
51 0 G6 G^3 K6 K^3 O6 O^3
52 0 G4 G^2 K4 K^2 O4 O^2
53 0 G2 G^1 K2 K^1 O2 O^1
54 0 G0 G^0 K0 K^0 O0 O^0
55 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
56 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
57 0 H14 H^7 L14 L^7 P14 P^7
58 0 H12 H^6 L12 L^6 P12 P^6
59 0 H10 H^5 L10 L^5 P10 P^5
ispMACH 4256V/B/C/Z, 4384V/B/C, 4512V/B/C, Logic Signal Connections:
176-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4256V/B/C/Z ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
63
60 0 H8 H^4 L8 L^4 P8 P^4
61 0 H6 H^3 L6 L^3 P6 P^3
62 0 H4 H^2 L4 L^2 P4 P^2
63 0 H2 H^1 L2 L^1 P2 P^1
64 0 H0 H^0 L0 L^0 P0 P^0
65 - GND - GND - GND -
66 0 CLK1/I - CLK1/I - CLK1/I -
67 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
68 1 CLK2/I - CLK2/I - CLK2/I -
69 - VCC - VCC - VCC -
70 1 I0 I^0 M0 M^0 AX0 AX^0
71 1 I2 I^1 M2 M^1 AX2 AX^1
72 1 I4 I^2 M4 M^2 AX4 AX^2
73 1 I6 I^3 M6 M^3 AX6 AX^3
74 1 I8 I^4 M8 M^4 AX8 AX^4
75 1 I10 I^5 M10 M^5 AX10 AX^5
76 1 I12 I^6 M12 M^6 AX12 AX^6
77 1 I14 I^7 M14 M^7 AX14 AX^7
78 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
79 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
80 1 J0 J^0 N0 N^0 BX0 BX^0
81 1 J2 J^1 N2 N^1 BX2 BX^1
82 1 J4 J^2 N4 N^2 BX4 BX^2
83 1 J6 J^3 N6 N^3 BX6 BX^3
84 1 J8 J^4 N8 N^4 BX8 BX^4
85 1 J10 J^5 N10 N^5 BX10 BX^5
86 1 J12 J^6 N12 N^6 BX12 BX^6
87 1 J14 J^7 N14 N^7 BX14 BX^7
88 - VCC - VCC - VCC -
89 - NC - NC-NC-
90 - GND - GND - GND -
91 - TMS - TMS - TMS -
92 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
93 1 K14 K^7 O14 O^7 CX14 CX^7
94 1 K12 K^6 O12 O^6 CX12 CX^6
95 1 K10 K^5 O10 O^5 CX10 CX^5
96 1 K8 K^4 O8 O^4 CX8 CX^4
97 1 K6 K^3 O6 O^3 CX6 CX^3
98 1 K4 K^2 O4 O^2 CX4 CX^2
99 1 K2 K^1 O2 O^1 CX2 CX^1
100 1 K0 K^0 O0 O^0 CX0 CX^0
ispMACH 4256V/B/C/Z, 4384V/B/C, 4512V/B/C, Logic Signal Connections:
176-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4256V/B/C/Z ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
64
101 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
102 1 L14 L^7 AX14 AX^7 GX14 GX^7
103 1 L12 L^6 AX12 AX^6 GX12 GX^6
104 1 L10 L^5 AX10 AX^5 GX10 GX^5
105 1 L8 L^4 AX8 AX^4 GX8 GX^4
106 1 L6 L^3 AX6 AX^3 GX6 GX^3
107 1 L4 L^2 AX4 AX^2 GX4 GX^2
108 1 L2 L^1 AX2 AX^1 GX2 GX^1
109 1 L0 L^0 AX0 AX^0 GX0 GX^0
110 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
111 1 M0 M^0 DX0 DX^0 JX0 JX^0
112 1 M2 M^1 DX2 DX^1 JX2 JX^1
113 1 M4 M^2 DX4 DX^2 JX4 JX^2
114 1 M6 M^3 DX6 DX^3 JX6 JX^3
115 1 M8 M^4 DX8 DX^4 JX8 JX^4
116 1 M10 M^5 DX10 DX^5 JX10 JX^5
117 1 M12 M^6 DX12 DX^6 JX12 JX^6
118 1 M14 M^7 DX14 DX^7 JX14 JX^7
119 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
120 1 N0 N^0 FX0 FX^0 NX0 NX^0
121 1 N2 N^1 FX2 FX^1 NX2 NX^1
122 1 N4 N^2 FX4 FX^2 NX4 NX^2
123 1 N6 N^3 FX6 FX^3 NX6 NX^3
124 1 N8 N^4 FX8 FX^4 NX8 NX^4
125 1 N10 N^5 FX10 FX^5 NX10 NX^5
126 1 N12 N^6 FX12 FX^6 NX12 NX^6
127 1 N14 N^7 FX14 FX^7 NX14 NX^7
128 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
129 - TDO - TDO - TDO -
130 - VCC - VCC - VCC -
131 - NC - NC-NC-
132 - NC - NC-NC-
133 - NC - NC-NC-
134 - GND - GND - GND -
135 1 O14 O^7 GX14 GX^7 OX14 OX^7
136 1 O12 O^6 GX12 GX^6 OX12 OX^6
137 1 O10 O^5 GX10 GX^5 OX10 OX^5
138 1 O8 O^4 GX8 GX^4 OX8 OX^4
139 1 O6 O^3 GX6 GX^3 OX6 OX^3
140 1 O4 O^2 GX4 GX^2 OX4 OX^2
141 1 O2 O^1 GX2 GX^1 OX2 OX^1
ispMACH 4256V/B/C/Z, 4384V/B/C, 4512V/B/C, Logic Signal Connections:
176-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4256V/B/C/Z ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
65
142 1 O0 O^0 GX0 GX^0 OX0 OX^0
143 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
144 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
145 1 P14 P^7 HX14 HX^7 PX14 PX^7
146 1 P12 P^6 HX12 HX^6 PX12 PX^6
147 1 P10 P^5 HX10 HX^5 PX10 PX^5
148 1 P8 P^4 HX8 HX^4 PX8 PX^4
149 1 P6 P^3 HX6 HX^3 PX6 PX^3
150 1 P4 P^2 HX4 HX^2 PX4 PX^2
151 1 P2/GOE1 P^1 HX2/GOE1 HX^1 PX2/GOE1 PX^1
152 1 P0 P^0 HX0 HX^0 PX0 PX^0
153 - GND - GND - GND -
154 1 CLK3/I - CLK3/I - CLK3/I -
155 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
156 0 CLK0/I - CLK0/I - CLK0/I -
157 - VCC - VCC - VCC -
158 0 A0 A^0 A0 A^0 A0 A^0
159 0 A2/GOE0 A^1 A2/GOE0 A^1 A2//GOE0 A^1
160 0 A4 A^2 A4 A^2 A4 A^2
161 0 A6 A^3 A6 A^3 A6 A^3
162 0 A8 A^4 A8 A^4 A8 A^4
163 0 A10 A^5 A10 A^5 A10 A^5
164 0 A12 A^6 A12 A^6 A12 A^6
165 0 A14 A^7 A14 A^7 A14 A^7
166 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
167 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
168 0 B0 B^0 B0 B^0 B0 B^0
169 0 B2 B^1 B2 B^1 B2 B^1
170 0 B4 B^2 B4 B^2 B4 B^2
171 0 B6 B^3 B6 B^3 B6 B^3
172 0 B8 B^4 B8 B^4 B8 B^4
173 0 B10 B^5 B10 B^5 B10 B^5
174 0 B12 B^6 B12 B^6 B12 B^6
175 0 B14 B^7 B14 B^7 B14 B^7
176 - VCC - VCC - VCC -
ispMACH 4256V/B/C/Z, 4384V/B/C, 4512V/B/C, Logic Signal Connections:
176-Pin TQFP (Cont.)
Pin Number Bank
Number ispMACH 4256V/B/C/Z ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
66
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
-- ----VCC-VCC-
-- GND - GND - GND - GND -
C3 - TDI - TDI - TDI - TDI -
- 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
B1 0 C14 C^7 C14 C^9 C14 C^7 C14 C^7
F5 0 C12 C^6 C12 C^8 C12 C^6 C12 C^6
D3 0 C10 C^5 C10 C^7 C10 C^5 C10 C^5
C1 0 C8 C^4 C9 C^6 C8 C^4 C8 C^4
C2 0 C6 C^3 C8 C^5 C6 C^3 C6 C^3
E3 0 C4 C^2 C6 C^4 C4 C^2 C4 C^2
D2 0 C2 C^1 C4 C^3 C2 C^1 C2 C^1
F6 0 C0 C^0 C2 C^2 C0 C^0 C0 C^0
D1 0 NC - C1 C^1 F6 F^3 H0 H^0
E2 0 NC - C0 C^0 F4 F^2 H4 H^1
E4 0 NC - NC - D6 D^3 F4 F^2
G5 0 NC - NC - D4 D^2 F6 F^3
E1 0 NC-NC-NC-F8F^4
- 0 - - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
- 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
F2 0 NC-NC-NC-F10F^5
F1 0 NC - NC - D2 D^1 F12 F^6
G1 0 NC - NC - D0 D^0 F14 F^7
G6 0 NC - D14 D^9 F2 F^1 H8 H^2
G4 0 NC - D12 D^8 F0 F^0 H12 H^3
H6 0 D14 D^7 D10 D^7 E14 E^7 G14 G^7
G3 0 D12 D^6 D9 D^6 E12 E^6 G12 G^6
H5 0 D10 D^5 D8 D^5 E10 E^5 G10 G^5
G2 0 D8 D^4 D6 D^4 E8 E^4 G8 G^4
H1 0 D6 D^3 D4 D^3 E6 E^3 G6 G^3
H2 0 D4 D^2 D2 D^2 E4 E^2 G4 G^2
H3 0 D2 D^1 D1 D^1 E2 E^1 G2 G^1
H4 0 D0 D^0 D0 D^0 E0 E^0 G0 G^0
- 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
- 0 - - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
J4 0 E0 E^0 E0 E^0 H0 H^0 J0 J^0
J3 0 E2 E^1 E1 E^1 H2 H^1 J2 J^1
J2 0 E4 E^2 E2 E^2 H4 H^2 J4 J^2
J1 0 E6 E^3 E4 E^3 H6 H^3 J6 J^3
K1 0 E8 E^4 E6 E^4 H8 H^4 J8 J^4
J5 0 E10 E^5 E8 E^5 H10 H^5 J10 J^5
K2 0 E12 E^6 E9 E^6 H12 H^6 J12 J^6
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
67
J6 0 E14 E^7 E10 E^7 H14 H^7 J14 J^7
K3 0 NC - E12 E^8 G0 G^0 I0 I^0
K4 0 NC - E14 E^9 G2 G^1 I4 I^1
L1 0 NC - NC - I14 I^7 K0 K^0
L2 0 NC - NC - I12 I^6 K2 K^1
M1 0 NC-NC-NC-K4K^2
- 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
- 0 - - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
M2 0 NC-NC-NC-K6K^3
N1 0 NC - NC - I10 I^5 K8 K^4
M3 0 NC - NC - I8 I^4 K10 K^5
M4 0 NC - F0 F^0 G4 G^2 I8 I^2
N2 0 NC - F1 F^1 G6 G^3 I12 I^3
K5 0 F0 F^0 F2 F^2 J0 J^0 N0 N^0
P1 0 F2 F^1 F4 F^3 J2 J^1 N2 N^1
K6 0 F4 F^2 F6 F^4 J4 J^2 N4 N^2
N3 0 F6 F^3 F8 F^5 J6 J^3 N6 N^3
L5 0 F8 F^4 F9 F^6 J8 J^4 N8 N^4
P2 0 F10 F^5 F10 F^7 J10 J^5 N10 N^5
L6 0 F12 F^6 F12 F^8 J12 J^6 N12 N^6
R1 0 F14 F^7 F14 F^9 J14 J^7 N14 N^7
- 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
P3 - TCK - TCK - TCK - TCK -
-- VCC - VCC - VCC - VCC -
-- GND - GND - GND - GND -
- 0 - - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
T2 0 NC - G14 G^9 I6 I^3 K12 K^6
M5 0 NC - G12 G^8 I4 I^2 K14 K^7
N4 0 G14 G^7 G10 G^7 K14 K^7 O14 O^7
T3 0 G12 G^6 G9 G^6 K12 K^6 O12 O^6
R3 0 G10 G^5 G8 G^5 K10 K^5 O10 O^5
M6 0 G8 G^4 G6 G^4 K8 K^4 O8 O^4
P4 0 G6 G^3 G4 G^3 K6 K^3 O6 O^3
L7 0 G4 G^2 G2 G^2 K4 K^2 O4 O^2
N5 0 G2 G^1 G1 G^1 K2 K^1 O2 O^1
M7 0 G0 G^0 G0 G^0 K0 K^0 O0 O^0
P5 0 NC - NC - G8 G^4 M0 M^0
R4 0 NC - NC - G10 G^5 M4 M^1
T4 0 NC-NC-NC-L0L^0
- 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
- 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
68
R5 0 NC-NC-NC-L4L^1
T5 0 NC - NC - I2 I^1 L8 L^2
R6 0 NC - NC - I0 I^0 L12 L^3
T6 0 NC - H14 H^9 G12 G^6 M8 M^2
N7 0 NC - H12 H^8 G14 G^7 M12 M^3
P7 0 H14 H^7 H10 H^7 L14 L^7 P14 P^7
R7 0 H12 H^6 H9 H^6 L12 L^6 P12 P^6
L8 0 H10 H^5 H8 H^5 L10 L^5 P10 P^5
T7 0 H8 H^4 H6 H^4 L8 L^4 P8 P^4
M8 0 H6 H^3 H4 H^3 L6 L^3 P6 P^3
N8 0 H4 H^2 H2 H^2 L4 L^2 P4 P^2
R8 0 H2 H^1 H1 H^1 L2 L^1 P2 P^1
P8 0 H0 H^0 H0 H^0 L0 L^0 P0 P^0
-- GND-GND - GND - GND -
T8 0 CLK1/I - CLK1/I - CLK1/I - CLK1/I -
- 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
N9 1 CLK2/I - CLK2/I - CLK2/I - CLK2/I -
-- VCC-VCC - VCC - VCC -
P9 1 I0 I^0 I0 I^0 M0 M^0 AX0 AX^0
R9 1 I2 I^1 I1 I^1 M2 M^1 AX2 AX^1
T9 1 I4 I^2 I2 I^2 M4 M^2 AX4 AX^2
T10 1 I6 I^3 I4 I^3 M6 M^3 AX6 AX^3
R10 1 I8 I^4 I6 I^4 M8 M^4 AX8 AX^4
M9 1 I10 I^5 I8 I^5 M10 M^5 AX10 AX^5
P10 1 I12 I^6 I9 I^6 M12 M^6 AX12 AX^6
L9 1 I14 I^7 I10 I^7 M14 M^7 AX14 AX^7
N10 1 NC - I12 I^8 BX14 BX^7 DX0 DX^0
T11 1 NC - I14 I^9 BX12 BX^6 DX4 DX^1
R11 1 NC - NC - P0 P^0 EX0 EX^0
T12 1 NC - NC - P2 P^1 EX4 EX^1
N12 1 NC - NC - NC - EX8 EX^2
- 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
- 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
R12 1 NC - NC - NC - EX12 EX^3
T13 1 NC - J0 J^0 BX10 BX^5 DX8 DX^2
P12 1 NC - J1 J^1 BX8 BX^4 DX12 DX^3
M10 1 J0 J^0 J2 J^2 N0 N^0 BX0 BX^0
R13 1 J2 J^1 J4 J^3 N2 N^1 BX2 BX^1
L10 1 J4 J^2 J6 J^4 N4 N^2 BX4 BX^2
T14 1 J6 J^3 J8 J^5 N6 N^3 BX6 BX^3
M11 1 J8 J^4 J9 J^6 N8 N^4 BX8 BX^4
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
69
R14 1 J10 J^5 J10 J^7 N10 N^5 BX10 BX^5
P13 1 J12 J^6 J12 J^8 N12 N^6 BX12 BX^6
N13 1 J14 J^7 J14 J^9 N14 N^7 BX14 BX^7
M12 1 NC - NC - P4 P^2 FX0 FX^0
T15 1 NC - NC - P6 P^3 FX2 FX^1
-- VCC-VCC - VCC - VCC -
-- GND-GND - GND - GND -
- 1 - - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
P14 - TMS - TMS - TMS - TMS -
- 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
L12 1 NC - NC - NC - FX4 FX^2
R16 1 NC - NC - P8 P^4 FX6 FX^3
N14 1 NC - NC - P10 P^5 FX8 FX^4
P15 1 K14 K^7 K14 K^9 O14 O^7 CX14 CX^7
L11 1 K12 K^6 K12 K^8 O12 O^6 CX12 CX^6
P16 1 K10 K^5 K10 K^7 O10 O^5 CX10 CX^5
K11 1 K8 K^4 K9 K^6 O8 O^4 CX8 CX^4
M14 1 K6 K^3 K8 K^5 O6 O^3 CX6 CX^3
K12 1 K4 K^2 K6 K^4 O4 O^2 CX4 CX^2
N15 1 K2 K^1 K4 K^3 O2 O^1 CX2 CX^1
N16 1 K0 K^0 K2 K^2 O0 O^0 CX0 CX^0
M15 1 NC - K1 K^1 BX6 BX^3 HX0 HX^0
M13 1 NC - K0 K^0 BX4 BX^2 HX4 HX^1
- 1 - - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
- 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
M16 1 NC - NC - NC - FX10 FX^5
L15 1 NC - NC - P12 P^6 FX12 FX^6
L16 1 NC - NC - P14 P^7 FX14 FX^7
J11 1 NC - L14 L^9 BX2 BX^1 HX8 HX^2
K15 1 NC - L12 L^8 BX0 BX^0 HX12 HX^3
J12 1 L14 L^7 L10 L^7 AX14 AX^7 GX14 GX^7
K13 1 L12 L^6 L9 L^6 AX12 AX^6 GX12 GX^6
K14 1 L10 L^5 L8 L^5 AX10 AX^5 GX10 GX^5
K16 1 L8 L^4 L6 L^4 AX8 AX^4 GX8 GX^4
J16 1 L6 L^3 L4 L^3 AX6 AX^3 GX6 GX^3
J15 1 L4 L^2 L2 L^2 AX4 AX^2 GX4 GX^2
H16 1 L2 L^1 L1 L^1 AX2 AX^1 GX2 GX^1
J13 1 L0 L^0 L0 L^0 AX0 AX^0 GX0 GX^0
- 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
- 1 - - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
J14 1 M0 M^0 M0 M^0 DX0 DX^0 JX0 JX^0
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
70
H15 1 M2 M^1 M1 M^1 DX2 DX^1 JX2 JX^1
H14 1 M4 M^2 M2 M^2 DX4 DX^2 JX4 JX^2
H13 1 M6 M^3 M4 M^3 DX6 DX^3 JX6 JX^3
G16 1 M8 M^4 M6 M^4 DX8 DX^4 JX8 JX^4
H12 1 M10 M^5 M8 M^5 DX10 DX^5 JX10 JX^5
G15 1 M12 M^6 M9 M^6 DX12 DX^6 JX12 JX^6
H11 1 M14 M^7 M10 M^7 DX14 DX^7 JX14 JX^7
F16 1 NC - M12 M^8 CX0 CX^0 IX0 IX^0
G13 1 NC - M14 M^9 CX2 CX^1 IX4 IX^1
G14 1 NC - NC - EX14 EX^7 KX0 KX^0
F15 1 NC - NC - EX12 EX^6 KX2 KX^1
E16 1 NC - NC - NC - KX4 KX^2
- 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
- 1 - - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
E15 1 NC - NC - NC - KX6 KX^3
G12 1 NC - NC - EX10 EX^5 KX8 KX^4
E13 1 NC - NC - EX8 EX^4 KX10 KX^5
D16 1 NC - N0 N^0 CX4 CX^2 IX8 IX^2
E14 1 NC - N1 N^1 CX6 CX^3 IX12 IX^3
G11 1 N0 N^0 N2 N^2 FX0 FX^0 NX0 NX^0
D15 1 N2 N^1 N4 N^3 FX2 FX^1 NX2 NX^1
F11 1 N4 N^2 N6 N^4 FX4 FX^2 NX4 NX^2
C16 1 N6 N^3 N8 N^5 FX6 FX^3 NX6 NX^3
F12 1 N8 N^4 N9 N^6 FX8 FX^4 NX8 NX^4
D14 1 N10 N^5 N10 N^7 FX10 FX^5 NX10 NX^5
C15 1 N12 N^6 N12 N^8 FX12 FX^6 NX12 NX^6
B16 1 N14 N^7 N14 N^9 FX14 FX^7 NX14 NX^7
- 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
C14 - TDO - TDO - TDO - TDO -
-- VCC - VCC - VCC - VCC -
-- GND - GND - GND - GND -
- 1 - - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
A15 1 NC - NC - EX6 EX^3 KX12 KX^6
B14 1 NC - NC - EX4 EX^2 KX14 KX^7
E12 1 O14 O^7 O14 O^9 GX14 GX^7 OX14 OX^7
A14 1 O12 O^6 O12 O^8 GX12 GX^6 OX12 OX^6
C13 1 O10 O^5 O10 O^7 GX10 GX^5 OX10 OX^5
D13 1 O8 O^4 O9 O^6 GX8 GX^4 OX8 OX^4
E11 1 O6 O^3 O8 O^5 GX6 GX^3 OX6 OX^3
B13 1 O4 O^2 O6 O^4 GX4 GX^2 OX4 OX^2
F10 1 O2 O^1 O4 O^3 GX2 GX^1 OX2 OX^1
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
71
C12 1 O0 O^0 O2 O^2 GX0 GX^0 OX0 OX^0
E10 1 NC - O1 O^1 CX8 CX^4 MX0 MX^0
A13 1 NC - O0 O^0 CX10 CX^5 MX4 MX^1
D12 1 NC - NC - NC - LX0 LX^0
- 1 GND (Bank 1) - GND (Bank 1) - GND (Bank 1) - GND (Bank 1) -
- 1 VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) - VCCO (Bank 1) -
B12 1 NC - NC - NC - LX4 LX^1
A12 1 NC - NC - EX2 EX^1 LX8 LX^2
B11 1 NC - NC - EX0 EX^0 LX12 LX^3
A11 1 NC - P14 P^9 CX12 CX^6 MX8 MX^2
D10 1 NC - P12 P^8 CX14 CX^7 MX12 MX^3
C10 1 P14 P^7 P10 P^7 HX14 HX^7 PX14 PX^7
B10 1 P12 P^6 P9 P6 HX12 HX^6 PX12 PX^6
A10 1 P10 P^5 P8 P^5 HX10 HX^5 PX10 PX^5
A9 1 P8 P^4 P6 P^4 HX8 HX^4 PX8 PX^4
F9 1 P6 P^3 P4 P^3 HX6 HX^3 PX6 PX^3
B9 1 P4 P^2 P2 P^2 HX4 HX^2 PX4 PX^2
E9 1 P2/GOE1 P^1 P1/GOE1 P^1 HX2/GOE1 HX^1 PX2/GOE1 PX^1
C9 1 P0 P^0 P0 P^0 HX0 HX^0 PX0 PX^0
-- GND-GND GND - GND -
D9 1 CLK3/I - CLK3/I - CLK3/I - CLK3/I -
- 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
B8 0 CLK0/I - CLK0/I - CLK0/I - CLK0/I -
-- VCC-VCC - VCC - VCC -
D8 0 A0 A^0 A0 A^0 A0 A^0 A0 A^0
C8 0 A2/GOE0 A^1 A1/GOE0 A^1 A2/GOE0 A^1 A2/GOE0 A^1
A8 0 A4 A^2 A2 A^2 A4 A^2 A4 A^2
A7 0 A6 A^3 A4 A^3 A6 A^3 A6 A^3
B7 0 A8 A^4 A6 A^4 A8 A^4 A8 A^4
E8 0 A10 A^5 A8 A^5 A10 A^5 A10 A^5
D7 0 A12 A^6 A9 A^6 A12 A^6 A12 A^6
F8 0 A14 A^7 A10 A^7 A14 A^7 A14 A^7
C7 0 NC - A12 A^8 F14 F^7 D0 D^0
A6 0 NC - A14 A^9 F12 F^6 D4 D^1
B6 0 NC - NC - D14 D^7 E0 E^0
A5 0 NC - NC - D12 D^6 E4 E^1
B5 0 NC-NC-NC-E8E^2
- 0 VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) - VCCO (Bank 0) -
- 0 GND (Bank 0) - GND (Bank 0) - GND (Bank 0) - GND (Bank 0) -
D5 0 NC-NC-NC-E12E^3
A4 0 NC - B0 B^0 F10 F^5 D8 D^2
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
72
E7 0 NC - B1 B^1 F8 F^4 D12 D^3
A3 0 B0 B^0 B2 B^2 B0 B^0 B0 B^0
F7 0 B2 B^1 B4 B^3 B2 B^1 B2 B^1
B4 0 B4 B^2 B6 B^4 B4 B^2 B4 B^2
C5 0 B6 B^3 B8 B^5 B6 B^3 B6 B^3
A2 0 B8 B^4 B9 B^6 B8 B^4 B8 B^4
E6 0 B10 B^5 B10 B^7 B10 B^5 B10 B^5
B3 0 B12 B^6 B12 B^8 B12 B^6 B12 B^6
C4 0 B14 B^7 B14 B^9 B14 B^7 B14 B^7
D4 0 NC - NC - D10 D^5 F0 F^0
E5 0 NC - NC - D8 D^4 F2 F^1
-- VCC-VCC - VCC - VCC -
-- ----GND-GND-
- 0 - - - - GND (Bank 0) - GND (Bank 0) -
Note: VCC, VCCO and GND are tied together to their respective common signal on the package substrate. See Power Supply and NC Con-
nections table for VCC/ VCCO/GND pin denitions.
ispMACH 4256V/B/C, 4384V/B/C, 4512V/B/C Logic Signal Connections:
256-Ball fpBGA (Cont.)
Ball
Number I/O
Bank
ispMACH 4256V/B/C
128-I/O ispMACH 4256V/B/C
160-I/O ispMACH 4384V/B/C ispMACH 4512V/B/C
GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP GLB/MC/Pad ORP
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
73
Part Number Description
ispMACH 4000 Family Speed Grade Offering
-25 -27 -3 -35 -37 -42 -45 -5 -75 -10
Com Com Com Com Com Com Com Com Ind Com Ind Auto Ind
ispMACH 4032V/B/C ✔✔✔✔
1
ispMACH 4064V/B/C ✔✔✔✔
1
ispMACH 4128V/B/C ✔✔✔✔
1
ispMACH 4256V/B/C ✔✔✔✔
1
ispMACH 4384V/B/C ✔✔✔✔
ispMACH 4512V/B/C ✔✔✔✔
ispMACH 4032ZC ✔✔✔✔✔
ispMACH 4064ZC ✔✔✔✔✔
ispMACH 4128ZC ✔✔✔
ispMACH 4256ZC ✔✔✔
1. 3.3V only.
Device Number
4032 = 32 Macrocells
4064 = 64 Macrocells
4128 = 128 Macrocells
4256 = 256 Macrocells
4384 = 384 Macrocells
4512 = 512 Macrocells
LC XXXX X X – XX XX XXX X X XX
Production Status
Blank = Final production
ES = Engineering Samples
I/O Designator (if applicable)
A = 128 I/Os
B = 160 I/Os
Supply Voltage
V = 3.3V
B = 2.5V
C = 1.8V
Power
Z = Zero Power
Blank = Low Power
Speed
25 = 2.5ns
27 = 2.7ns
3 = 3.0ns
35 = 3.5ns
37 = 3.7ns
42 = 4.2ns
45 = 4.5ns
5 = 5.0ns
75 = 7.5ns
10 = 10.0ns
Pin/Ball Count
44 (1.0mm thickness)
48 (1.0mm thickness)
56
100
128
132
144
176
256
Package
T = TQFP
F = fpBGA
M = csBGA
TN = Lead-free TQFP
FN = Lead-free fpBGA
MN = Lead-free csBGA
Operating Temperature Range
C = Commercial
I = Industrial
E = Automotive
Device Family
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
74
Ordering Information
Note: ispMACH 4000 devices are all dual marked except the slowest commercial speed grade ispMACH 4000Z
de vices . For e xample , the commercial speed gr ade LC4128C-5T100C is also marked with the industrial grade -75I.
The commercial grade is always one speed grade faster than the associated dual mark industrial grade. The slow-
est commercial speed grade ispMACH 4000Z devices are marked as commercial grade only.
Conventional Packaging
ispMACH 4000ZC (Zero Power, 1.8V) Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032ZC
LC4032ZC-35M56C 32 1.8 3.5 csBGA 56 32 C
LC4032ZC-5M56C 32 1.8 5 csBGA 56 32 C
LC4032ZC-75M56C 32 1.8 7.5 csBGA 56 32 C
LC4032ZC-35T48C 32 1.8 3.5 TQFP 48 32 C
LC4032ZC-5T48C 32 1.8 5 TQFP 48 32 C
LC4032ZC-75T48C 32 1.8 7.5 TQFP 48 32 C
LC4064ZC
LC4064ZC-37M132C164 1.8 3.7 csBGA 132 64 C
LC4064ZC-5M132C164 1.8 5 csBGA 132 64 C
LC4064ZC-75M132C164 1.8 7.5 csBGA 132 64 C
LC4064ZC-37T100C 64 1.8 3.7 TQFP 100 64 C
LC4064ZC-5T100C 64 1.8 5 TQFP 100 64 C
LC4064ZC-75T100C 64 1.8 7.5 TQFP 100 64 C
LC4064ZC-37M56C 64 1.8 3.7 csBGA 56 32 C
LC4064ZC-5M56C 64 1.8 5 csBGA 56 32 C
LC4064ZC-75M56C 64 1.8 7.5 csBGA 56 32 C
LC4064ZC-37T48C 64 1.8 3.7 TQFP 48 32 C
LC4064ZC-5T48C 64 1.8 5 TQFP 48 32 C
LC4064ZC-75T48C 64 1.8 7.5 TQFP 48 32 C
LC4128ZC
LC4128ZC-42M132C1128 1.8 4.2 csBGA 132 96 C
LC4128ZC-75M132C1128 1.8 7.5 csBGA 132 96 C
LC4128ZC-42T100C 128 1.8 4.2 TQFP 100 64 C
LC4128ZC-75T100C 128 1.8 7.5 TQFP 100 64 C
LC4256ZC
LC4256ZC-45T176C 256 1.8 4.5 TQFP 176 128 C
LC4256ZC-75T176C 256 1.8 7.5 TQFP 176 128 C
LC4256ZC-45M132C1256 1.8 4.5 csBGA 132 96 C
LC4256ZC-75M132C1256 1.8 7.5 csBGA 132 96 C
LC4256ZC-45T100C 256 1.8 4.5 TQFP 100 64 C
LC4256ZC-75T100C 256 1.8 7.5 TQFP 100 64 C
1. Contact factory for product availability.
ispMACH 4000ZC (1.8V, Zero Power) Industrial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032ZC
LC4032ZC-5M56I 32 1.8 5 csBGA 56 32 I
LC4032ZC-75M56I 32 1.8 7.5 csBGA 56 32 I
LC4032ZC-5T48I 32 1.8 5 TQFP 48 32 I
LC4032ZC-75T48I 32 1.8 7.5 TQFP 48 32 I
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
75
LC4064ZC
LC4064ZC-5M132I164 1.8 5 csBGA 132 64 I
LC4064ZC-75M132I164 1.8 7.5 csBGA 132 64 I
LC4064ZC-5T100I 64 1.8 5 TQFP 100 64 I
LC4064ZC-75T100I 64 1.8 7.5 TQFP 100 64 I
LC4064ZC-5M56I 64 1.8 5 csBGA 56 34 I
LC4064ZC-75M56I 64 1.8 7.5 csBGA 56 34 I
LC4064ZC-5T48I 64 1.8 5 TQFP 48 32 I
LC4064ZC-75T48I 64 1.8 7.5 TQFP 48 32 I
LC4128ZC LC4128ZC-75M132I1128 1.8 7.5 csBGA 132 96 I
LC4128ZC-75T100I 128 1.8 7.5 TQFP 100 64 I
LC4256ZC LC4256ZC-75T176I 256 1.8 7.5 TQFP 176 128 I
LC4256ZC-75M132I1256 1.8 7.5 csBGA 132 96 I
LC4256ZC-75T100I 256 1.8 7.5 TQFP 100 64 I
1. Contact factory for product availability.
ispMACH 4000ZC (1.8V, Zero Power) Automotive Devices
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032ZC LC4032ZC-75T48E 32 1.8 7.5 TQFP 48 32 E
LC4064ZC LC4064ZC-75T100E 64 1.8 7.5 TQFP 100 64 E
LC4064ZC-75T48E 64 1.8 7.5 TQFP 48 32 E
LC4128ZC LC4128ZC-75T100E 128 1.8 7.5 TQFP 100 64 E
LC4256ZC LC4256ZC-75T176E 256 1.8 7.5 TQFP 176 128 E
LC4256ZC-75T100E 256 1.8 7.5 TQFP 100 64 E
ispMACH 4000C (1.8V) Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032C
LC4032C-25T48C 32 1.8 2.5 TQFP 48 32 C
LC4032C-5T48C 32 1.8 5 TQFP 48 32 C
LC4032C-75T48C 32 1.8 7.5 TQFP 48 32 C
LC4032C-25T44C 32 1.8 2.5 TQFP 44 30 C
LC4032C-5T44C 32 1.8 5 TQFP 44 30 C
LC4032C-75T44C 32 1.8 7.5 TQFP 44 30 C
LC4064C
LC4064C-25T100C 64 1.8 2.5 TQFP 100 64 C
LC4064C-5T100C 64 1.8 5 TQFP 100 64 C
LC4064C-75T100C 64 1.8 7.5 TQFP 100 64 C
LC4064C-25T48C 64 1.8 2.5 TQFP 48 32 C
LC4064C-5T48C 64 1.8 5 TQFP 48 32 C
LC4064C-75T48C 64 1.8 7.5 TQFP 48 32 C
LC4064C-25T44C 64 1.8 2.5 TQFP 44 30 C
LC4064C-5T44C 64 1.8 5 TQFP 44 30 C
LC4064C-75T44C 64 1.8 7.5 TQFP 44 30 C
ispMACH 4000ZC (1.8V, Zero Power) Industrial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
76
LC4128C
LC4128C-27T128C 128 1.8 2.7 TQFP 128 92 C
LC4128C-5T128C 128 1.8 5 TQFP 128 92 C
LC4128C-75T128C 128 1.8 7.5 TQFP 128 92 C
LC4128C-27T100C 128 1.8 2.7 TQFP 100 64 C
LC4128C-5T100C 128 1.8 5 TQFP 100 64 C
LC4128C-75T100C 128 1.8 7.5 TQFP 100 64 C
LC4256C
LC4256C-3F256AC 256 1.8 3 fpBGA 256 128 C
LC4256C-5F256AC 256 1.8 5 fpBGA 256 128 C
LC4256C-75F256AC 256 1.8 7.5 fpBGA 256 128 C
LC4256C-3F256BC 256 1.8 3 fpBGA 256 160 C
LC4256C-5F256BC 256 1.8 5 fpBGA 256 160 C
LC4256C-75F256BC 256 1.8 7.5 fpBGA 256 160 C
LC4256C-3T176C 256 1.8 3 TQFP 176 128 C
LC4256C-5T176C 256 1.8 5 TQFP 176 128 C
LC4256C-75T176C 256 1.8 7.5 TQFP 176 128 C
LC4256C-3T100C 256 1.8 3 TQFP 100 64 C
LC4256C-5T100C 256 1.8 5 TQFP 100 64 C
LC4256C-75T100C 256 1.8 7.5 TQFP 100 64 C
LC4384C
LC4384C-35F256C 384 1.8 3.5 fpBGA 256 192 C
LC4384C-5F256C 384 1.8 5 fpBGA 256 192 C
LC4384C-75F256C 384 1.8 7.5 fpBGA 256 192 C
LC4384C-35T176C 384 1.8 3.5 TQFP 176 128 C
LC4384C-5T176C 384 1.8 5 TQFP 176 128 C
LC4384C-75T176C 384 1.8 7.5 TQFP 176 128 C
LC4512C
LC4512C-35F256C 512 1.8 3.5 fpBGA 256 208 C
LC4512C-5F256C 512 1.8 5 fpBGA 256 208 C
LC4512C-75F256C 512 1.8 7.5 fpBGA 256 208 C
LC4512C-35T176C 512 1.8 3.5 TQFP 176 128 C
LC4512C-5T176C 512 1.8 5 TQFP 176 128 C
LC4512C-75T176C 512 1.8 7.5 TQFP 176 128 C
ispMACH 4000C (1.8V) Industrial Devices
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032C
LC4032C-5T48I 32 1.8 5 TQFP 48 32 I
LC4032C-75T48I 32 1.8 7.5 TQFP 48 32 I
LC4032C-10T48I 32 1.8 10 TQFP 48 32 I
LC4032C-5T44I 32 1.8 5 TQFP 44 30 I
LC4032C-75T44I 32 1.8 7.5 TQFP 44 30 I
LC4032C-10T44I 32 1.8 10 TQFP 44 30 I
ispMACH 4000C (1.8V) Commercial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
77
LC4064C
LC4064C-5T100I 64 1.8 5 TQFP 100 64 I
LC4064C-75T100I 64 1.8 7.5 TQFP 100 64 I
LC4064C-10T100I 64 1.8 10 TQFP 100 64 I
LC4064C-5T48I 64 1.8 5 TQFP 48 32 I
LC4064C-75T48I 64 1.8 7.5 TQFP 48 32 I
LC4064C-10T48I 64 1.8 10 TQFP 48 32 I
LC4064C-5T44I 64 1.8 5 TQFP 44 30 I
LC4064C-75T44I 64 1.8 7.5 TQFP 44 30 I
LC4064C-10T44I 64 1.8 10 TQFP 44 30 I
LC4128C
LC4128C-5T128I 128 1.8 5 TQFP 128 92 I
LC4128C-75T128I 128 1.8 7.5 TQFP 128 92 I
LC4128C-10T128I 128 1.8 10 TQFP 128 92 I
LC4128C-5T100I 128 1.8 5 TQFP 100 64 I
LC4128C-75T100I 128 1.8 7.5 TQFP 100 64 I
LC4128C-10T100I 128 1.8 10 TQFP 100 64 I
LC4256C
LC4256C-5F256AI 256 1.8 5 fpBGA 256 128 I
LC4256C-75F256AI 256 1.8 7.5 fpBGA 256 128 I
LC4256C-10F256AI 256 1.8 10 fpBGA 256 128 I
LC4256C-5F256BI 256 1.8 5 fpBGA 256 160 I
LC4256C-75F256BI 256 1.8 7.5 fpBGA 256 160 I
LC4256C-10F256BI 256 1.8 10 fpBGA 256 160 I
LC4256C-5T176I 256 1.8 5 TQFP 176 128 I
LC4256C-75T176I 256 1.8 7.5 TQFP 176 128 I
LC4256C-10T176I 256 1.8 10 TQFP 176 128 I
LC4256C-5T100I 256 1.8 5 TQFP 100 64 I
LC4256C-75T100I 256 1.8 7.5 TQFP 100 64 I
LC4256C-10T100I 256 1.8 10 TQFP 100 64 I
LC4384C
LC4384C-5F256I 384 1.8 5 fpBGA 256 192 I
LC4384C-75F256I 384 1.8 7.5 fpBGA 256 192 I
LC4384C-10F256I 384 1.8 10 fpBGA 256 192 I
LC4384C-5T176I 384 1.8 5 TQFP 176 128 I
LC4384C-75T176I 384 1.8 7.5 TQFP 176 128 I
LC4384C-10T176I 384 1.8 10 TQFP 176 128 I
LC4512C
LC4512C-5F256I 512 1.8 5 fpBGA 256 208 I
LC4512C-75F256I 512 1.8 7.5 fpBGA 256 208 I
LC4512C-10F256I 512 1.8 10 fpBGA 256 208 I
LC4512C-5T176I 512 1.8 5 TQFP 176 128 I
LC4512C-75T176I 512 1.8 7.5 TQFP 176 128 I
LC4512C-10T176I 512 1.8 10 TQFP 176 128 I
ispMACH 4000C (1.8V) Industrial Devices (Cont.)
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
78
ispMACH 4000B (2.5V) Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032B
LC4032B-25T48C 32 2.5 2.5 TQFP 48 32 C
LC4032B-5T48C 32 2.5 5 TQFP 48 32 C
LC4032B-75T48C 32 2.5 7.5 TQFP 48 32 C
LC4032B-25T44C 32 2.5 2.5 TQFP 44 30 C
LC4032B-5T44C 32 2.5 5 TQFP 44 30 C
LC4032B-75T44C 32 2.5 7.5 TQFP 44 30 C
LC4064B
LC4064B-25T100C 64 2.5 2.5 TQFP 100 64 C
LC4064B-5T100C 64 2.5 5 TQFP 100 64 C
LC4064B-75T100C 64 2.5 7.5 TQFP 100 64 C
LC4064B-25T48C 64 2.5 2.5 TQFP 48 32 C
LC4064B-5T48C 64 2.5 5 TQFP 48 32 C
LC4064B-75T48C 64 2.5 7.5 TQFP 48 32 C
LC4064B-25T44C 64 2.5 2.5 TQFP 44 30 C
LC4064B-5T44C 64 2.5 5 TQFP 44 30 C
LC4064B-75T44C 64 2.5 7.5 TQFP 44 30 C
LC4128B
LC4128B-27T128C 128 2.5 2.7 TQFP 128 92 C
LC4128B-5T128C 128 2.5 5 TQFP 128 92 C
LC4128B-75T128C 128 2.5 7.5 TQFP 128 92 C
LC4128B-27T100C 128 2.5 2.7 TQFP 100 64 C
LC4128B-5T100C 128 2.5 5 TQFP 100 64 C
LC4128B-75T100C 128 2.5 7.5 TQFP 100 64 C
LC4256B
LC4256B-3F256AC 256 2.5 3 fpBGA 256 128 C
LC4256B-5F256AC 256 2.5 5 fpBGA 256 128 C
LC4256B-75F256AC 256 2.5 7.5 fpBGA 256 128 C
LC4256B-3F256BC 256 2.5 3 fpBGA 256 160 C
LC4256B-5F256BC 256 2.5 5 fpBGA 256 160 C
LC4256B-75F256BC 256 2.5 7.5 fpBGA 256 160 C
LC4256B-3T176C 256 2.5 3 TQFP 176 128 C
LC4256B-5T176C 256 2.5 5 TQFP 176 128 C
LC4256B-75T176C 256 2.5 7.5 TQFP 176 128 C
LC4256B-3T100C 256 2.5 3 TQFP 100 64 C
LC4256B-5T100C 256 2.5 5 TQFP 100 64 C
LC4256B-75T100C 256 2.5 7.5 TQFP 100 64 C
LC4384B
LC4384B-35F256C 384 2.5 3.5 fpBGA 256 192 C
LC4384B-5F256C 384 2.5 5 fpBGA 256 192 C
LC4384B-75F256C 384 2.5 7.5 fpBGA 256 192 C
LC4384B-35T176C 384 2.5 3.5 TQFP 176 128 C
LC4384B-5T176C 384 2.5 5 TQFP 176 128 C
LC4384B-75T176C 384 2.5 7.5 TQFP 176 128 C
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
79
LC4512B
LC4512B-35F256C 512 2.5 3.5 fpBGA 256 208 C
LC4512B-5F256C 512 2.5 5 fpBGA 256 208 C
LC4512B-75F256C 512 2.5 7.5 fpBGA 256 208 C
LC4512B-35T176C 512 2.5 3.5 TQFP 176 128 C
LC4512B-5T176C 512 2.5 5 TQFP 176 128 C
LC4512B-75T176C 512 2.5 7.5 TQFP 176 128 C
ispMACH 4000B (2.5V) Industrial Devices
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032B
LC4032B-5T48I 32 2.5 5 TQFP 48 32 I
LC4032B-75T48I 32 2.5 7.5 TQFP 48 32 I
LC4032B-10T48I 32 2.5 10 TQFP 48 32 I
LC4032B-5T44I 32 2.5 5 TQFP 44 30 I
LC4032B-75T44I 32 2.5 7.5 TQFP 44 30 I
LC4032B-10T44I 32 2.5 10 TQFP 44 30 I
LC4064B
LC4064B-5T100I 64 2.5 5 TQFP 100 64 I
LC4064B-75T100I 64 2.5 7.5 TQFP 100 64 I
LC4064B-10T100I 64 2.5 10 TQFP 100 64 I
LC4064B-5T48I 64 2.5 5 TQFP 48 32 I
LC4064B-75T48I 64 2.5 7.5 TQFP 48 32 I
LC4064B-10T48I 64 2.5 10 TQFP 48 32 I
LC4064B-5T44I 64 2.5 5 TQFP 44 30 I
LC4064B-75T44I 64 2.5 7.5 TQFP 44 30 I
LC4064B-10T44I 64 2.5 10 TQFP 44 30 I
LC4128B
LC4128B-5T128I 128 2.5 5 TQFP 128 92 I
LC4128B-75T128I 128 2.5 7.5 TQFP 128 92 I
LC4128B-10T128I 128 2.5 10 TQFP 128 92 I
LC4128B-5T100I 128 2.5 5 TQFP 100 64 I
LC4128B-75T100I 128 2.5 7.5 TQFP 100 64 I
LC4128B-10T100I 128 2.5 10 TQFP 100 64 I
LC4256B
LC4256B-5F256AI 256 2.5 5 fpBGA 256 128 I
LC4256B-75F256AI 256 2.5 7.5 fpBGA 256 128 I
LC4256B-10F256AI 256 2.5 10 fpBGA 256 128 I
LC4256B-5F256BI 256 2.5 5 fpBGA 256 160 I
LC4256B-75F256BI 256 2.5 7.5 fpBGA 256 160 I
LC4256B-10F256BI 256 2.5 10 fpBGA 256 160 I
LC4256B-5T176I 256 2.5 5 TQFP 176 128 I
LC4256B-75T176I 256 2.5 7.5 TQFP 176 128 I
LC4256B-10T176I 256 2.5 10 TQFP 176 128 I
LC4256B-5T100I 256 2.5 5 TQFP 100 64 I
LC4256B-75T100I 256 2.5 7.5 TQFP 100 64 I
LC4256B-10T100I 256 2.5 10 TQFP 100 64 I
ispMACH 4000B (2.5V) Commercial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
80
LC4384B
LC4384B-5F256I 384 2.5 5 fpBGA 256 192 I
LC4384B-75F256I 384 2.5 7.5 fpBGA 256 192 I
LC4384B-10F256I 384 2.5 10 fpBGA 256 192 I
LC4384B-5T176I 384 2.5 5 TQFP 176 128 I
LC4384B-75T176I 384 2.5 7.5 TQFP 176 128 I
LC4384B-10T176I 384 2.5 10 TQFP 176 128 I
LC4512B
LC4512B-5F256I 512 2.5 5 fpBGA 256 208 I
LC4512B-75F256I 512 2.5 7.5 fpBGA 256 208 I
LC4512B-10F256I 512 2.5 10 fpBGA 256 208 I
LC4512B-5T176I 512 2.5 5 TQFP 176 128 I
LC4512B-75T176I 512 2.5 7.5 TQFP 176 128 I
LC4512B-10T176I 512 2.5 10 TQFP 176 128 I
ispMACH 4000V (3.3V) Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032V
LC4032V-25T48C 32 3.3 2.5 TQFP 48 32 C
LC4032V-5T48C 32 3.3 5 TQFP 48 32 C
LC4032V-75T48C 32 3.3 7.5 TQFP 48 32 C
LC4032V-25T44C 32 3.3 2.5 TQFP 44 30 C
LC4032V-5T44C 32 3.3 5 TQFP 44 30 C
LC4032V-75T44C 32 3.3 7.5 TQFP 44 30 C
LC4064V
LC4064V-25T100C 64 3.3 2.5 TQFP 100 64 C
LC4064V-5T100C 64 3.3 5 TQFP 100 64 C
LC4064V-75T100C 64 3.3 7.5 TQFP 100 64 C
LC4064V-25T48C 64 3.3 2.5 TQFP 48 32 C
LC4064V-5T48C 64 3.3 5 TQFP 48 32 C
LC4064V-75T48C 64 3.3 7.5 TQFP 48 32 C
LC4064V-25T44C 64 3.3 2.5 TQFP 44 30 C
LC4064V-5T44C 64 3.3 5 TQFP 44 30 C
LC4064V-75T44C 64 3.3 7.5 TQFP 44 30 C
LC4128V
LC4128V-27T144C 128 3.3 2.7 TQFP 144 96 C
LC4128V-5T144C 128 3.3 5 TQFP 144 96 C
LC4128V-75T144C 128 3.3 7.5 TQFP 144 96 C
LC4128V-27T128C 128 3.3 2.7 TQFP 128 92 C
LC4128V-5T128C 128 3.3 5 TQFP 128 92 C
LC4128V-75T128C 128 3.3 7.5 TQFP 128 92 C
LC4128V-27T100C 128 3.3 2.7 TQFP 100 64 C
LC4128V-5T100C 128 3.3 5 TQFP 100 64 C
LC4128V-75T100C 128 3.3 7.5 TQFP 100 64 C
ispMACH 4000B (2.5V) Industrial Devices (Cont.)
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
81
LC4256V
LC4256V-3F256AC 256 3.3 3 fpBGA 256 128 C
LC4256V-5F256AC 256 3.3 5 fpBGA 256 128 C
LC4256V-75F256AC 256 3.3 7.5 fpBGA 256 128 C
LC4256V-3F256BC 256 3.3 3 fpBGA 256 160 C
LC4256V-5F256BC 256 3.3 5 fpBGA 256 160 C
LC4256V-75F256BC 256 3.3 7.5 fpBGA 256 160 C
LC4256V-3T176C 256 3.3 3 TQFP 176 128 C
LC4256V-5T176C 256 3.3 5 TQFP 176 128 C
LC4256V-75T176C 256 3.3 7.5 TQFP 176 128 C
LC4256V-3T144C 256 3.3 3 TQFP 144 96 C
LC4256V-5T144C 256 3.3 5 TQFP 144 96 C
LC4256V-75T144C 256 3.3 7.5 TQFP 144 96 C
LC4256V-3T100C 256 3.3 3 TQFP 100 64 C
LC4256V-5T100C 256 3.3 5 TQFP 100 64 C
LC4256V-75T100C 256 3.3 7.5 TQFP 100 64 C
LC4384V
LC4384V-35F256C 384 3.3 3.5 fpBGA 256 192 C
LC4384V-5F256C 384 3.3 5 fpBGA 256 192 C
LC4384V-75F256C 384 3.3 7.5 fpBGA 256 192 C
LC4384V-35T176C 384 3.3 3.5 TQFP 176 128 C
LC4384V-5T176C 384 3.3 5 TQFP 176 128 C
LC4384V-75T176C 384 3.3 7.5 TQFP 176 128 C
LC4512V
LC4512V-35F256C 512 3.3 3.5 fpBGA 256 208 C
LC4512V-5F256C 512 3.3 5 fpBGA 256 208 C
LC4512V-75F256C 512 3.3 7.5 fpBGA 256 208 C
LC4512V-35T176C 512 3.3 3.5 TQFP 176 128 C
LC4512V-5T176C 512 3.3 5 TQFP 176 128 C
LC4512V-75T176C 512 3.3 7.5 TQFP 176 128 C
ispMACH 4000V (3.3V) Industrial Devices
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032V
LC4032V-5T48I 32 3.3 5 TQFP 48 32 I
LC4032V-75T48I 32 3.3 7.5 TQFP 48 32 I
LC4032V-10T48I 32 3.3 10 TQFP 48 32 I
LC4032V-5T44I 32 3.3 5 TQFP 44 30 I
LC4032V-75T44I 32 3.3 7.5 TQFP 44 30 I
LC4032V-10T44I 32 3.3 10 TQFP 44 30 I
ispMACH 4000V (3.3V) Commercial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
82
LC4064V
LC4064V-5T100I 64 3.3 5 TQFP 100 64 I
LC4064V-75T100I 64 3.3 7.5 TQFP 100 64 I
LC4064V-10T100I 64 3.3 10 TQFP 100 64 I
LC4064V-5T48I 64 3.3 5 TQFP 48 32 I
LC4064V-75T48I 64 3.3 7.5 TQFP 48 32 I
LC4064V-10T48I 64 3.3 10 TQFP 48 32 I
LC4064V-5T44I 64 3.3 5 TQFP 44 30 I
LC4064V-75T44I 64 3.3 7.5 TQFP 44 30 I
LC4064V-10T44I 64 3.3 10 TQFP 44 30 I
LC4128V
LC4128V-5T144I 128 3.3 5 TQFP 144 96 I
LC4128V-75T144I 128 3.3 7.5 TQFP 144 96 I
LC4128V-10T144I 128 3.3 10 TQFP 144 96 I
LC4128V-5T128I 128 3.3 5 TQFP 128 92 I
LC4128V-75T128I 128 3.3 7.5 TQFP 128 92 I
LC4128V-10T128I 128 3.3 10 TQFP 128 92 I
LC4128V-5T100I 128 3.3 5 TQFP 100 64 I
LC4128V-75T100I 128 3.3 7.5 TQFP 100 64 I
LC4128V-10T100I 128 3.3 10 TQFP 100 64 I
LC4256V
LC4256V-5F256AI 256 3.3 5 fpBGA 256 128 I
LC4256V-75F256AI 256 3.3 7.5 fpBGA 256 128 I
LC4256V-10F256AI 256 3.3 10 fpBGA 256 128 I
LC4256V-5F256BI 256 3.3 5 fpBGA 256 160 I
LC4256V-75F256BI 256 3.3 7.5 fpBGA 256 160 I
LC4256V-10F256BI 256 3.3 10 fpBGA 256 160 I
LC4256V-5T176I 256 3.3 5 TQFP 176 128 I
LC4256V-75T176I 256 3.3 7.5 TQFP 176 128 I
LC4256V-10T176I 256 3.3 10 TQFP 176 128 I
LC4256V-5T144I 256 3.3 5 TQFP 144 96 I
LC4256V-75T144I 256 3.3 7.5 TQFP 144 96 I
LC4256V-10T144I 256 3.3 10 TQFP 144 96 I
LC4256V-5T100I 256 3.3 5 TQFP 100 64 I
LC4256V-75T100I 256 3.3 7.5 TQFP 100 64 I
LC4256V-10T100I 256 3.3 10 TQFP 100 64 I
LC4384V
LC4384V-5F256I 384 3.3 5 fpBGA 256 192 I
LC4384V-75F256I 384 3.3 7.5 fpBGA 256 192 I
LC4384V-10F256I 384 3.3 10 fpBGA 256 192 I
LC4384V-5T176I 384 3.3 5 TQFP 176 128 I
LC4384V-75T176I 384 3.3 7.5 TQFP 176 128 I
LC4384V-10T176I 384 3.3 10 TQFP 176 128 I
ispMACH 4000V (3.3V) Industrial Devices (Cont.)
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
83
LC4512V
LC4512V-5F256I 512 3.3 5 fpBGA 256 208 I
LC4512V-75F256I 512 3.3 7.5 fpBGA 256 208 I
LC4512V-10F256I 512 3.3 10 fpBGA 256 208 I
LC4512V-5T176I 512 3.3 5 TQFP 176 128 I
LC4512V-75T176I 512 3.3 7.5 TQFP 176 128 I
LC4512V-10T176I 512 3.3 10 TQFP 176 128 I
ispMACH 4000V (3.3V) Automotive Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
LC4032V LC4032V-75T48E 32 3.3 7.5 TQFP 48 32 E
LC4032V-75T44E 32 3.3 7.5 TQFP 44 30 E
LC4064V LC4064V-75T100E 64 3.3 7.5 TQFP 100 64 E
LC4064V-75T48E 64 3.3 7.5 TQFP 48 32 E
LC4064V-75T44E 64 3.3 7.5 TQFP 44 30 E
LC4128V LC4128V-75T144E 128 3.3 7.5 TQFP 144 96 E
LC4128V-75T128E 128 3.3 7.5 TQFP 128 92 E
LC4128V-75T100E 128 3.3 7.5 TQFP 100 64 E
LC4256V LC4256V-75T176E 256 3.3 7.5 TQFP 176 128 E
LC4256V-75T144E 256 3.3 7.5 TQFP 144 96 E
LC4256V-75T100E 256 3.3 7.5 TQFP 100 64 E
ispMACH 4000V (3.3V) Industrial Devices (Cont.)
Family Part Number Macrocells Voltage tPD Package Pin/Ball Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
84
Lead-Free Packaging
ispMACH 4000Z (Zero Power, 1.8V) Lead-Free Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032ZC
LC4032ZC-35MN56C 32 1.8 3.5 Lead-free csBGA 56 32 C
LC4032ZC-5MN56C 32 1.8 5 Lead-free csBGA 56 32 C
LC4032ZC-75MN56C 32 1.8 7.5 Lead-free csBGA 56 32 C
LC4032ZC-35TN48C 32 1.8 3.5 Lead-free TQFP 48 32 C
LC4032ZC-5TN48C 32 1.8 5 Lead-free TQFP 48 32 C
LC4032ZC-75TN48C 32 1.8 7.5 Lead-free TQFP 48 32 C
LC4064ZC
LC4064ZC-37MN132C164 1.8 3.7 Lead-free csBGA 132 64 C
LC4064ZC-5MN132C164 1.8 5 Lead-free csBGA 132 64 C
LC4064ZC-75MN132C164 1.8 7.5 Lead-free csBGA 132 64 C
LC4064ZC-37TN100C 64 1.8 3.7 Lead-free TQFP 100 64 C
LC4064ZC-5TN100C 64 1.8 5 Lead-free TQFP 100 64 C
LC4064ZC-75TN100C 64 1.8 7.5 Lead-free TQFP 100 64 C
LC4064ZC-37MN56C 64 1.8 3.7 Lead-free csBGA 56 32 C
LC4064ZC-5MN56C 64 1.8 5 Lead-free csBGA 56 32 C
LC4064ZC-75MN56C 64 1.8 7.5 Lead-free csBGA 56 32 C
LC4064ZC-37TN48C 64 1.8 3.7 Lead-free TQFP 48 32 C
LC4064ZC-5TN48C 64 1.8 5 Lead-free TQFP 48 32 C
LC4064ZC-75TN48C 64 1.8 7.5 Lead-free TQFP 48 32 C
LC4128ZC
LC4128ZC-42MN132C1128 1.8 4.2 Lead-free csBGA 132 96 C
LC4128ZC-75MN132C1128 1.8 7.5 Lead-free csBGA 132 96 C
LC4128ZC-42TN100C 128 1.8 4.2 Lead-free TQFP 100 64 C
LC4128ZC-75TN100C 128 1.8 7.5 Lead-free TQFP 100 64 C
LC4256ZC
LC4256ZC-45TN176C 256 1.8 4.5 Lead-free TQFP 176 128 C
LC4256ZC-75TN176C 256 1.8 7.5 Lead-free TQFP 176 128 C
LC4256ZC-45MN132C1256 1.8 4.5 Lead-free csBGA 132 96 C
LC4256ZC-75MN132C1256 1.8 7.5 Lead-free csBGA 132 96 C
LC4256ZC-45TN100C 256 1.8 4.5 Lead-free TQFP 100 64 C
LC4256ZC-75TN100C 256 1.8 7.5 Lead-free TQFP 100 64 C
1. Contact factory for product availability.
ispMACH 4000Z (Zero Power, 1.8V) Lead-Free Industrial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032ZC
LC4032ZC-5MN56I 32 1.8 5 Lead-free csBGA 56 32 I
LC4032ZC-75MN56I 32 1.8 7.5 Lead-free csBGA 56 32 I
LC4032ZC-5TN48I 32 1.8 5 Lead-free TQFP 48 32 I
LC4032ZC-75TN48I 32 1.8 7.5 Lead-free TQFP 48 32 I
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
85
LC4064ZC
LC4064ZC-5MN132I164 1.8 5 Lead-free csBGA 132 64 I
LC4064ZC-75MN132I164 1.8 7.5 Lead-free csBGA 132 64 I
LC4064ZC-5TN100I 64 1.8 5 Lead-free TQFP 100 64 I
LC4064ZC-75TN100I 64 1.8 7.5 Lead-free TQFP 100 64 I
LC4064ZC-5MN56I 64 1.8 5 Lead-free csBGA 56 32 I
LC4064ZC-75MN56I 64 1.8 7.5 Lead-free csBGA 56 32 I
LC4064ZC-5TN48I 64 1.8 5 Lead-free TQFP 48 32 I
LC4064ZC-75TN48I 64 1.8 7.5 Lead-free TQFP 48 32 I
LC4128ZC LC4128ZC-75MN132I1128 1.8 7.5 Lead-free csBGA 132 96 I
LC4128ZC-75TN100I 128 1.8 7.5 Lead-free TQFP 100 64 I
LC4256ZC LC4256ZC-75TN176I 256 1.8 7.5 Lead-free TQFP 176 128 I
LC4256ZC-75MN132I1256 1.8 7.5 Lead-free csBGA 132 96 I
LC4256ZC-75TN100I 256 1.8 7.5 Lead-free TQFP 100 64 I
1. Contact factory for product availability.
ispMACH 4000Z (Zero Power, 1.8V) Lead-Free Automotive Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032ZC LC4032ZC-75TN48E 32 1.8 7.5 Lead-free TQFP 48 32 E
LC4064ZC LC4064ZC-75TN100E 64 1.8 7.5 Lead-free TQFP 100 64 E
LC4064ZC-75TN48E 64 1.8 7.5 Lead-free TQFP 48 32 E
LC4128ZC LC4128ZC-75TN100E 128 1.8 7.5 Lead-free TQFP 100 64 E
LC4256ZC LC4256ZC-75TN176E 256 1.8 7.5 Lead-free TQFP 176 128 E
LC4256ZC-75TN100E 256 1.8 7.5 Lead-free TQFP 100 64 E
ispMACH 4000C (1.8V) Lead-Free Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032C
LC4032C-25TN48C 32 1.8 2.5 Lead-free TQFP 48 32 C
LC4032C-5TN48C 32 1.8 5 Lead-free TQFP 48 32 C
LC4032C-75TN48C 32 1.8 7.5 Lead-free TQFP 48 32 C
LC4032C-25TN44C 32 1.8 2.5 Lead-free TQFP 44 30 C
LC4032C-5TN44C 32 1.8 5 Lead-free TQFP 44 30 C
LC4032C-75TN44C 32 1.8 7.5 Lead-free TQFP 44 30 C
ispMACH 4000Z (Zero Power, 1.8V) Lead-Free Industrial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
86
LC4064C
LC4064C-25TN100C 64 1.8 2.5 Lead-free TQFP 100 64 C
LC4064C-5TN100C 64 1.8 5 Lead-free TQFP 100 64 C
LC4064C-75TN100C 64 1.8 7.5 Lead-free TQFP 100 64 C
LC4064C-25TN48C 64 1.8 2.5 Lead-free TQFP 48 32 C
LC4064C-5TN48C 64 1.8 5 Lead-free TQFP 48 32 C
LC4064C-75TN48C 64 1.8 7.5 Lead-free TQFP 48 32 C
LC4064C-25TN44C 64 1.8 2.5 Lead-free TQFP 44 30 C
LC4064C-5TN44C 64 1.8 5 Lead-free TQFP 44 30 C
LC4064C-75TN44C 64 1.8 7.5 Lead-free TQFP 44 30 C
LC4128C
LC4128C-27TN128C 128 1.8 2.7 Lead-free TQFP 128 92 C
LC4128C-5TN128C 128 1.8 5 Lead-free TQFP 128 92 C
LC4128C-75TN128C 128 1.8 7.5 Lead-free TQFP 128 92 C
LC4128C-27TN100C 128 1.8 2.7 Lead-free TQFP 100 64 C
LC4128C-5TN100C 128 1.8 5 Lead-free TQFP 100 64 C
LC4128C-75TN100C 128 1.8 7.5 Lead-free TQFP 100 64 C
LC4256C
LC4256C-3FN256AC 256 1.8 3 Lead-free fpBGA 256 128 C
LC4256C-5FN256AC 256 1.8 5 Lead-free fpBGA 256 128 C
LC4256C-75FN256AC 256 1.8 7.5 Lead-free fpBGA 256 128 C
LC4256C-3FN256BC 256 1.8 3 Lead-free fpBGA 256 160 C
LC4256C-5FN256BC 256 1.8 5 Lead-free fpBGA 256 160 C
LC4256C-75FN256BC 256 1.8 7.5 Lead-free fpBGA 256 160 C
LC4256C-3TN176C 256 1.8 3 Lead-free TQFP 176 128 C
LC4256C-5TN176C 256 1.8 5 Lead-free TQFP 176 128 C
LC4256C-75TN176C 256 1.8 7.5 Lead-free TQFP 176 128 C
LC4256C-3TN100C 256 1.8 3 Lead-free TQFP 100 64 C
LC4256C-5TN100C 256 1.8 5 Lead-free TQFP 100 64 C
LC4256C-75TN100C 256 1.8 7.5 Lead-free TQFP 100 64 C
LC4384C
LC4384C-35FN256C 384 1.8 3.5 Lead-free fpBGA 256 192 C
LC4384C-5FN256C 384 1.8 5 Lead-free fpBGA 256 192 C
LC4384C-75FN256C 384 1.8 7.5 Lead-free fpBGA 256 192 C
LC4384C-35TN176C 384 1.8 3.5 Lead-free TQFP 176 128 C
LC4384C-5TN176C 384 1.8 5 Lead-free TQFP 176 128 C
LC4384C-75TN176C 384 1.8 7.5 Lead-free TQFP 176 128 C
LC4512C
LC4512C-35FN256C 512 1.8 3.5 Lead-free fpBGA 256 208 C
LC4512C-5FN256C 512 1.8 5 Lead-free fpBGA 256 208 C
LC4512C-75FN256C 512 1.8 7.5 Lead-free fpBGA 256 208 C
LC4512C-35TN176C 512 1.8 3.5 Lead-free TQFP 176 128 C
LC4512C-5TN176C 512 1.8 5 Lead-free TQFP 176 128 C
LC4512C-75TN176C 512 1.8 7.5 Lead-free TQFP 176 128 C
ispMACH 4000C (1.8V) Lead-Free Commercial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
87
ispMACH 4000C (1.8V) Lead-Free Industrial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032C
LC4032C-5TN48I 32 1.8 5 Lead-free TQFP 48 32 I
LC4032C-75TN48I 32 1.8 7.5 Lead-free TQFP 48 32 I
LC4032C-10TN48I 32 1.8 10 Lead-free TQFP 48 32 I
LC4032C-5TN44I 32 1.8 5 Lead-free TQFP 44 30 I
LC4032C-75TN44I 32 1.8 7.5 Lead-free TQFP 44 30 I
LC4032C-10TN44I 32 1.8 10 Lead-free TQFP 44 30 I
LC4064C
LC4064C-5TN100I 64 1.8 5 Lead-free TQFP 100 64 I
LC4064C-75TN100I 64 1.8 7.5 Lead-free TQFP 100 64 I
LC4064C-10TN100I 64 1.8 10 Lead-free TQFP 100 64 I
LC4064C-5TN48I 64 1.8 5 Lead-free TQFP 48 32 I
LC4064C-75TN48I 64 1.8 7.5 Lead-free TQFP 48 32 I
LC4064C-10TN48I 64 1.8 10 Lead-free TQFP 48 32 I
LC4064C-5TN44I 64 1.8 5 Lead-free TQFP 44 30 I
LC4064C-75TN44I 64 1.8 5 Lead-free TQFP 44 30 I
LC4064C-10TN44I 64 1.8 10 Lead-free TQFP 44 30 I
LC4128C
LC4128C-5TN128I 128 1.8 5 Lead-free TQFP 128 92 I
LC4128C-75TN128I 128 1.8 7.5 Lead-free TQFP 128 92 I
LC4128C-10TN128I 128 1.8 10 Lead-free TQFP 128 92 I
LC4128C-5TN100I 128 1.8 5 Lead-free TQFP 100 64 I
LC4128C-75TN100I 128 1.8 7.5 Lead-free TQFP 100 64 I
LC4128C-10TN100I 128 1.8 10 Lead-free TQFP 100 64 I
LC4256C
LC4256C-5FN256AI 256 1.8 5 Lead-free fpBGA 256 128 I
LC4256C-75FN256AI 256 1.8 7.5 Lead-free fpBGA 256 128 I
LC4256C-10FN256AI 256 1.8 10 Lead-free fpBGA 256 128 I
LC4256C-5FN256BI 256 1.8 5 Lead-free fpBGA 256 160 I
LC4256C-75FN256BI 256 1.8 7.5 Lead-free fpBGA 256 160 I
LC4256C-10FN256BI 256 1.8 10 Lead-free fpBGA 256 160 I
LC4256C-5TN176I 256 1.8 5 Lead-free TQFP 176 128 I
LC4256C-75TN176I 256 1.8 7.5 Lead-free TQFP 176 128 I
LC4256C-10TN176I 256 1.8 10 Lead-free TQFP 176 128 I
LC4256C-5TN100I 256 1.8 5 Lead-free TQFP 100 64 I
LC4256C-75TN100I 256 1.8 7.5 Lead-free TQFP 100 64 I
LC4256C-10TN100I 256 1.8 10 Lead-free TQFP 100 64 I
LC4384C
LC4384C-5FN256I 384 1.8 5 Lead-free fpBGA 256 192 I
LC4384C-75FN256I 384 1.8 7.5 Lead-free fpBGA 256 192 I
LC4384C-10FN256I 384 1.8 10 Lead-free fpBGA 256 192 I
LC4384C-5TN176I 384 1.8 5 Lead-free TQFP 176 128 I
LC4384C-75TN176I 384 1.8 7.5 Lead-free TQFP 176 128 I
LC4384C-10TN176I 384 1.8 10 Lead-free TQFP 176 128 I
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
88
LC4512C
LC4512C-5FN256I 512 1.8 5 Lead-free fpBGA 256 208 I
LC4512C-75FN256I 512 1.8 7.5 Lead-free fpBGA 256 208 I
LC4512C-10FN256I 512 1.8 10 Lead-free fpBGA 256 208 I
LC4512C-5TN176I 512 1.8 5 Lead-free TQFP 176 128 I
LC4512C-75TN176I 512 1.8 7.5 Lead-free TQFP 176 128 I
LC4512C-10TN176I 512 1.8 10 Lead-free TQFP 176 128 I
ispMACH 4000V (3.3V) Lead-Free Commercial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032V
LC4032V-25TN48C 32 3.3 2.5 Lead-free TQFP 48 32 C
LC4032V-5TN48C 32 3.3 5 Lead-free TQFP 48 32 C
LC4032V-75TN48C 32 3.3 7.5 Lead-free TQFP 48 32 C
LC4032V-25TN44C 32 3.3 2.5 Lead-free TQFP 44 30 C
LC4032V-5TN44C 32 3.3 5 Lead-free TQFP 44 30 C
LC4032V-75TN44C 32 3.3 7.5 Lead-free TQFP 44 30 C
LC4064V
LC4064V-25TN100C 64 3.3 2.5 Lead-free TQFP 100 64 C
LC4064V-5TN100C 64 3.3 5 Lead-free TQFP 100 64 C
LC4064V-75TN100C 64 3.3 7.5 Lead-free TQFP 100 64 C
LC4064V-25TN48C 64 3.3 2.5 Lead-free TQFP 48 32 C
LC4064V-5TN48C 64 3.3 5 Lead-free TQFP 48 32 C
LC4064V-75TN48C 64 3.3 7.5 Lead-free TQFP 48 32 C
LC4064V-25TN44C 64 3.3 2.5 Lead-free TQFP 44 30 C
LC4064V-5TN44C 64 3.3 5 Lead-free TQFP 44 30 C
LC4064V-75TN44C 64 3.3 7.5 Lead-free TQFP 44 30 C
LC4128V
LC4128V-27TN144C 128 3.3 2.7 Lead-free TQFP 144 96 C
LC4128V-5TN144C 128 3.3 5 Lead-free TQFP 144 96 C
LC4128V-75TN144C 128 3.3 7.5 Lead-free TQFP 144 96 C
LC4128V-27TN128C 128 3.3 2.7 Lead-free TQFP 128 92 C
LC4128V-5TN128C 128 3.3 5 Lead-free TQFP 128 92 C
LC4128V-75TN128C 128 3.3 7.5 Lead-free TQFP 128 92 C
LC4128V-27TN100C 128 3.3 2.7 Lead-free TQFP 100 64 C
LC4128V-5TN100C 128 3.3 5 Lead-free TQFP 100 64 C
LC4128V-75TN100C 128 3.3 7.5 Lead-free TQFP 100 64 C
ispMACH 4000C (1.8V) Lead-Free Industrial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
89
LC4256V
LC4256V-3FN256AC 256 3.3 3 Lead-free fpBGA 256 128 C
LC4256V-5FN256AC 256 3.3 5 Lead-free fpBGA 256 128 C
LC4256V-75FN256AC 256 3.3 7.5 Lead-free fpBGA 256 128 C
LC4256V-3FN256BC 256 3.3 3 Lead-free fpBGA 256 160 C
LC4256V-5FN256BC 256 3.3 5 Lead-free fpBGA 256 160 C
LC4256V-75FN256BC 256 3.3 7.5 Lead-free fpBGA 256 160 C
LC4256V-3TN176C 256 3.3 3 Lead-free TQFP 176 128 C
LC4256V-5TN176C 256 3.3 5 Lead-free TQFP 176 128 C
LC4256V-75TN176C 256 3.3 7.5 Lead-free TQFP 176 128 C
LC4256V-3TN144C 256 3.3 3 Lead-free TQFP 144 96 C
LC4256V-5TN144C 256 3.3 5 Lead-free TQFP 144 96 C
LC4256V-75TN144C 256 3.3 7.5 Lead-free TQFP 144 96 C
LC4256V-3TN100C 256 3.3 3 Lead-free TQFP 100 64 C
LC4256V-5TN100C 256 3.3 5 Lead-free TQFP 100 64 C
LC4256V-75TN100C 256 3.3 7.5 Lead-free TQFP 100 64 C
LC4384V
LC4384V-35FN256C 384 3.3 3.5 Lead-free fpBGA 256 192 C
LC4384V-5FN256C 384 3.3 5 Lead-free fpBGA 256 192 C
LC4384V-75FN256C 384 3.3 7.5 Lead-free fpBGA 256 192 C
LC4384V-35TN176C 384 3.3 3.5 Lead-free TQFP 176 128 C
LC4384V-5TN176C 384 3.3 5 Lead-free TQFP 176 128 C
LC4384V-75TN176C 384 3.3 7.5 Lead-free TQFP 176 128 C
LC4512V
LC4512V-35FN256C 512 3.3 3.5 Lead-free fpBGA 256 208 C
LC4512V-5FN256C 512 3.3 5 Lead-free fpBGA 256 208 C
LC4512V-75FN256C 512 3.3 7.5 Lead-free fpBGA 256 208 C
LC4512V-35TN176C 512 3.3 3.5 Lead-free TQFP 176 128 C
LC4512V-5TN176C 512 3.3 5 Lead-free TQFP 176 128 C
LC4512V-75TN176C 512 3.3 7.5 Lead-free TQFP 176 128 C
ispMACH 4000V (3.3V) Lead-Free Industrial Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032V
LC4032V-5TN48I 32 3.3 5 Lead-free TQFP 48 32 I
LC4032V-75TN48I 32 3.3 7.5 Lead-free TQFP 48 32 I
LC4032V-10TN48I 32 3.3 10 Lead-free TQFP 48 32 I
LC4032V-5TN44I 32 3.3 5 Lead-free TQFP 44 30 I
LC4032V-75TN44I 32 3.3 7.5 Lead-free TQFP 44 30 I
LC4032V-10TN44I 32 3.3 10 Lead-free TQFP 44 30 I
ispMACH 4000V (3.3V) Lead-Free Commercial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
90
LC4064V
LC4064V-5TN100I 64 3.3 5 Lead-free TQFP 100 64 I
LC4064V-75TN100I 64 3.3 7.5 Lead-free TQFP 100 64 I
LC4064V-10TN100I 64 3.3 10 Lead-free TQFP 100 64 I
LC4064V-5TN48I 64 3.3 5 Lead-free TQFP 48 32 I
LC4064V-75TN48I 64 3.3 7.5 Lead-free TQFP 48 32 I
LC4064V-10TN48I 64 3.3 10 Lead-free TQFP 48 32 I
LC4064V-5TN44I 64 3.3 5 Lead-free TQFP 44 30 I
LC4064V-75TN44I 64 3.3 5 Lead-free TQFP 44 30 I
LC4064V-10TN44I 64 3.3 10 Lead-free TQFP 44 30 I
LC4128V
LC4128V-5TN144I 128 3.3 5 Lead-free TQFP 144 96 I
LC4128V-75TN144I 128 3.3 7.5 Lead-free TQFP 144 96 I
LC4128V-10TN144I 128 3.3 10 Lead-free TQFP 144 96 I
LC4128V-5TN128I 128 3.3 5 Lead-free TQFP 128 92 I
LC4128V-75TN128I 128 3.3 7.5 Lead-free TQFP 128 92 I
LC4128V-10TN128I 128 3.3 10 Lead-free TQFP 128 92 I
LC4128V-5TN100I 128 3.3 5 Lead-free TQFP 100 64 I
LC4128V-75TN100I 128 3.3 7.5 Lead-free TQFP 100 64 I
LC4128V-10TN100I 128 3.3 10 Lead-free TQFP 100 64 I
LC4256V
LC4256V-5FN256AI 256 3.3 5 Lead-free fpBGA 256 128 I
LC4256V-75FN256AI 256 3.3 7.5 Lead-free fpBGA 256 128 I
LC4256V-10FN256AI 256 3.3 10 Lead-free fpBGA 256 128 I
LC4256V-5FN256BI 256 3.3 5 Lead-free fpBGA 256 160 I
LC4256V-75FN256BI 256 3.3 7.5 Lead-free fpBGA 256 160 I
LC4256V-10FN256BI 256 3.3 10 Lead-free fpBGA 256 160 I
LC4256V-5TN176I 256 3.3 5 Lead-free TQFP 176 128 I
LC4256V-75TN176I 256 3.3 7.5 Lead-free TQFP 176 128 I
LC4256V-10TN176I 256 3.3 10 Lead-free TQFP 176 128 I
LC4256V-5TN144I 256 3.3 5 Lead-free TQFP 144 96 I
LC4256V-75TN144I 256 3.3 7.5 Lead-free TQFP 144 96 I
LC4256V-10TN144I 256 3.3 10 Lead-free TQFP 144 96 I
LC4256V-5TN100I 256 3.3 5 Lead-free TQFP 100 64 I
LC4256V-75TN100I 256 3.3 7.5 Lead-free TQFP 100 64 I
LC4256V-10TN100I 256 3.3 10 Lead-free TQFP 100 64 I
LC4384V
LC4384V-5FN256I 384 3.3 5 Lead-free fpBGA 256 192 I
LC4384V-75FN256I 384 3.3 7.5 Lead-free fpBGA 256 192 I
LC4384V-10FN256I 384 3.3 10 Lead-free fpBGA 256 192 I
LC4384V-5TN176I 384 3.3 5 Lead-free TQFP 176 128 I
LC4384V-75TN176I 384 3.3 7.5 Lead-free TQFP 176 128 I
LC4384V-10TN176I 384 3.3 10 Lead-free TQFP 176 128 I
ispMACH 4000V (3.3V) Lead-Free Industrial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet
91
For Further Information
In addition to this data sheet, the following technical notes may be helpful when designing with the ispMACH
4000V/B/C/Z family:
ispMACH 4000 Timing Model Design and Usage Guidelines (TN1004)
ispMACH 4000V/B/C/Z Power Consumption (TN1005)
Low Power Design Guide (TN1042)
LC4512V
LC4512V-5FN256I 512 3.3 5 Lead-free fpBGA 256 208 I
LC4512V-75FN256I 512 3.3 7.5 Lead-free fpBGA 256 208 I
LC4512V-10FN256I 512 3.3 10 Lead-free fpBGA 256 208 I
LC4512V-5TN176I 512 3.3 5 Lead-free TQFP 176 128 I
LC4512V-75TN176I 512 3.3 7.5 Lead-free TQFP 176 128 I
LC4512V-10TN176I 512 3.3 10 Lead-free TQFP 176 128 I
ispMACH 4000V (3.3V) Lead-Free Automotive Devices
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade
LC4032V LC4032V-75TN48E 32 3.3 7.5 Lead-free TQFP 48 32 E
LC4032V-75TN44E 32 3.3 7.5 Lead-free TQFP 44 30 E
LC4064V LC4064V-75TN100E 64 3.3 7.5 Lead-free TQFP 100 64 E
LC4064V-75TN48E 64 3.3 7.5 Lead-free TQFP 48 32 E
LC4064V-75TN44E 64 3.3 7.5 Lead-free TQFP 44 30 E
LC4128V LC4128V-75TN144E 128 3.3 7.5 Lead-free TQFP 144 96 E
LC4128V-75TN128E 128 3.3 7.5 Lead-free TQFP 128 92 E
LC4128V-75TN100E 128 3.3 7.5 Lead-free TQFP 100 64 E
LC4256V LC4256V-75TN176E 256 3.3 7.5 Lead-free TQFP 176 128 E
LC4256V-75TN144E 256 3.3 7.5 Lead-free TQFP 144 96 E
LC4256V-75TN100E 256 3.3 7.5 Lead-free TQFP 100 64 E
ispMACH 4000V (3.3V) Lead-Free Industrial Devices (Cont.)
Device Part Number Macrocells Voltage tPD Package Pin/Ball
Count I/O Grade